
BOND SHEET CURED is a reinforced dielectric polymerized interface material designed for high dielectric isolation and low thermal resistance. Ultra-thin dielectric layer with high dielectric strength, high thermal conductivity and low thermal resistance, which efficiently dissipates the heat generated by the power components to the cooling elements. Consisting of a glass fabric base, enriched with mineral fillers. Silicon free. Ideal for pick and place automation.
Thermal Resistance | |
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Thermal Conductivity | |
Elec. Test V(DC) | |
Brake down voltage V(AC) | |
Flexible | |
Ideal for high temperature | |
Dielectric strenght | |
Insulation Guarantee | |
Dielectric Layer |
Thermal Resistance | |
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Thermal Conductivity | |
Elec. Test V(DC) | |
Brake down voltage V(AC) | |
Flexible | |
Ideal for high temperature | |
Dielectric strenght | |
Insulation Guarantee | |
Dielectric Layer |
Thermal Resistance | |
---|---|
Thermal Conductivity | |
Elec. Test V(DC) | |
Brake down voltage V(AC) | |
Flexible | |
Ideal for high temperature | |
Dielectric strenght | |
Insulation Guarantee | |
Dielectric Layer | 70 |
Thermal Resistance | |
---|---|
Thermal Conductivity | |
Elec. Test V(DC) | |
Brake down voltage V(AC) | |
Flexible | |
Ideal for high temperature | |
Dielectric strenght | |
Insulation Guarantee | |
Dielectric Layer |
Thermal Resistance | 0,152 |
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Thermal Conductivity | 2,2 |
Elec. Test V(DC) | 6000 |
Brake down voltage V(AC) | - |
Flexible | NO |
Ideal for high temperature | High |
Dielectric strenght | High |
Insulation Guarantee | * |
Dielectric Layer | 100 |
Thermal Resistance | 0,106 |
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Thermal Conductivity | 2,2 |
Elec. Test V(DC) | 4000 |
Brake down voltage V(AC) | - |
Flexible | NO |
Ideal for high temperature | Excellent |
Dielectric strenght | Excellent |
Insulation Guarantee | * |
Dielectric Layer | 70 |
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