Thin Lam - FR4 multilayer PCB
Thin Lam
THIN LAM is a thin laminate designed for high thermal dissipation applications, with thermal conductivity ranging between 2.2 and 3.2 W/mK. This laminate can be bent after component insertion in order to achieve three-dimensional shapes with the PCB board. THIN LAM is the ideal replacement for FR4 thin laminates when thermal release is required. Double side Cu-clad thin laminate is built on the basis of thermal conductive polymeric-ceramic glass reinforced prepreg. It is mainly intended to produce double side PCB, for later bonding to a metal heat spreader by means of one sheet of B-stage.
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Product specifications
Thermal Impedance 0,37/0,75 Kcm²/W Resistance to Thermal Shocks High Thermal Conductivity 2,2 W/mK Effective Heat Dissipation Yes Dielectric Breakdown Voltage, AC ≥3/≥6 kV -
Product specifications
Dielectric Layer 1520μm Thermal Conductivity 3,2 W/kV Brakedown Voltage V(AC) 50 kV/mm Ideal for high temperature High Dielectric Strength Excellent Bond to a Metal Heat Sink Yes Resistance to Thermal Shocks Yes -
Product specifications
Dielectric Layer 1270μm Thermal Conductivity 3,2 W/kV Brakedown Voltage V(AC) 50 kV/mm Ideal for high temperature High Dielectric Strength Excellent Bond to a Metal Heat Sink Yes Resistance to Thermal Shocks Yes -
Product specifications
Dielectric Layer 1000μm Thermal Conductivity 3,2 W/kV Brakedown Voltage V(AC) 50 kV/mm Ideal for high temperature High Dielectric Strength Excellent Bond to a Metal Heat Sink Yes Resistance to Thermal Shocks Yes -
Product specifications
Dielectric Layer 760μm Thermal Conductivity 3,2 W/kV Brakedown Voltage V(AC) 50 kV/mm Ideal for high temperature High Dielectric Strength Excellent Bond to a Metal Heat Sink Yes Resistance to Thermal Shocks Yes -
Product specifications
Dielectric Layer 710μm Thermal Conductivity 3,2 W/kV Brakedown Voltage V(AC) 50 kV/mm Ideal for high temperature High Dielectric Strength Excellent Bond to a Metal Heat Sink Yes Resistance to Thermal Shocks Yes -
Product specifications
Dielectric Layer 600μm Thermal Conductivity 3,2 W/kV Brakedown Voltage V(AC) 50 kV/mm Ideal for high temperature High Dielectric Strength Excellent Bond to a Metal Heat Sink Yes Resistance to Thermal Shocks Yes -
Product specifications
Dielectric Layer 500μm Thermal Conductivity 3,2 W/kV Brakedown Voltage V(AC) 50 kV/mm Ideal for high temperature High Dielectric Strength Excellent Bond to a Metal Heat Sink Yes Resistance to Thermal Shocks Yes -
Product specifications
Dielectric Layer 450μm Thermal Conductivity 3,2 W/kV Brakedown Voltage V(AC) 50 kV/mm Ideal for high temperature High Dielectric Strength Excellent Bond to a Metal Heat Sink Yes Resistance to Thermal Shocks Yes -
Product specifications
Dielectric Layer 400μm Thermal Conductivity 3,2 W/kV Brakedown Voltage V(AC) 50 kV/mm Ideal for high temperature High Dielectric Strength Excellent Bond to a Metal Heat Sink Yes Resistance to Thermal Shocks Yes -
Product specifications
Dielectric Layer 380μm Thermal Conductivity 3,2 W/kV Brakedown Voltage V(AC) 50 kV/mm Ideal for high temperature High Dielectric Strength Excellent Bond to a Metal Heat Sink Yes Resistance to Thermal Shocks Yes -
Product specifications
Dielectric Layer 300μm Thermal Conductivity 3,2 W/kV Brakedown Voltage V(AC) 50 kV/mm Ideal for high temperature High Dielectric Strength Excellent Bond to a Metal Heat Sink Yes Resistance to Thermal Shocks Yes
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