Thermal interface materials for power electronics applications
TIM - Thermal Interface Material
We have successfully created a wide range of Thermal Interface Materials (TIMs) specifically designed to meet the needs of various electronic applications. These materials are classified into two main categories, based on whether they need dielectric capacity or not. Furthermore, we have developed a comprehensive lineup of TIMs with distinct surface properties, differentiating them based on their self-adhesive nature.
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Bond Sheet Cured
BOND SHEET CURED is a reinforced dielectric polymerized interface material designed for high dielectric isolation and low thermal resistance. Ultra-thin dielectric layer with high dielectric strength, high thermal conductivity and low thermal resistance, which efficiently dissipates the heat generated by the power components to the cooling elements. Consisting of a glass fabric base, enriched with mineral fillers. Silicon free. Ideal for pick and place automation.
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Thermal Tape & Adhesive
Adhesive film with two-sided adhesive combined with thermal transmission properties based on acrylic resin, PSA (pressure sensitive adhesive). Dual cure technology ensures greater adhesion over time after application. It is ideal to improve the wetting between rough surfaces allowing the conformation of the surface ensuring a good anchoring and excellent thermal transmission.
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Thermal Pad
Acrylic pads offer several advantages, including high thermal conductivity, excellent electrical insulation, and resistance to chemicals, moisture, and UV radiation. They are flexible, conformable, and can be easily cut to size, making them ideal for a wide range of applications such as thermal management, electronic insulation, and gasketing.
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Phase Change
Phase change materials (PCMs) have several advantages, including high energy storage density, low volume change during phase transition, and the ability to maintain a constant temperature during thermal energy storage and release. They can also reduce energy consumption and costs in buildings and industrial applications, and can be integrated into existing systems with minimal modifications.
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Thermal Gel
Thermal gels are highly efficient at transferring heat between components, providing excellent thermal conductivity and reducing thermal resistance. They can conform to irregular shapes and surfaces, filling gaps and minimizing air pockets, which improves heat transfer and reduces the risk of overheating.
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Thermal Grease
Thermal grease, also known as thermal compound, offers several advantages, including high thermal conductivity, low thermal resistance, and excellent heat transfer properties. It fills gaps and irregularities between components, reducing the risk of overheating and improving the overall performance and lifespan of electronic devices. Thermal grease is easy to apply and remove, making it ideal for testing and prototyping. It is also non-toxic and non-corrosive, making it safe for use in sensitive applications such as medical devices.
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Silicone Pads
Silicone pads offer several advantages, including excellent thermal conductivity, electrical insulation, and resistance to high temperatures and harsh chemicals. They are flexible, conformable, and can be easily cut to size, making them ideal for a wide range of applications such as thermal management, electronic insulation, and gasketing.
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ISOLCOPPER
ISOLCOPPER is a thin copper (35 micron) cladded with an ultrathin dielectric layer filled with high end mineral content. This Aismalibar copper isolated treatment technology reduces the thermal resistance to very low values and achieving a dielectric strength up to 2 kV. CTE expansion XY 17 ppm. Low mounting pressure. Silicon free. No need of thermal grease.
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