THIN LAM
THIN LAM is a thin laminate designed for high thermal dissipation applications, with thermal conductivity ranging between 2.2 and 3.2 W/mK. This laminate can be bent after component insertion in order to achieve three-dimensional shapes with the PCB board. THIN LAM is the ideal replacement for FR4 thin laminates when thermal release is required. Double side Cu-clad thin laminate is built on the basis of thermal conductive polymeric-ceramic glass reinforced prepreg. It is mainly intended to produce double side PCB, for later bonding to a metal heat spreader by means of one sheet of B-stage.
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Product specifications
Thermal Resistance - Thermal Conductivity 3,2 Elec. Test V(DC) - Brake down voltage V(AC) - Flexible NO Ideal for high temperature High Dielectric strenght Excellent Insulation Guarantee * Dielectric Layer 1520 -
Product specifications
Thermal Resistance - Thermal Conductivity 3,2 Elec. Test V(DC) - Brake down voltage V(AC) - Flexible NO Ideal for high temperature High Dielectric strenght Excellent Insulation Guarantee * Dielectric Layer 1270 -
Product specifications
Thermal Resistance - Thermal Conductivity 3,2 Elec. Test V(DC) - Brake down voltage V(AC) - Flexible NO Ideal for high temperature High Dielectric strenght Excellent Insulation Guarantee * Dielectric Layer 1000 -
Product specifications
Thermal Resistance - Thermal Conductivity 3,2 Elec. Test V(DC) - Brake down voltage V(AC) - Flexible NO Ideal for high temperature High Dielectric strenght Excellent Insulation Guarantee * Dielectric Layer 760 -
Product specifications
Thermal Resistance - Thermal Conductivity 3,2 Elec. Test V(DC) - Brake down voltage V(AC) - Flexible NO Ideal for high temperature High Dielectric strenght Excellent Insulation Guarantee * Dielectric Layer 710 -
Product specifications
Thermal Resistance - Thermal Conductivity 3,2 Elec. Test V(DC) - Brake down voltage V(AC) - Flexible NO Ideal for high temperature High Dielectric strenght Excellent Insulation Guarantee * Dielectric Layer 600 -
Product specifications
Thermal Resistance - Thermal Conductivity 3,2 Elec. Test V(DC) - Brake down voltage V(AC) - Flexible NO Ideal for high temperature High Dielectric strenght Excellent Insulation Guarantee * Dielectric Layer 500 -
Product specifications
Thermal Resistance - Thermal Conductivity 3,2 Elec. Test V(DC) - Brake down voltage V(AC) - Flexible NO Ideal for high temperature High Dielectric strenght Excellent Insulation Guarantee * Dielectric Layer 450 -
Product specifications
Thermal Resistance - Thermal Conductivity 3,2 Elec. Test V(DC) - Brake down voltage V(AC) - Flexible NO Ideal for high temperature High Dielectric strenght Excellent Insulation Guarantee * Dielectric Layer 400 -
Product specifications
Thermal Resistance - Thermal Conductivity 3,2 Elec. Test V(DC) - Brake down voltage V(AC) - Flexible NO Ideal for high temperature High Dielectric strenght Excellent Insulation Guarantee * Dielectric Layer 380 -
Product specifications
Thermal Resistance - Thermal Conductivity 3,2 Elec. Test V(DC) - Brake down voltage V(AC) - Flexible NO Ideal for high temperature High Dielectric strenght Excellent Insulation Guarantee * Dielectric Layer 300 -
Product specifications
Thermal Resistance - Thermal Conductivity 3,2 Elec. Test V(DC) - Brake down voltage V(AC) - Flexible NO Ideal for high temperature High Dielectric strenght Excellent Insulation Guarantee * Dielectric Layer 250
