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Bond Sheet Cured - Thermal interface materials for power electronics applications

Bond Sheet Cured

BOND SHEET CURED is a reinforced dielectric polymerized interface material designed for high dielectric isolation and low thermal resistance. Ultra-thin dielectric layer with high dielectric strength, high thermal conductivity and low thermal resistance, which efficiently dissipates the heat generated by the power components to the cooling elements. Consisting of a glass fabric base, enriched with mineral fillers. Silicon free. Ideal for pick and place automation.

  • Product specifications

    Dielectric Layer 70μm, 100μm
    Dielectric Strength High
    Thermal Conductivity 2,2 W/mK
    Thermal Resistance 0,065/0,080 K/W
    Brake down voltage V(AC) ≥4/6 kV
    Thermal Insulating Material Ideal
    One/Two sides Air gap filling capacity at 35-40ºC
    Silicon free Yes
  • Product specifications

    Dielectric Layer 80μm
    Dielectric Strength High
    Thermal Conductivity 3,2 W/mK
    Thermal Resistance 0,058 K/W
    Brake-down Voltage V(AC) ≥4 kV
    Ideal for pick and place automation Yes
    CTE Expansion Very low
    One/Two sides Air gap filling capacity at 35-40ºC
    Low Mounting Pressure Yes
    Silicon free Yes
  • Product specifications

    Dielectric Layer 80μm
    Dielectric Strength High
    Thermal Conductivity 3,2 W/mK
    Thermal Resistance 0,068 K/W
    Brake-down Voltage V(AC) ≥4 kV
    CTE Expansion Very low
    Side A Self-adhesive tape, pressure sensitive
    Side B Air gap filling capacity at 35-40ºC
    Self Adhesive Yes
  • Product specifications

    Dielectric Layer 80μm
    Dielectric Strength High
    Thermal Conductivity 3,2 W/mK
    Thermal Resistance 0,055 K/W
    Brake-down Voltage V(AC) ≥4 kV
    CTE Expansion Very low
    One/Two sides Self-adhesive TT50 tape, pressure sensitive
    Silicon free Yes
    Self Adhesive Yes
  • Product specifications

    Dielectric Layer 70μm, 100μm
    Dielectric Strength High
    Thermal Conductivity 1,5 W/mK
    Thermal Resistance 0,119/0,136 K/W
    Brake-down Voltage V(AC) ≥4/6 kV
    Side A Self-adhesive tape, pressure sensitive
    Side B Air gap filling capacity at 35-40ºC
    Pick and place automation Ideal
    Silicon free Yes
  • Product specifications

    Dielectric Layer 70μm, 100μm
    Dielectric Strength High
    Thermal conductivity 1,5 W/mK
    Thermal Resistance 0,090/0,107 K/W
    Brake-down Voltage V(AC) ≥4/6 kV
    One/Two sides Self-adhesive TT50 tape, pressure sensitive
    Pick and place automation Ideal
    Silicon free Yes
  • Product specifications

    Dielectric Layer 70μm, 80μm, 100μm
    Dielectric Strength High
    Thermal Conductivity (Resin) 2,2 W/mK
    Thermal Impedance 0,35/0,50/0,50 Kcm²/W
    Brake-down Voltage V(AC) ≥5 kV/100μm
    CTE Expansion Low
    Resistance to thermal shocks Yes
  • Product specifications

    Dielectric Layer 70µm, 80µm, 100µm
    Dielectric Strength High
    Thermal Conductivity 2,2 W/mK
    Thermal Impedance 0,35/0,40/0,50 Kcm²/W
    Brake-down Voltage V(AC) ≥6 kV/100µm
    Resistance to thermal shocks Yes
  • Product specifications

    Dielectric Layer 70μm, 80μm, 100μm
    Dielectric Strength High
    Thermal Conductivity (Resin) 3,2 W/mK
    Thermal Impedance 0,23/0,27/0,33 Kcm²/W
    Brake-down Voltage V(AC) ≥4 kV
    CTE Expansion Low
  • Product specifications

    Dielectric Layer 70µm,100µm
    Dielectric Strength High
    Thermal Conductivity 2,2 W/mK
    Thermal Resistance 0,041/0,058 K/W
    Brake down voltage V(AC) ≥4/6 kV
    Thermal Insulating Material Ideal

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