Fastherm - IMS
Fastherm
FASTHERM is a new technology we developed to achieve a faster thermal transition from the LED thermal pad into the heat sink. This superior thermal transition can be achieved by using the entire COBRITHERM HTC product range with either a copper or copper / aluminum base. At AISMALIBAR we created a special laminate with a bimetal heat sink made with a thin layer of copper cladded onto an aluminum base. The aluminum layer possesses diffusive properties while the copper layer has a very thin dielectric for improving horizontal thermal dissipation. The bimetal also allows for solderability in surface mounting applications.
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Product specifications
Dielectric Layer 35μm Copper Thermal Conductivity 380 W/mK Thermal Impedance 0,42 Kcm²/W Brake down voltage V(AC) 2 kV Maximum Operational Temperature 130ºC Pedestrian Copper Grow on PCBs Ideal -
Product specifications
Dielectric Layer 25μm Copper Thermal Conductivity 380 W/mK Thermal Impedance 0,42 Kcm²/W Brakedown Voltage V(AC) 2 kV Maximum Operational Temperature 130ºC Pedestrian Copper Grow on PCBs Ideal
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