Bond Sheet Cured
BOND SHEET CURED is a reinforced dielectric polymerized interface material designed for high dielectric isolation and low thermal resistance. Ultra-thin dielectric layer with high dielectric strength, high thermal conductivity and low thermal resistance, which efficiently dissipates the heat generated by the power components to the cooling elements. Consisting of a glass fabric base, enriched with mineral fillers. Silicon free. Ideal for pick and place automation.
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Product specifications
Dielectric Layer 70μm, 100μm Dielectric Strength High Thermal Conductivity 2,2 W/mK Thermal Resistance 0,065/0,080 K/W Brake down voltage V(AC) ≥4/6 kV Thermal Insulating Material Ideal One/Two sides Air gap filling capacity at 35-40ºC Silicon free Yes -
Product specifications
Dielectric Layer 80μm Dielectric Strength High Thermal Conductivity 3,2 W/mK Thermal Resistance 0,058 K/W Brake-down Voltage V(AC) ≥4 kV Ideal for pick and place automation Yes CTE Expansion Very low One/Two sides Air gap filling capacity at 35-40ºC Low Mounting Pressure Yes Silicon free Yes -
Product specifications
Dielectric Layer 80μm Dielectric Strength High Thermal Conductivity 3,2 W/mK Thermal Resistance 0,068 K/W Brake-down Voltage V(AC) ≥4 kV CTE Expansion Very low Side A Self-adhesive tape, pressure sensitive Side B Air gap filling capacity at 35-40ºC Self Adhesive Yes -
Product specifications
Dielectric Layer 80μm Dielectric Strength High Thermal Conductivity 3,2 W/mK Thermal Resistance 0,055 K/W Brake-down Voltage V(AC) ≥4 kV CTE Expansion Very low One/Two sides Self-adhesive TT50 tape, pressure sensitive Silicon free Yes Self Adhesive Yes -
Product specifications
Dielectric Layer 70μm, 100μm Dielectric Strength High Thermal Conductivity 1,5 W/mK Thermal Resistance 0,119/0,136 K/W Brake-down Voltage V(AC) ≥4/6 kV Side A Self-adhesive tape, pressure sensitive Side B Air gap filling capacity at 35-40ºC Pick and place automation Ideal Silicon free Yes -
Product specifications
Dielectric Layer 70μm, 100μm Dielectric Strength High Thermal conductivity 1,5 W/mK Thermal Resistance 0,090/0,107 K/W Brake-down Voltage V(AC) ≥4/6 kV One/Two sides Self-adhesive TT50 tape, pressure sensitive Pick and place automation Ideal Silicon free Yes -
Product specifications
Dielectric Layer 70μm, 80μm, 100μm Dielectric Strength High Thermal Conductivity (Resin) 2,2 W/mK Thermal Impedance 0,35/0,50/0,50 Kcm²/W Brake-down Voltage V(AC) ≥5 kV/100μm CTE Expansion Low Resistance to thermal shocks Yes -
Product specifications
Dielectric Layer 70µm, 80µm, 100µm Dielectric Strength High Thermal Conductivity 2,2 W/mK Thermal Impedance 0,35/0,40/0,50 Kcm²/W Brake-down Voltage V(AC) ≥6 kV/100µm Resistance to thermal shocks Yes -
Product specifications
Dielectric Layer 70μm, 80μm, 100μm Dielectric Strength High Thermal Conductivity (Resin) 3,2 W/mK Thermal Impedance 0,23/0,27/0,33 Kcm²/W Brake-down Voltage V(AC) ≥4 kV CTE Expansion Low -
Product specifications
Dielectric Layer 70µm,100µm Dielectric Strength High Thermal Conductivity 2,2 W/mK Thermal Resistance 0,041/0,058 K/W Brake down voltage V(AC) ≥4/6 kV Thermal Insulating Material Ideal
