super-large

large

medium

small

Aismalibar - About

Aismalibar experts in thermal management

Aismalibar experts in thermal management History Powered by Aismalibar

Aismalibar experts in thermal management - The expansion of technology into every aspect of our lives requires proper thermal management of integrated electronic components to achieve higher performance and efficiency. These days, industry, as is the case with the automotive sector, is promoting electronic solutions while abandoning mechanical ones. At Aismalibar, we are experts in thermal solutions of electronic circuits. Our goal is to reduce the operating temperature of electronic components, thereby prolonging their useful life and optimizing their performance. Using our materials ensures the quality and reliability of products that incorporate them. Furthermore, our materials minimize the use of supplementary fans or heat sinks, thus reducing production costs.

Global service

At our production plant in Barcelona – a strategic technological hub – we develop, manufacture and market the latest advances in laminates for the production of printed circuit boards in order to offer our customers a global and personalized service, guaranteed through our subsidiaries in Germany, China, Taiwan, the United States and Canada.

Aismalibar has also consolidate its presence in the Asian market through the new production plant located in the city of Kunshan Suzhou, China. The new Suzhou plant has a production capacity of 720.000 m2 of IMS (Insulated Metal Substrate) and 4 million m2 of Pre Preg without fabric. We already have Commercial Subsidiaries in China and Taiwan.

At Aismalibar, engineers and chemists work alongside the sales department developing new proposals for a market in a constant state of evolution. Our production capacity increases every year, and we tenaciously persevere in the search for the most productive alliances between our customers, government as well as academic institutions.

Research, development and innovation

At Aismalibar, the innovation cycle is always ongoing. This dedication commitment by the company is achieved through our own R+D+I, which is fully involved in all manufacturing and marketing processes. To this end, we have a department whose laboratory is fitted with the latest-generation equipment such as TMA, DSC, TGA, GC, SEM and PSA.

This creativity is reflected in our continuous introduction of technological innovations into the global marketplace. Aismalibar’s involvement in its industrial environment has made it an unquestionable European leader, and many of our products are recognized as the very best available today. Your needs are our challenges.

Markets

The products of a leading manufacturer such as Aismalibar are utilized in a variety of different areas and environments. Aismalibar manufactures its PCB laminates for the electronics sector and its markets: LED lighting, telecommunications, the automotive sector, renewable energies, home appliances, railway transport, aerospace research and energy storage and industrial management.

The objective of the company is to provide you with the best experience through the efficiency our products, always striving to fully guarantee our business response capacity. We are more than just a partner. We ensure a guarantee of reliability and service in electronics.

Manufacturing

Our Montcada i Reixac plant is capable of producing half a million square meters of Cobrithem and almost one million square meters of Thermal Pre Peg. Our plant in China has a production capacity of two million square meters of CEM1 Cobrisol. In addition, at Aismalibar we have preserved the modernizing spirit of the company’s founder. It is for this reason that our capital investment portion has combined capital flow between the R+D+I department and constant modernization of our production plant.

Since 2009 all of our insulated metal substrates (IMS) have been ISO/TS 16949: 2009 certified. We have also secured UL certification, among others, for the entire Aismalibar product range.

Walter L. Ankli founded Aismalibar in 1934. Soon after, production began on his flagship product, the copper clad wire, eventually making Aismalibar the largest European company in the sector and an internationally renowned brand.

In 1958, long before the technological revolution, Aismalibar began producing copper clad laminates for printed circuit boards. In 1965 Aismalibar opened its copper laminate plant for the production of XPC, FR2 and FR4. In today’s modern and digitized world, our IMS/CCL metal-based laminates are essential components of the electronics industry, where our base materials are integrated into electronic products.

In 2011 Aismalibar became part of Benmayor S.A. The combination of knowledge and structure has enabled Aismalibar to become the sole European manufacturer specializing in thermal clad insulated metal substrate (IMS). Our laminates provide exceptional thermal management. We are pioneers, both highly creative and very competitive.

Our customers are companies from different areas and sectors, yet they have one important thing in common: the need for top-level thermal management, powered by Aismalibar. These are some of them.

BOND SHEET CURED + AIR GAP FILLER

Ultra-thin dielectric layer, high dielectric strength,
high thermal conductivity and low thermal resistance.
Montaje_1

Air Gap Filler μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)
70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)
50(1,2)

Air Gap Filler μm (mils)
50(2,0)

Bond Sheet Cured μm (mils)
70(2,8)
80(3,1)
100(3,9)

Total thickness
Dielectric capacity
Thermal resistance Rth
Thermal conductivity
Bond Sheet Cured 70µm (ASTM 5476)
70 µm
4 KV
0,041 K/W
2,2 W/mK
Technical data sheet
Bond Sheet Cured 100µm (ASTM 5476)
100 µm
6 KV
0,058 K/W
2,2 W/mK
Technical data sheet
Bond Sheet Cured 70µm + Air Gap Filler
120 µm
4,2 KV
0,07 K/W
2,2 W/mK
Technical data sheet
Bond Sheet Cured 100µm + Air Gap Filler
150 µm
6,2 KV
0,088 K/W
2,2 W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 70µm + Air gap filler
170 µm
4,4 KV
0,099 K/W
2,2 W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 100µm + Air gap filler
200 µm
6,4 KV
0,117 K/W
2,2 W/mK
Technical data sheet
Bond Sheet Cured 80µm High Tg (ASTM 5476)
80 µm
4 KV
0,031 K/W
3,2 W/mK
Technical data sheet
Bond Sheet Cured 80µm High Tg + Air gap filler
130 µm
4,2 KV
0,051 K/W
3,2 W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 80µm HTg + Air gap filler
180 µm
4,4 KV
0,070 K/W
3,2 W/mK
Technical data sheet
Dielectric capacity Dielectric capacity Thermal resistance Rth Thermal resistance Rth Thermal conductivity Thermal conductivity
Bond sheet cured 70µm (ASTM5476)
Total thickness
70µm
Dialectric capacity
4KV
Thermal resistance Rth
0,041K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Bond Sheet Cured 100µm (ASTM 5476)
Total thickness
100µm
Dialectric capacity
6KV
Thermal resistance Rth
0,058K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Bond Sheet Cured 70µm + Air gap filler
Total thickness
120µm
Dialectric capacity
4,2KV
Thermal resistance Rth
0,07K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Bond Sheet Cured 100µm + Air gap filler
Total thickness
150µm
Dialectric capacity
6,2KV
Thermal resistance Rth
0,88K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 70µm + Air gap filler
Total thickness
170µm
Dialectric capacity
4,4KV
Thermal resistance Rth
0,99K/W
Thermal conductivity
3,2W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 100µm + Air gap filler
Total thickness
200µm
Dialectric capacity
6,4KV
Thermal resistance Rth
0,117K/W
Thermal conductivity
3,2W/mK
Technical data sheet
Bond Sheet Cured 80µm High Tg (ASTM 5476)
Total thickness
80µm
Dialectric capacity
4KV
Thermal resistance Rth
0,031K/W
Thermal conductivity
3,2W/mK
Technical data sheet
Bond Sheet Cured 80µm High Tg + Air gap filler
Total thickness
130µm
Dialectric capacity
4,2KV
Thermal resistance Rth
0,051K/W
Thermal conductivity
3,2W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 80µm High Tg + Air gap filler
Total thickness
180µm
Dialectric capacity
4,4KV
Thermal resistance Rth
0,070K/W
Thermal conductivity
3,2W/mK
Technical data sheet
Bond sheet cured 70µm (ASTM5476)
Total Thickness
70 µm
Dialectric capacity
4 KV
Thermal resistance Rth
0,041K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Technical data sheet
Bond Sheet Cured 100µm (ASTM5476)
Total Thickness
100 µm
Dialectric capacity
6 KV
Thermal resistance Rth
0,058 K/W
Thermal conductivity
2,2 W/mK
Technical data sheet
Technical data sheet
Bond Sheet Cured 70µm + Air gap filler
Total Thickness
120 µm
Dialectric capacity
4,2 KV
Thermal resistance Rth
0,07 K/W
Thermal conductivity
2,2 W/mK
Technical data sheet
Technical data sheet
Bond Sheet Cured 100µm + Air gap filler
Total Thickness
150 µm
Dialectric capacity
6,2 KV
Thermal resistance Rth
0,88 K/W
Thermal conductivity
2,2 W/mK
Technical data sheet
Technical data sheet
Air gap filler + Bond Sheet Cured 70µm + Air gap filler
Total Thickness
170 µm
Dialectric capacity
4,4 KV
Thermal resistance Rth
0,99 K/W
Thermal conductivity
3,2 W/mK
Technical data sheet
Technical data sheet
Air gap filler + Bond Sheet Cured 100µm + Air gap filler
Total Thickness
200 µm
Dialectric capacity
6,4 KV
Thermal resistance Rth
0,117 K/W
Thermal conductivity
3,2 W/mK
Technical data sheet
Technical data sheet
Bond Sheet Cured 80µm High Tg (ASTM 5476)
Total Thickness
80 µm
Dialectric capacity
4 KV
Thermal resistance Rth
0,031 K/W
Thermal conductivity
3,2 W/mK
Technical data sheet
Technical data sheet
Bond Sheet Cured 80µm High Tg + Air gap filler
Total Thickness
130 µm
Dialectric capacity
4,2 KV
Thermal resistance Rth
0,051 K/W
Thermal conductivity
3,2 W/mK
Technical data sheet
Technical data sheet
Air gap filler + Bond Sheet Cured 80µm High Tg + Air gap filler
Total Thickness
180 µm
Dialectric capacity
4,4 KV
Thermal resistance Rth
0,070 K/W
Thermal conductivity
3,2 W/mK
Technical data sheet
Technical data sheet

ALPRIMER (ISOLAL)

Aluminum laminate coated with a thermal conductive ultra-thin dielectric layer.

Imagen1

Insulation thickness µm (in)

100(3,9)

Aluminium thickness um (In)

1000 (0.039)/ 1500 (0.059)/2000(0.078)/3000 (0.12)

Dielectric capacity (KV)
ALP
6
Technical Data Sheet

BOND SHEET CURED + THERMAL TAPE

Adhesive film with thermal transmission combined with an ultra-thin dielectric layer.

Thermal Tape um (mllc)

50 (1.9)

Dielectric thickness µm (mlic)

70(2,8)/80(3,1) / 100(3,9)

Total Thickness (µm)
Dielectric capacity (KV)
Thermal Resistance Rth (K/W)
Thermal Conductivity
Bond Sheet Cured 70µm + Thermal Tape
120
4,5
0,09
2,2 W/mk
Technical Data Sheet
Bond Sheet Cured 100µm + Thermal Tape
150
6,5
0,107
2,2 W/mk
Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 70µm + Thermal Tape
170
4,7
0,119
2,2 W/mk
Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 100µm + Thermal Tape
200
6,7
0,136
2,2 W/mk
Technical Data Sheet
Bond Sheet Cured 80µm High Tg + Thermal Tape
130
4,5
0,08
3,2 W/mK
Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 80µm High Tg + Thermal Tape
180
4,7
0,099
3,2 W/mK
Technical Data Sheet

New call-to-action