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AL+Primer - FR4 multilayer PCB

AL+Primer

AL PRIMER is the solution to achieve a multilayer product with high thermal dissipation in the most suitable way. It consists of a metal base covered by one of its faces with a resin specially designed to have a good compatibility with the prepreg, fluidity for the coating of tracks and a large thermal transmission. The thickness of the primer is available in two different layers, to be molded to the different copper layers. Our B-stage prepreg is recommended for greater compatibility and improvement of the quality and performance of the final product.

  • Product specifications

    Dielectric Layer 60μm
    Thermal Conductivity 2,2 W/mK
    Thermal Impedance 0,30 Kcm²/W
    Coating on one or both sides Yes
    Delivered as B-stage Yes
  • Product specifications

    Dielectric Layer 30μm
    Thermal Conductivity 2,2 W/mK
    Thermal Impedance 0,15 Kcm²/W
    Coating on one or both sides Yes
    Delivered as B-stage Yes

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