THIN LAM (THERMAL FR4)

Thin Lam is a double-sided, Cu-clad laminate manufactured from a thermal-conductive, polymeric, glass-reinforced prepreg. It is used to produce both double-sided and multilayer PCBs. Designed for applications that demand enhanced thermal management, Thin Lam offers thermal conductivities ranging from 2.2 to 3.2 W/m·K. It is the ideal replacement for FR4 laminates when superior thermal performance is required. During fabrication, Thin Lam bonds to a metal heat sink using standard multilayer lamination processes with one B-stage COBRITHERM Bond Sheet.