
ISOLCOPPER + 1 AIR GAP FILLER
FamilyTIM - THERMAL INTERFACE MATERIAL
ProductISOLCOPPER
TypeHigh Dielectric Strength
Dielectric Layer(μm)
Thermal Resistance (K/W)
Thermal Conductivity (W/mk)
Elec. TEST V(DC)
Brake down voltage V(AC)
Comformable
Ideal for high temperature
Dielectric strength
Insulation Guaranty
- Aismalibar Thermal air gap filler is a unique technology that provides air gap filing capacity at 35-40ºC.
- High Tg : 180ºC (DSC)
- Low mounting pressure
- Silicon free
- No need of thermal grease
- Glass free
- Ultra low thermal resistance
- Dielectric strength 2 kV
- CTE expansion XY 17 ppm
- Aismalibar copper isolated treatment
- Heat spreader
ISOLCOPPER other products
ISOLCOPPER + 2 AIR GAP FILLER
TypeALCUP
Dielectric Layer (μm)
Thermal Conductivity (W/mk)
ISOLCOPPER + AIR GAP FILLER + THERMAL TAPE
TypeHigh Dielectric Strength
Dielectric Layer (μm)
Thermal Conductivity (W/mk)
ISOLCOPPER + 1 AIR GAP FILLER
TypeHigh Dielectric Strength
Dielectric Layer (μm)
Thermal Conductivity (W/mk)
ISOLCOPPER by Aismalibar
TypeHigh Dielectric Strength
Dielectric Layer (μm)
Thermal Conductivity (W/mk)