COBRITHERM is an Insulated Metal Substrate (IMS) with exceptional thermal conductivity. It comprises an aluminum or copper base layered with copper foil on the opposing side. The substrate incorporates an epoxy-based insulation layer with a high inorganic content, enabling it to achieve outstanding thermal conductivity. Our primary objective with COBRITHERM is to minimize thermal blockage and efficiently transfer heat from electronic components to the metal core. By employing high pressure and high temperature during its production, we attain exceptional bonding strengths surpassing those typically found in standard thermal adhesives utilized in the thermal management industry.

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