FR4-FR95
With a combination of our well-known THICK COPPER technology we are able to offer FR4 THICK COPPER from 105 to 400 microns always with RA copper. All our FR4 are UL, lead free, VDE and CE approved.
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Product specifications
Isolation Thickness Minimum 70μm, more on request Effective bonding between multilayer circuits (PCB) Yes CTE Low Interconnect reliability over thermal cycles Ideal -
Product specifications
ED Copper Layers 35μm Dielectric Layer 0.05-1.2 mm Glass Epoxy Yes Thermal Resistance High Dielectric Breakdown 40kV z-CTE Low Reinforcement Woven E-glass Glass Transition Tg ≥155ºC -
Product specifications
ED Copper Layers 35μm Dielectric Layer 0.8-3.2 mm Glass Epoxy Yes Thermal Resistance High Dielectric Breakdown 42kV z-CTE Low Reinforcement Woven E-glass Glass Transition Tg 135ºC -
Product specifications
ED Copper Layers 35μm Dielectric Layer 0,8-3,2mm Glass Epoxy Yes Thermal Resistance High Dielectric Breakdown 42kV z-CTE Low Reinforcement Woven E-glass Glass Transition Tg 170ºC -
Product specifications
ED Copper Layers 35μm Dielectric Layer 0,8-3,2mm Glass Epoxy Yes Thermal Resistance High Dielectric Breakdown 42kV z-CTE Low Reinforcement Woven E-glass Glass Transition Tg 135ºC -
Product specifications
ED Copper Layers 35μm Dielectric Layer 0,05-1,2mm Glass Epoxy Yes Thermal Resistance High Dielectric Breakdown 42kV z-CTE Low Reinforcement Woven E-glass Glass Transition Tg 135ºC
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