Aismalibar PCB laminates for the electronics sector and its markets

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Last news

Aismalibar to attend APEC on March 19-23 at Orlando, FL

Aismalibar attending to Electronica nov22

Aismalibar at The Battery Show North America in Novi, Michigan September 13-15, 2022

Aismalibar to attend The Battery Show Europe June 28th to 30th 2022

Aismalibar to attend the PCIM Europe from 10-12 May 2021.

These are the new TIMs for power electronics

Improved Thermal Interface Materials<br>for Cooling High-Power Electronics

Improved Thermal Interface Materials
for Cooling High-Power Electronics

Aismalibar at IPC APEX expo 2022

Aismalibar’s new range of Thermal Interface Material (TIM).

AISMALIBAR to exhibit at 2021 Productronica, November 16-19, 2021 in Munich, Germany.

See all news

Markets

Automotive

Front Lights
Rear and Interior Lights
Electric Power Steering (EPS)
On Board Charger (OBC)
HVDC Power Transmission

Markets

Lighting-LED

Power LED Packages
Street Lighting
Stadiums and Arenas
Architectural
Decorative
Industrial and Horticulture

Markets

Power and Industrial Automation

Inverters and Power Converters
Welding Industry

Markets

Home Appliances

White and Brown Goods
Consumer Electronics

Markets

Solar and Wind

Power Converters

Markets

Railway and Aerospace

Electronics

Markets

Telecommunications

Base Station

BOND SHEET CURED + AIR GAP FILLER

Ultra-thin dielectric layer, high dielectric strength,
high thermal conductivity and low thermal resistance.

Air Gap Filler μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)

70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)

50(1,2)

Air Gap Filler μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)

70(2,8)

80(3,1)

100(3,9)

	Total thickness
Bond Sheet Cured 70µm (ASTM 5476)	70 µm	4 KV	0,041 K/W	2,2 W/mK
Bond Sheet Cured 100µm (ASTM 5476)	100 µm	6 KV	0,058 K/W	2,2 W/mK
Bond Sheet Cured 70µm + Air Gap Filler	120 µm	4,2 KV	0,07 K/W	2,2 W/mK
Bond Sheet Cured 100µm + Air Gap Filler	150 µm	6,2 KV	0,088 K/W	2,2 W/mK
Air gap filler + Bond Sheet Cured 70µm + Air gap filler	170 µm	4,4 KV	0,099 K/W	2,2 W/mK
Air gap filler + Bond Sheet Cured 100µm + Air gap filler	200 µm	6,4 KV	0,117 K/W	2,2 W/mK
Bond Sheet Cured 80µm High Tg (ASTM 5476)	80 µm	4 KV	0,031 K/W	3,2 W/mK
Bond Sheet Cured 80µm High Tg + Air gap filler	130 µm	4,2 KV	0,051 K/W	3,2 W/mK
Air gap filler + Bond Sheet Cured 80µm HTg + Air gap filler	180 µm	4,4 KV	0,070 K/W	3,2 W/mK

Dielectric capacity Thermal resistance Rth Thermal conductivity

Bond sheet cured 70µm (ASTM5476)
Total thickness	70µm
Dialectric capacity	4KV
Thermal resistance Rth	0,041K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 100µm (ASTM 5476)
Total thickness	100µm
Dialectric capacity	6KV
Thermal resistance Rth	0,058K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 70µm + Air gap filler
Total thickness	120µm
Dialectric capacity	4,2KV
Thermal resistance Rth	0,07K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 100µm + Air gap filler
Total thickness	150µm
Dialectric capacity	6,2KV
Thermal resistance Rth	0,88K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Air gap filler + Bond Sheet Cured 70µm + Air gap filler
Total thickness	170µm
Dialectric capacity	4,4KV
Thermal resistance Rth	0,99K/W
Thermal conductivity	3,2W/mK
Technical data sheet

Air gap filler + Bond Sheet Cured 100µm + Air gap filler
Total thickness	200µm
Dialectric capacity	6,4KV
Thermal resistance Rth	0,117K/W
Thermal conductivity	3,2W/mK
Technical data sheet

Bond Sheet Cured 80µm High Tg (ASTM 5476)
Total thickness	80µm
Dialectric capacity	4KV
Thermal resistance Rth	0,031K/W
Thermal conductivity	3,2W/mK
Technical data sheet

Bond Sheet Cured 80µm High Tg + Air gap filler
Total thickness	130µm
Dialectric capacity	4,2KV
Thermal resistance Rth	0,051K/W
Thermal conductivity	3,2W/mK
Technical data sheet

Air gap filler + Bond Sheet Cured 80µm High Tg + Air gap filler
Total thickness	180µm
Dialectric capacity	4,4KV
Thermal resistance Rth	0,070K/W
Thermal conductivity	3,2W/mK
Technical data sheet

Bond sheet cured 70µm (ASTM5476)
Total Thickness	70 µm
Dialectric capacity	4 KV
Thermal resistance Rth	0,041K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 100µm (ASTM5476)
Total Thickness	100 µm
Dialectric capacity	6 KV
Thermal resistance Rth	0,058 K/W
Thermal conductivity	2,2 W/mK
Technical data sheet

Bond Sheet Cured 70µm + Air gap filler
Total Thickness	120 µm
Dialectric capacity	4,2 KV
Thermal resistance Rth	0,07 K/W
Thermal conductivity	2,2 W/mK
Technical data sheet

Bond Sheet Cured 100µm + Air gap filler
Total Thickness	150 µm
Dialectric capacity	6,2 KV
Thermal resistance Rth	0,88 K/W
Thermal conductivity	2,2 W/mK
Technical data sheet

Air gap filler + Bond Sheet Cured 70µm + Air gap filler
Total Thickness	170 µm
Dialectric capacity	4,4 KV
Thermal resistance Rth	0,99 K/W
Thermal conductivity	3,2 W/mK
Technical data sheet

Air gap filler + Bond Sheet Cured 100µm + Air gap filler
Total Thickness	200 µm
Dialectric capacity	6,4 KV
Thermal resistance Rth	0,117 K/W
Thermal conductivity	3,2 W/mK
Technical data sheet

Bond Sheet Cured 80µm High Tg (ASTM 5476)
Total Thickness	80 µm
Dialectric capacity	4 KV
Thermal resistance Rth	0,031 K/W
Thermal conductivity	3,2 W/mK
Technical data sheet

Bond Sheet Cured 80µm High Tg + Air gap filler
Total Thickness	130 µm
Dialectric capacity	4,2 KV
Thermal resistance Rth	0,051 K/W
Thermal conductivity	3,2 W/mK
Technical data sheet

Air gap filler + Bond Sheet Cured 80µm High Tg + Air gap filler
Total Thickness	180 µm
Dialectric capacity	4,4 KV
Thermal resistance Rth	0,070 K/W
Thermal conductivity	3,2 W/mK
Technical data sheet

ALPRIMER (ISOLAL)

Aluminum laminate coated with a thermal conductive ultra-thin dielectric layer.

Insulation thickness µm (in)

100(3,9)

Aluminium thickness um (In)

1000 (0.039)/ 1500 (0.059)/2000(0.078)/3000 (0.12)

	Dielectric capacity (KV)
ALP	6	Technical Data Sheet

BOND SHEET CURED + THERMAL TAPE

Adhesive film with thermal transmission combined with an ultra-thin dielectric layer.

Thermal Tape um (mllc)

50 (1.9)

Dielectric thickness µm (mlic)

70(2,8)/80(3,1) / 100(3,9)

	Total Thickness (µm)	Dielectric capacity (KV)	Thermal Resistance Rth (K/W)	Thermal Conductivity
Bond Sheet Cured 70µm + Thermal Tape	120	4,5	0,09	2,2 W/mk	Technical Data Sheet
Bond Sheet Cured 100µm + Thermal Tape	150	6,5	0,107	2,2 W/mk	Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 70µm + Thermal Tape	170	4,7	0,119	2,2 W/mk	Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 100µm + Thermal Tape	200	6,7	0,136	2,2 W/mk	Technical Data Sheet
Bond Sheet Cured 80µm High Tg + Thermal Tape	130	4,5	0,08	3,2 W/mK	Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 80µm High Tg + Thermal Tape	180	4,7	0,099	3,2 W/mK	Technical Data Sheet

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Last news

3/08/2023

Aismalibar to attend APEC on March 19-23 at Orlando, FL

12/10/2022

Aismalibar attending to Electronica nov22

9/09/2022

Aismalibar at The Battery Show North America in Novi, Michigan September 13-15, 2022

6/22/2022

Aismalibar to attend The Battery Show Europe June 28th to 30th 2022

5/06/2022

Aismalibar to attend the PCIM Europe from 10-12 May 2021.

4/09/2022

These are the new TIMs for power electronics

3/09/2022

Improved Thermal Interface Materials
for Cooling High-Power Electronics

1/25/2022

Aismalibar at IPC APEX expo 2022

11/16/2021

Aismalibar’s new range of Thermal Interface Material (TIM).

11/16/2021

AISMALIBAR to exhibit at 2021 Productronica, November 16-19, 2021 in Munich, Germany.

Aismalibar - Markets

Automotive

Lighting-LED

Power and Industrial Automation

Home Appliances

Solar and Wind

Railway and Aerospace

Telecommunications

BOND SHEET CURED + AIR GAP FILLER

Air Gap Filler μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)
70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)
50(1,2)

Air Gap Filler μm (mils)
50(2,0)

Bond Sheet Cured μm (mils)
70(2,8)

80(3,1)

100(3,9)

ALPRIMER (ISOLAL)

BOND SHEET CURED + THERMAL TAPE

Last news

3/08/2023

Aismalibar to attend APEC on March 19-23 at Orlando, FL

12/10/2022

Aismalibar attending to Electronica nov22

9/09/2022

Aismalibar at The Battery Show North America in Novi, Michigan September 13-15, 2022

6/22/2022

Aismalibar to attend The Battery Show Europe June 28th to 30th 2022

5/06/2022

Aismalibar to attend the PCIM Europe from 10-12 May 2021.

4/09/2022

These are the new TIMs for power electronics

3/09/2022

Improved Thermal Interface Materialsfor Cooling High-Power Electronics

1/25/2022

Aismalibar at IPC APEX expo 2022

11/16/2021

Aismalibar’s new range of Thermal Interface Material (TIM).

11/16/2021

AISMALIBAR to exhibit at 2021 Productronica, November 16-19, 2021 in Munich, Germany.

Aismalibar - Markets

Automotive

Lighting-LED

Power and Industrial Automation

Home Appliances

Solar and Wind

Railway and Aerospace

Telecommunications

BOND SHEET CURED + AIR GAP FILLER

Air Gap Filler μm (mils) 50(2,0)

Bond Sheet Cured μm (mils)70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)50(1,2)

Air Gap Filler μm (mils)50(2,0)

Bond Sheet Cured μm (mils)70(2,8) 80(3,1) 100(3,9)

ALPRIMER (ISOLAL)

BOND SHEET CURED + THERMAL TAPE

Improved Thermal Interface Materials
for Cooling High-Power Electronics

Air Gap Filler μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)
70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)
50(1,2)

Air Gap Filler μm (mils)
50(2,0)

Bond Sheet Cured μm (mils)
70(2,8)

80(3,1)

100(3,9)