Aismalibar at PCIM 2024

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We are excited to announce that Aismalibar will be exhibiting at PCIM 2024 in Booth 449 in Hall 9.

👉🏼 Discover our product innovations and learn more about the future of thermal management:

BOND SHEET CURED GLASS FREE 3,2W/mK used for Thermal Interface material in power electronics and battery isolation.

BOND SHEET (PRE PREG) 2,0W/mK, 3,2W/mK, 5,0W/mK, 8,0W/mK for PCB Thermal Management.

IMS COBRITHERM ULTRATHIN 5,0W/mK, 8W/mK Metal Base Substrate, clad with ED copper foil is designed for effective thermal dissipation and high electrical insulation.

COBRITHERM ALP, Aluminum Coated with 100-micron Dielectric Ceramic layer with extra low thermal resistance and high dielectric strength up to 6KV. It is ideal for Battery housing, power electronics and comfortable heat sinks.

Our team of thermal management experts will be available during the trade fair to provide insights, answer your questions, and explore customized solutions for your specific needs.

➡️ If you have any other questions or requests, contact us here.