Aismalibar to speak at 2019 “Cooling Days” Conferences

Aismalibar is proud to be a partner of “Cooling Days”, an event that takes place in Würzburg, Germany on October 22 and 23. In addition to the exhibition, there will also be several conferences, including one offered by Uwe C. Lemke, Business Development Manager of Aismalibar. This conference will focus on how to cool the electronics using the latest generation PCBs.

Cooling Days” was founded from new ideas that address thermal management challenges for electronic developers and equipment manufacturers. Many different aspects of thermal control of electronic systems will be analyzed over the two day conference. Industry and research experts will explain the most important concepts and present new methods and products for the improvement of thermal management.

Aismalibar will have an active role in this event since as both sponsor and exhibitor, and will also hold a conference given by Uwe C. Lemke, representative of the company in Germany, Austria and Switzerland. The conference will focus on the importance of IMS base material with which the printed circuit board is created, especially when cooling an electronic system.

AISMALIBAR products featured in COOLING DAYS

COBRITHERM ULTRATHIN is a high thermal conductivity metal cladding used for car headlights with high power LEDs > 2W and Power Electronics for cooling PMF and IGBTs.

The demand for dissipation rates and higher working temperatures is increasing rapidly. Due to this continuous demand, Aismalibar has developed a new Cobritherm with an innovative ultra-thin dielectric layer that provides higher thermal efficiency and excellent working temperature. With a thickness of only 35 microns, this new product reduces thermal resistance to 0.09 Kcm2 / W (0.014 Kin2 / W), which offers excellent thermal dissipation conditions for high power LED assembly.

Aismalibar has implemented a 100% proof test (high-pot test) for all IMS laminates. This is the only way to ensure that the dielectric strength is perfect and that production problems are detected before the PCBs reach the end user. This guarantees dielectric insulation between the conductive layers of copper and aluminum.