Thermal FR4 Multilayer PCB
THERMAL FR4 MULTILAYER
Thermal FR4 Multilayer refers to PCB stackups that incorporate Thermal FR4 and other AISMALIBAR materials to improve thermal performance. These configurations offer a substantial boost in thermal conductivity over standard FR4, addressing its limitations in high-density, advanced electronic designs. They can be combined with Thermal FR4, Bond Sheet Prepreg, and AL Primer to build robust multilayer structures. Higher power densities can lead to increased operating temperatures; therefore, multilayer architectures are often required to manage functionality, routing, and thermal performance effectively. By leveraging its expertise in thermal management, AISMALIBAR provides a comprehensive range of substrates that can be combined to create customised solutions tailored to your designs.
-
THIN LAM (THERMAL FR4)
Thin Lam is a double-sided, Cu-clad laminate manufactured from a thermal-conductive, polymeric, glass-reinforced prepreg. It is used to produce both double-sided and multilayer PCBs. Designed for applications that demand enhanced thermal management, Thin Lam offers thermal conductivities ranging from 2.2 to 3.2 W/m·K. It is the ideal replacement for FR4 laminates when superior thermal performance is required. During fabrication, Thin Lam bonds to a metal heat sink using standard multilayer lamination processes with one B-stage COBRITHERM Bond Sheet.
See More -
BOND SHEET GLASS FREE
It is a B-stage, thermally conductive, glass-free dielectric prepreg based on an epoxy-ceramic formulation. It is designed to provide effective bonding between multilayer circuits (PCBs) and metal heat spreaders. When Bond Sheet Glass Free is incorporated, it improves heat transfer through the stackup, conducting heat away from electronic components on the copper layers and directing it efficiently toward the heat sink.
See More -
BOND SHEET GLASS REINFORCED
This B-stage, glass-reinforced dielectric prepreg uses an epoxy-ceramic formulation to achieve high thermal conductivity. The reinforcement provides extra mechanical stability and dimensional control during lamination, ensuring consistent dielectric thickness in multilayer constructions. It is designed to provide effective bonding between multilayer circuits (PCBs) and metal heat spreaders.
See More -
AL PRIMER
AL Primer is aluminium coated with a thermally conductive polymeric resin in B-stage. It can be supplied with the coating on one or both sides. Our advanced resins ensure high compatibility with prepregs, facilitate uniform, void-free impregnation, and provide outstanding thermal conductivity. This material is suitable for laminating double-sided or multilayer printed circuit boards onto aluminium, ensuring excellent thermal dissipation.
See More
