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THIN LAM

THIN LAM is a thin laminate designed for high thermal dissipation applications, with thermal conductivity ranging between 2.2 and 3.2 W/mK. This laminate can be bent after component insertion in order to achieve three-dimensional shapes with the PCB board. THIN LAM is the ideal replacement for FR4 thin laminates when thermal release is required. Double side Cu-clad thin laminate is built on the basis of thermal conductive polymeric-ceramic glass reinforced prepreg. It is mainly intended to produce double side PCB, for later bonding to a metal heat spreader by means of one sheet of B-stage.

  • Product specifications

    Thermal Resistance -
    Thermal Conductivity 3,2
    Elec. Test V(DC) -
    Brake down voltage V(AC) -
    Flexible NO
    Ideal for high temperature High
    Dielectric strenght Excellent
    Insulation Guarantee *
    Dielectric Layer 1520
  • Product specifications

    Thermal Resistance -
    Thermal Conductivity 3,2
    Elec. Test V(DC) -
    Brake down voltage V(AC) -
    Flexible NO
    Ideal for high temperature High
    Dielectric strenght Excellent
    Insulation Guarantee *
    Dielectric Layer 1270
  • Product specifications

    Thermal Resistance -
    Thermal Conductivity 3,2
    Elec. Test V(DC) -
    Brake down voltage V(AC) -
    Flexible NO
    Ideal for high temperature High
    Dielectric strenght Excellent
    Insulation Guarantee *
    Dielectric Layer 1000
  • Product specifications

    Thermal Resistance -
    Thermal Conductivity 3,2
    Elec. Test V(DC) -
    Brake down voltage V(AC) -
    Flexible NO
    Ideal for high temperature High
    Dielectric strenght Excellent
    Insulation Guarantee *
    Dielectric Layer 760
  • Product specifications

    Thermal Resistance -
    Thermal Conductivity 3,2
    Elec. Test V(DC) -
    Brake down voltage V(AC) -
    Flexible NO
    Ideal for high temperature High
    Dielectric strenght Excellent
    Insulation Guarantee *
    Dielectric Layer 710
  • Product specifications

    Thermal Resistance -
    Thermal Conductivity 3,2
    Elec. Test V(DC) -
    Brake down voltage V(AC) -
    Flexible NO
    Ideal for high temperature High
    Dielectric strenght Excellent
    Insulation Guarantee *
    Dielectric Layer 600
  • Product specifications

    Thermal Resistance -
    Thermal Conductivity 3,2
    Elec. Test V(DC) -
    Brake down voltage V(AC) -
    Flexible NO
    Ideal for high temperature High
    Dielectric strenght Excellent
    Insulation Guarantee *
    Dielectric Layer 500
  • Product specifications

    Thermal Resistance -
    Thermal Conductivity 3,2
    Elec. Test V(DC) -
    Brake down voltage V(AC) -
    Flexible NO
    Ideal for high temperature High
    Dielectric strenght Excellent
    Insulation Guarantee *
    Dielectric Layer 450
  • Product specifications

    Thermal Resistance -
    Thermal Conductivity 3,2
    Elec. Test V(DC) -
    Brake down voltage V(AC) -
    Flexible NO
    Ideal for high temperature High
    Dielectric strenght Excellent
    Insulation Guarantee *
    Dielectric Layer 400
  • Product specifications

    Thermal Resistance -
    Thermal Conductivity 3,2
    Elec. Test V(DC) -
    Brake down voltage V(AC) -
    Flexible NO
    Ideal for high temperature High
    Dielectric strenght Excellent
    Insulation Guarantee *
    Dielectric Layer 380
  • Product specifications

    Thermal Resistance -
    Thermal Conductivity 3,2
    Elec. Test V(DC) -
    Brake down voltage V(AC) -
    Flexible NO
    Ideal for high temperature High
    Dielectric strenght Excellent
    Insulation Guarantee *
    Dielectric Layer 300
  • Product specifications

    Thermal Resistance -
    Thermal Conductivity 3,2
    Elec. Test V(DC) -
    Brake down voltage V(AC) -
    Flexible NO
    Ideal for high temperature High
    Dielectric strenght Excellent
    Insulation Guarantee *
    Dielectric Layer 250

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