FASTHERM

FASTHERM is an Insulated Metal Substrate (IMS) featuring a copper base and RA copper foil separated by an ultra-thin, thermally conductive dielectric layer. It is designed to deliver extremely fast heat transfer from heat-generating components to the heat sink, making it ideal for high-power electronics. FASTHERM includes a dielectric layer as thin as 25 microns, significantly reducing dielectric thermal resistance to exceptionally low levels. This substrate is highly suitable for applications such as high-power LEDs, power converters, motor drivers, and any design requiring efficient thermal management and high reliability. FASTHERM is also fully compatible with pedestal PCB technology.