BOND SHEET CURED
BOND SHEET CURED is a reinforced dielectric polymerized interface material designed for high dielectric isolation and low thermal resistance. Ultra-thin dielectric layer with high dielectric strength, high thermal conductivity and low thermal resistance, which efficiently dissipates the heat generated by the power components to the cooling elements. Consisting of a glass fabric base, enriched with mineral fillers. Silicon free. Ideal for pick and place automation.
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Product specifications
Thermal Resistance Thermal Conductivity Elec. Test V(DC) Brake down voltage V(AC) Flexible Ideal for high temperature Dielectric strenght Insulation Guarantee Dielectric Layer -
Product specifications
Thermal Resistance Thermal Conductivity Elec. Test V(DC) Brake down voltage V(AC) Flexible Ideal for high temperature Dielectric strenght Insulation Guarantee Dielectric Layer -
Product specifications
Thermal Resistance Thermal Conductivity Elec. Test V(DC) Brake down voltage V(AC) Flexible Ideal for high temperature Dielectric strenght Insulation Guarantee Dielectric Layer 70 -
Product specifications
Thermal Resistance Thermal Conductivity Elec. Test V(DC) Brake down voltage V(AC) Flexible Ideal for high temperature Dielectric strenght Insulation Guarantee Dielectric Layer -
Product specifications
Thermal Resistance 0,152 Thermal Conductivity 2,2 Elec. Test V(DC) 6000 Brake down voltage V(AC) - Flexible NO Ideal for high temperature High Dielectric strenght High Insulation Guarantee * Dielectric Layer 100 -
Product specifications
Thermal Resistance 0,106 Thermal Conductivity 2,2 Elec. Test V(DC) 4000 Brake down voltage V(AC) - Flexible NO Ideal for high temperature Excellent Dielectric strenght Excellent Insulation Guarantee * Dielectric Layer 70
