TIM - Thermal Interface Material

Aismalibar has developed a family of Thermal Interface Materials (TIMs) for a wide area of electronic application fields, dividing it into two main areas differentiated from each other by the need, or not, to have dielectric capacity.



    BOND SHEET CURED is a reinforced dielectric polymerized interface material designed for high dielectric isolation and low thermal resistance. Ultra-thin dielectric layer with high dielectric strength, high thermal conductivity and low thermal resistance, which efficiently dissipates the heat generated by the power components to the cooling elements. Consisting of a glass fabric base, enriched with mineral fillers. Silicon free. Ideal for pick and place automation.

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    COPPERFILLER is a TIM developed by Aismalibar designed to eliminate the need to apply thermal paste on the surfaces to be dissipated. It is composed of three layers, the two external ones are responsible for filling the air cavities between the radiators and the components, eliminating the need for thermal paste and a central layer of 30 micron copper designed to distribute the temperature more efficient both in Z axis and in X, Y.

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    ISOLCOPPER is a thin copper (35 micron) cladded with an ultrathin dielectric layer filled with high end mineral content. This Aismalibar copper isolated treatment technology reduces the thermal resistance to very low values and achieving a dielectric strength up to 2 kV. CTE expansion XY 17 ppm. Low mounting pressure. Silicon free. No need of thermal grease.

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    Adhesive film with two-sided adhesive combined with thermal transmission properties based on acrylic resin, PSA (pressure sensitive adhesive). Dual cure technology ensures greater adhesion over time after application. It is ideal to improve the wetting between rough surfaces allowing the conformation of the surface ensuring a good anchoring and excellent thermal transmission.

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