Aismalibar to Attend APEC on March 19-23 at Orlando, FL

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Aismalibar will be attending the APEC, the leading conference for practicing power electronics professionals, in Orlando Florida from March 19-23. Aismalibar will be presenting new cooling technologies for power electronics, specifically Thermal Interface Materials (TIMs) and Insulated Mental Substrates (IMS).

Aismalibar Thermal Interface Materials have been designed to improve dielectric isolation and fast thermal transmission in battery assemblies, taking into consideration cost reduction, lifetime performance, safety, and reliability.

Our Thermal Interface Materials are divided into two main areas, differentiated based on whether they need dielectric capacity. Dielectric requirement is determined by the electronic device, its operating voltage, and the applicable regulations regarding ground insulation. Additionally, Aismalibar has developed a series of applicable surfaces on the TIMs, differentiated by whether they need to be self-adhesive. Both surfaces serve, in turn, to reduce the air cavities that exist between the surfaces of the TIMs and the heatsinks or electronic components.

COPPERFILLER and BOND SHEET CURED offer a high-performance alternative solution to current thermal pastes or pads. The new COBRITHERM ALP is made from an aluminum base that is dielectrically insulated, designed to build structures, covers, partitions or radiators, among other solutions. It is completely insulated and guarantees excellent contact between the battery and dissipation elements.

IMS METAL CLAD Is a thick aluminum-based substrate, cladded in ED copper foil, designed for an effective thermal dissipation and high electrical insulation. Our proprietary formulated polymer-ceramic ensures high thermal conductivity, dielectric strength, and thermal endurance. AISMALIBAR’s Insulated Metal Substrates allow processing by standard PCBs procedures, integrating heat dissipation with no need for extra components and SMD assembly process.

Visit us at booth 136 to learn more about our products. We look forward to speaking with you.


Founded in 1934 and based in Barcelona, Spain, Aismalibar manufactures high-end Copper and Metal Clad Laminates and Thermal Interface Materials for the Printed Circuit Board Industry. These products are collaboratively required to efficiently extract and remove heat from electronic systems at the source. The ability to skillfully engineer solutions which reduce the operational temperature of PCBs and assemblies and their related components to ensure end product quality and reliability is a core competence of Aismalibar. At the production plant in Barcelona – a strategic technological hub – Aismalibar develops, manufactures, and markets the latest advances in thermal management technology in order to offer customers a global and personalized service guaranteed through their global subsidiaries.

Aismalibar materials minimize the use of supplementary fans or heat sinks, thus reducing production costs. The product range of insulated metal substrates (IMS) and Thermal Interface Materials are ISO/TS 16949: 2009 certified, RoHS Compliant and Halogen Free.  All materials have secured UL certification, among others, for the entire Aismalibar product range.  Aismalibar products are utilized in a variety of different technology market segments such as LED lighting, telecommunications, automotive, renewable energies, home appliances, railway transport, aerospace, energy storage and industrial management systems. The company has evolved to become an unquestionable global leader.  Aismalibar is committed to ensuring a guarantee of reliability and service in electronics.