
THIN LAM is a thin laminate designed for high thermal dissipation applications, with thermal conductivity ranging between 2.2 and 3.2 W/mK. This laminate can be bent after component insertion in order to achieve three-dimensional shapes with the PCB board. THIN LAM is the ideal replacement for FR4 thin laminates when thermal release is required. Double side Cu-clad thin laminate is built on the basis of thermal conductive polymeric-ceramic glass reinforced prepreg. It is mainly intended to produce double side PCB, for later bonding to a metal heat spreader by means of one sheet of B-stage.
Thermal Resistance | - |
---|---|
Thermal Conductivity | 3,2 |
Elec. Test V(DC) | - |
Brake down voltage V(AC) | - |
Flexible | NO |
Ideal for high temperature | High |
Dielectric strenght | Excellent |
Insulation Guarantee | * |
Dielectric Layer | 1520 |
Thermal Resistance | - |
---|---|
Thermal Conductivity | 3,2 |
Elec. Test V(DC) | - |
Brake down voltage V(AC) | - |
Flexible | NO |
Ideal for high temperature | High |
Dielectric strenght | Excellent |
Insulation Guarantee | * |
Dielectric Layer | 1270 |
Thermal Resistance | - |
---|---|
Thermal Conductivity | 3,2 |
Elec. Test V(DC) | - |
Brake down voltage V(AC) | - |
Flexible | NO |
Ideal for high temperature | High |
Dielectric strenght | Excellent |
Insulation Guarantee | * |
Dielectric Layer | 1000 |
Thermal Resistance | - |
---|---|
Thermal Conductivity | 3,2 |
Elec. Test V(DC) | - |
Brake down voltage V(AC) | - |
Flexible | NO |
Ideal for high temperature | High |
Dielectric strenght | Excellent |
Insulation Guarantee | * |
Dielectric Layer | 760 |
Thermal Resistance | - |
---|---|
Thermal Conductivity | 3,2 |
Elec. Test V(DC) | - |
Brake down voltage V(AC) | - |
Flexible | NO |
Ideal for high temperature | High |
Dielectric strenght | Excellent |
Insulation Guarantee | * |
Dielectric Layer | 710 |
Thermal Resistance | - |
---|---|
Thermal Conductivity | 3,2 |
Elec. Test V(DC) | - |
Brake down voltage V(AC) | - |
Flexible | NO |
Ideal for high temperature | High |
Dielectric strenght | Excellent |
Insulation Guarantee | * |
Dielectric Layer | 600 |
Thermal Resistance | - |
---|---|
Thermal Conductivity | 3,2 |
Elec. Test V(DC) | - |
Brake down voltage V(AC) | - |
Flexible | NO |
Ideal for high temperature | High |
Dielectric strenght | Excellent |
Insulation Guarantee | * |
Dielectric Layer | 500 |
Thermal Resistance | - |
---|---|
Thermal Conductivity | 3,2 |
Elec. Test V(DC) | - |
Brake down voltage V(AC) | - |
Flexible | NO |
Ideal for high temperature | High |
Dielectric strenght | Excellent |
Insulation Guarantee | * |
Dielectric Layer | 450 |
Thermal Resistance | - |
---|---|
Thermal Conductivity | 3,2 |
Elec. Test V(DC) | - |
Brake down voltage V(AC) | - |
Flexible | NO |
Ideal for high temperature | High |
Dielectric strenght | Excellent |
Insulation Guarantee | * |
Dielectric Layer | 400 |
Thermal Resistance | - |
---|---|
Thermal Conductivity | 3,2 |
Elec. Test V(DC) | - |
Brake down voltage V(AC) | - |
Flexible | NO |
Ideal for high temperature | High |
Dielectric strenght | Excellent |
Insulation Guarantee | * |
Dielectric Layer | 380 |
Thermal Resistance | - |
---|---|
Thermal Conductivity | 3,2 |
Elec. Test V(DC) | - |
Brake down voltage V(AC) | - |
Flexible | NO |
Ideal for high temperature | High |
Dielectric strenght | Excellent |
Insulation Guarantee | * |
Dielectric Layer | 300 |
Thermal Resistance | - |
---|---|
Thermal Conductivity | 3,2 |
Elec. Test V(DC) | - |
Brake down voltage V(AC) | - |
Flexible | NO |
Ideal for high temperature | High |
Dielectric strenght | Excellent |
Insulation Guarantee | * |
Dielectric Layer | 250 |
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