Our insulated metal substrate features a thick aluminum-based core, coated with ED copper foil, to provide excellent thermal dissipation and electrical insulation. With our specially developed polymer-ceramic formulation, we guarantee superior thermal conductivity, dielectric strength, and thermal endurance. Aismalibar's Insulated Metal Substrates integrates heat dissipation into standard PCB procedures, eliminating the need for additional components and facilitating SMD assembly processes.
COBRITHERM is an Insulated Metal Substrate (IMS) with exceptional thermal conductivity. It comprises an aluminum or copper base layered with copper foil on the opposing side. The substrate incorporates an epoxy-based insulation layer with a high inorganic content, enabling it to achieve outstanding thermal conductivity. Our primary objective with COBRITHERM is to minimize thermal blockage and efficiently transfer heat from electronic components to the metal core. By employing high pressure and high temperature during its production, we attain exceptional bonding strengths surpassing those typically found in standard thermal adhesives utilized in the thermal management industry.See More
COBRITHERM ULTRATHIN is a metal clad with high thermal conductivity specifically designed for high power applications, AC-DC power converters, motor drivers, and high-power LEDs with a wattage exceeding 2W. The demand for improved dissipation rates and elevated working temperatures is rapidly growing. In response to this demand, we have developed a new iteration of COBRITHERM featuring an innovative ultra-thin dielectric layer. This advancement allows for heightened thermal performance and exceptional working temperature capabilities. With a mere thickness of 35 microns, this cutting-edge product significantly reduces thermal resistance to just 0.11 Kcm²/W (0.017 Kin²/W), thereby creating optimal thermal dissipation conditions for high power LED assemblies. By incorporating COBRITHERM ULTRATHIN into your designs, you can effectively manage heat and enhance the overall performance and reliability of your high-power electronic applications.See More
FASTHERM is a new technology we developed to achieve a faster thermal transition from the LED thermal pad into the heat sink. This superior thermal transition can be achieved by using the entire COBRITHERM HTC product range with either a copper or copper / aluminum base. At AISMALIBAR we created a special laminate with a bimetal heat sink made with a thin layer of copper cladded onto an aluminum base. The aluminum layer possesses diffusive properties while the copper layer has a very thin dielectric for improving horizontal thermal dissipation. The bimetal also allows for solderability in surface mounting applications.See More
FLEXTHERM is a high technology thermal insulated metal substrate, also known as a metal core copper clad laminate, for use in the production of conformable metal printed circuit boards. Its low thermal impedance allows the dissipation of temperature from the heating elements of a PCB into FLEXTHERM's metal core at an extremely efficient rate. The flexible properties of this new material enable it to conform to both the negative and positive radius allowing the product to adapt to the ever-changing demands of the industry. Typical applications for FLEXTHERM are high-power LED, power supply modules and the automotive industry.See More
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