Aismalibar Copper-Clad laminates for PCB - Cooling electronics : Aismalibar

Events

Aismalibar to attend The Battery Show Europe from 28-30 June 2022

Aismlaibar will present at the Battery Show Europe the new range of products designed to improve temperature transmission in battery assemblies.

New Products

Thermal solutions for EV battery systems

Aismalibar develop high end thermal interface materials

New Products

Thermal Interface Materials (TIMs)

Aismalibar has developed a family of Thermal Interface Materials (TIMs) for a wide area of electronic application fields, dividing it into two main areas differentiated from each other by the need, or not, to have dielectric capacity.

New Products

Cobritherm UltraThin 4W – Tg180°C-150°C MOT

New COBRITHERM ULTRATHIN. Industry leading Thermal conductivity, strong MOT values, High Tg and Low CTE are the key elements for performance of MPCBs operating at high temperatures.

AISMALIBAR COPPER CLAD LAMINATES & METAL CLAD LAMINATES FOR PCB (CCL & MCCL)

Aismalibar has more than 60 years of experience manufacturing high end Copper and Metal Clad Laminates for the Printed Circuit Board Industry. During the last two decades Aismalibar has been focused on offering the best solutions to reduce the operational temperature of the Printed Circuit Boards.

Markets

Lighting-LED Solutions

With the help of AISMALIBAR products, excess heat can be managed and dispelled, thereby ensuring the quality of the light and the reliability of all your LED products.

Markets

Automotive solutions

AISMALIBAR products ensure excellent thermal management of Automotive highly electrified models, where the efficiency of all the systems and components is unquestionable.

Products

IMS – Metal Clad Laminates

AISMALIBAR’s Insulated Metal Substrates allow processing by standard PCBs procedures, integrating heat dissipation with no need for extra components and SMD assembly process.

About

Aismalibar at your service since 1934

AISMALIBAR has more than 60 years’ experience in the laminate business for PCB production and more than 18 years of experience in thermal management Metal CCL.

	Total thickness
Bond Sheet Cured 70µm (ASTM 5476)	70 µm	4 KV	0,041 K/W	2,2 W/mK
Bond Sheet Cured 100µm (ASTM 5476)	100 µm	6 KV	0,058 K/W	2,2 W/mK
Bond Sheet Cured 70µm + Air Gap Filler	120 µm	4,2 KV	0,07 K/W	2,2 W/mK
Bond Sheet Cured 100µm + Air Gap Filler	150 µm	6,2 KV	0,088 K/W	2,2 W/mK
Air gap filler + Bond Sheet Cured 70µm + Air gap filler	170 µm	4,4 KV	0,099 K/W	2,2 W/mK
Air gap filler + Bond Sheet Cured 100µm + Air gap filler	200 µm	6,4 KV	0,117 K/W	2,2 W/mK
Bond Sheet Cured 80µm High Tg (ASTM 5476)	80 µm	4 KV	0,031 K/W	3,2 W/mK
Bond Sheet Cured 80µm High Tg + Air gap filler	130 µm	4,2 KV	0,051 K/W	3,2 W/mK
Air gap filler + Bond Sheet Cured 80µm HTg + Air gap filler	180 µm	4,4 KV	0,070 K/W	3,2 W/mK

Bond sheet cured 70µm (ASTM5476)
Total thickness	70µm
Dialectric capacity	4KV
Thermal resistance Rth	0,041K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 100µm (ASTM 5476)
Total thickness	100µm
Dialectric capacity	6KV
Thermal resistance Rth	0,058K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 70µm + Air gap filler
Total thickness	120µm
Dialectric capacity	4,2KV
Thermal resistance Rth	0,07K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 100µm + Air gap filler
Total thickness	150µm
Dialectric capacity	6,2KV
Thermal resistance Rth	0,88K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Last news

6/22/2022

Aismalibar to attend The Battery Show Europe June 28th to 30th 2022

5/06/2022

Aismalibar to attend the PCIM Europe from 10-12 May 2021.

4/09/2022

These are the new TIMs for power electronics

3/09/2022

Improved Thermal Interface Materials
for Cooling High-Power Electronics

1/25/2022

Aismalibar at IPC APEX expo 2022

11/16/2021

Aismalibar’s new range of Thermal Interface Material (TIM).

11/16/2021

AISMALIBAR to exhibit at 2021 Productronica, November 16-19, 2021 in Munich, Germany.

10/01/2021

FR4 Thermal properties to consider when designing PCBs

7/16/2021

Innovative Thermal Management Solutions for High Power Electronic Modules

6/07/2021

Thermal FR4 by Aismalibar, the evolution of standard FR4

Aismalibar - Cooling Electronics

Aismalibar to attend The Battery Show Europe from 28-30 June 2022

Thermal solutions for EV battery systems

Thermal Interface Materials (TIMs)

Cobritherm UltraThin 4W – Tg180°C-150°C MOT

Lighting-LED Solutions

Automotive solutions

IMS – Metal Clad Laminates

Aismalibar at your service since 1934

BOND SHEET CURED + AIR GAP FILLER

Air Gap Filler μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)
70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)
50(1,2)

Air Gap Filler μm (mils)
50(2,0)

Bond Sheet Cured μm (mils)
70(2,8)

80(3,1)

100(3,9)

ALPRIMER (ISOLAL)

BOND SHEET CURED + THERMAL TAPE

	Total Thickness (µm)	Dielectric capacity (KV)	Thermal Resistance Rth (K/W)	Thermal Conductivity
Bond Sheet Cured 70µm + Thermal Tape	120	4,5	0,09	2,2 W/mk	Technical Data Sheet
Bond Sheet Cured 100µm + Thermal Tape	150	6,5	0,107	2,2 W/mk	Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 70µm + Thermal Tape	170	4,7	0,119	2,2 W/mk	Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 100µm + Thermal Tape	200	6,7	0,136	2,2 W/mk	Technical Data Sheet
Bond Sheet Cured 80µm High Tg + Thermal Tape	130	4,5	0,08	3,2 W/mK	Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 80µm High Tg + Thermal Tape	180	4,7	0,099	3,2 W/mK	Technical Data Sheet

Last news

6/22/2022

Aismalibar to attend The Battery Show Europe June 28th to 30th 2022

5/06/2022

Aismalibar to attend the PCIM Europe from 10-12 May 2021.

4/09/2022

These are the new TIMs for power electronics

3/09/2022

Improved Thermal Interface Materialsfor Cooling High-Power Electronics

1/25/2022

Aismalibar at IPC APEX expo 2022

11/16/2021

Aismalibar’s new range of Thermal Interface Material (TIM).

11/16/2021

AISMALIBAR to exhibit at 2021 Productronica, November 16-19, 2021 in Munich, Germany.

10/01/2021

FR4 Thermal properties to consider when designing PCBs

7/16/2021

Innovative Thermal Management Solutions for High Power Electronic Modules

6/07/2021

Thermal FR4 by Aismalibar, the evolution of standard FR4

Aismalibar - Cooling Electronics

Aismalibar to attend The Battery Show Europe from 28-30 June 2022

Thermal solutions for EV battery systems

Thermal Interface Materials (TIMs)

Cobritherm UltraThin 4W – Tg180°C-150°C MOT

Lighting-LED Solutions

Automotive solutions

IMS – Metal Clad Laminates

Aismalibar at your service since 1934

BOND SHEET CURED + AIR GAP FILLER

Air Gap Filler μm (mils) 50(2,0)

Bond Sheet Cured μm (mils)70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)50(1,2)

Air Gap Filler μm (mils)50(2,0)

Bond Sheet Cured μm (mils)70(2,8) 80(3,1) 100(3,9)

ALPRIMER (ISOLAL)

BOND SHEET CURED + THERMAL TAPE

Improved Thermal Interface Materials
for Cooling High-Power Electronics

Air Gap Filler μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)
70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)
50(1,2)

Air Gap Filler μm (mils)
50(2,0)

Bond Sheet Cured μm (mils)
70(2,8)

80(3,1)

100(3,9)