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Thermal interface
materials for EV
battery systems

Thermal interface
materials for EV
battery systems

Aismalibar develops high end thermal interface materials

  • Ultra thin layer with high dielectric strength up to 6000 VDC offering additional security to the battery.
  • High thermal conductivity from 2,2 to 3,2 W/m·K
  • Maximum operation temperature (MOT) 150ºC

Aismalibar develop high end thermal interface materials

  • Ultra thin layer with high dielectric strength up to 6000 V DC offering additional security to the battery.
  • High thermal conductivity from 2,2 to 3,2 w/mk
  • Maximum operation temperature (MOT) 150ºC
AL+PREPREGmedidas

The electric car revolution needs new battery concepts, offering reliable and safe operation as well as fast and efficient charging. Car manufacturers use different types of battery cells, cylindrical or prismatic and a variety of pack designs and assemblies. However, thermal stress in the cells negatively affects battery charging capacity, safety and longevity.

The electric car revolution needs new battery designs offering reliable and safe operation as well as fast and efficient charging. Car manufacturers use different type of battery cells, cylindrical or prismatic and variety of pack designs and assembling’s. However, heat fluctuation negatively affects battery charging capacity, safety and longevity.

Advantages using Aismalibar thermal Interface Material on BATTERY SYSTEMS

Advantages using Aismalibar thermal Interface Material on BATTERY SYSTEMS

  • Ultra-Thin layer of 70 -80 or 100 microns with high thermal conductivity, up to 2,2W/m·K or 3,2W/m·K
  • Capable to achieve high dielectric strength up to 6.000 VDC
  • Extra low thermal resistance
  • Optionally for delivering with thermal adhesive on one side for easy assembly 
  • Capable to be delivered with Aismalibar Air Gap Filler technology for excellent wettability
  • Excellent endurance and reliability performance
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  • Ultra-Thin layer of 70 -80 or 100 microns with high thermal conductivity , up to 2,2W/mk or 3,2W ..
  • Capable to achieve high dielectric strength up to 6000 v DC
  • Extra low thermal resistance
  • Capable to be delivered with thermal adhesive on one side for easy assembly 
  • Capable to be delivered with Aismalibar Air Gap Filler technology for excellent wettability. 
  • Excellent endurance test  and reliability

AISMALIBAR THERMAL SOLUTIONS FOR BATTERY SYSTEMS

Aismalibar high end thermal management solutions including thermal interface materials (TIM) as well as insulated metal substrates (IMS), optimize design, production processes and help manufacturers with efficient thermal performances.

Aismalibar_Battery_Solution

Aismalibar high end thermal management solutions including thermal interface materials (TIM) as well as insulated metal substrates (IMS), optimize design, production processes and can help manufacturers and suppliers in reaching their challenges.

Aismalibar product recommendations

Aismalibar solutions for BATTERY SYSTEMS

Aismalibar solutions for BATTERY PACKS

BSC ensures the dielectric resistance and with the AISMALIBAR GAP FILLER TECHNOLOGY  we improve the thermal preformance. BSC can be delivered with air gap filler in one or both sides.

Air gaps bettwen the 2 materials are eliminated when the matareial achive the 40ºC.

Guarantied homogeneous coating +/- 2 µm
Excellent dielectric strength
Excellent wettability
No need maintenance

BSC WITH GAP FILLER TECHNOLOGY

todo1

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More

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Download TIM leaflet
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catalogo nuevo
Download TIM leaflet
Download eBook
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APPLICATIONS

Power electronics, electronic power modules in solar inverters, windmills, truck gear boxes, high power LED lighting, AC/DC converters. Industrial power electronics managements, in welding machines and robot drives. Electric Vehicles (EV) for Power Train and On-Board-Charger.

AUTOMOTIVE
SOLAR & WIND
LIGHTING
BATTERIES
INVERTERS
TELECOMUNICATIONS
AUTOMOTIVE
SOLAR & WIND
LIGHTING
BATTERIES
INVERTERS
TELECOMUNICATIONS

BOND SHEET CURED + AIR GAP FILLER

Ultra-thin dielectric layer, high dielectric strength,
high thermal conductivity and low thermal resistance.
Montaje_1

Air Gap Filler μm (mils)
50(1,2)

Bond Sheet Cured μm (mils)
70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)
50(1,2)

Total thickness
Dielectric capacity
Thermal resistance Rth
Thermal conductivity
Bond Sheet Cured 70µm (ASTM 5476)
70 µm
4 KV
0,041 K/W
2,2 W/mK
Technical data sheet
Bond Sheet Cured 100µm (ASTM 5476)
100 µm
6 KV
0,058 K/W
2,2 W/mK
Technical data sheet
Bond Sheet Cured 70µm + Air Gap Filler
120 µm
4,2 KV
0,07 K/W
2,2 W/mK
Technical data sheet
Bond Sheet Cured 100µm + Air Gap Filler
150 µm
6,2 KV
0,088 K/W
2,2 W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 70µm + Air gap filler
170 µm
4,4 KV
0,099 K/W
2,2 W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 100µm + Air gap filler
200 µm
6,4 KV
0,117 K/W
2,2 W/mK
Technical data sheet
Bond Sheet Cured 80µm High Tg (ASTM 5476)
80 µm
4 KV
0,031 K/W
3,2 W/mK
Technical data sheet
Bond Sheet Cured 80µm High Tg + Air gap filler
130 µm
4,2 KV
0,051 K/W
3,2 W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 80µm HTg + Air gap filler
180 µm
4,4 KV
0,070 K/W
3,2 W/mK
Technical data sheet
Dielectric capacity Dielectric capacity Thermal resistance Rth Thermal resistance Rth Thermal conductivity Thermal conductivity
Bond sheet cured 70µm (ASTM5476)
Total thickness
70µm
Dialectric capacity
4KV
Thermal resistance Rth
0,041K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Bond Sheet Cured 100µm (ASTM 5476)
Total thickness
100µm
Dialectric capacity
6KV
Thermal resistance Rth
0,058K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Bond Sheet Cured 70µm + Air gap filler
Total thickness
120µm
Dialectric capacity
4,2KV
Thermal resistance Rth
0,07K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Bond Sheet Cured 100µm + Air gap filler
Total thickness
150µm
Dialectric capacity
6,2KV
Thermal resistance Rth
0,88K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 70µm + Air gap filler
Total thickness
170µm
Dialectric capacity
4,4KV
Thermal resistance Rth
0,99K/W
Thermal conductivity
3,2W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 100µm + Air gap filler
Total thickness
200µm
Dialectric capacity
6,4KV
Thermal resistance Rth
0,117K/W
Thermal conductivity
3,2W/mK
Technical data sheet
Bond Sheet Cured 80µm High Tg (ASTM 5476)
Total thickness
80µm
Dialectric capacity
4KV
Thermal resistance Rth
0,031K/W
Thermal conductivity
3,2W/mK
Technical data sheet
Bond Sheet Cured 80µm High Tg + Air gap filler
Total thickness
130µm
Dialectric capacity
4,2KV
Thermal resistance Rth
0,051K/W
Thermal conductivity
3,2W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 80µm High Tg + Air gap filler
Total thickness
180µm
Dialectric capacity
4,4KV
Thermal resistance Rth
0,070K/W
Thermal conductivity
3,2W/mK
Technical data sheet

ALPRIMER (ISOLAL)

Aluminum laminate coated with a thermal conductive ultra-thin dielectric layer.

Imagen1

Insulation thickness µm (in)

100(3,9)

Aluminium thickness um (In)

1000 (0.039)/ 1500 (0.059)/2000(0.078)/3000 (0.12)

Dielectric capacity (KV)
ALP
6
Technical Data Sheet

BOND SHEET CURED + THERMAL TAPE

Adhesive film with thermal transmission combined with an ultra-thin dielectric layer.

Thermal Tape um (mllc)

50 (1.9)

Dielectric thickness µm (mlic)

70(2,8)/80(3,1) / 100(3,9)

Total Thickness (µm)
Dielectric capacity (KV)
Thermal Resistance Rth (K/W)
Thermal Conductivity
Bond Sheet Cured 70µm + Thermal Tape
120
4,5
0,09
2,2 W/mk
Technical Data Sheet
Bond Sheet Cured 100µm + Thermal Tape
150
6,5
0,107
2,2 W/mk
Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 70µm + Thermal Tape
170
4,7
0,119
2,2 W/mk
Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 100µm + Thermal Tape
200
6,7
0,136
2,2 W/mk
Technical Data Sheet
Bond Sheet Cured 80µm High Tg + Thermal Tape
130
4,5
0,08
3,2 W/mK
Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 80µm High Tg + Thermal Tape
180
4,7
0,099
3,2 W/mK
Technical Data Sheet

COBRITHERM ALP

Aluminum laminate coated with a thermal conductive ultra-thin dielectric layer.

Insulation thickness μm (mils)
120(4,7)

Aluminium thickness μm (in)
1000(0.039)/1500(0.059)/
2000(0.078)/3000(0.12)

Total thickness
Dielectric capacity
Thermal resistance Rth
Thermal conductivity
Bond Sheet Cured 70µm (ASTM 5476)
70 µm
5 KV
0,099 K/W
2,2 W/mK
Technical data sheet
Dielectric capacity Dielectric capacity Thermal resistance Rth Thermal resistance Rth Thermal conductivity Thermal conductivity

BOND SHEET CURED + THERMAL TAPE

Adhesive film with thermal transmission combined with an ultra-thin thermally conductive dielectric layer.

Thermal tape μm (mils)

50(1.9)

Dielectric thickness μm (mils)

70(2.8) / 80(3.1) / 100(3.9)

Total thickness
Dialectric capacity
Thermal resistance Rth
Thermal conductivity
Technical data sheet
Bond Sheet Cured 70µm + Thermal Tape
120µm
4,5KV
0,09K/W
2,2W/mK
Bond Sheet Cured 100µm + Thermal Tape
150µm
6,5KV
0,107K/W
2,2W/mK
Air Gap Filler + Bond Sheet Cured 70µm + Thermal Tape
170µm
4,7KV
0,119K/W
2,2W/mK
Air Gap Filler + Bond Sheet Cured 100µm + Thermal Tape
200µm
6,7KV
0,136K/W
2,2W/mK
Bond Sheet Cured 80µm High Tg + Thermal Tape
130µm
4,5KV
0,08K/W
3,2W/mK
Air Gap Filler + Bond Sheet Cured 80µm + Thermal Tape
180µm
4,7KV
0,099K/W
3,2W/mK
Bond Sheet Cured 70µm + Thermal Tape
Total Thickness
120µm
Dialectric capacity
4,5KV
Thermal resistance Rth
0,09K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Bond Sheet Cured 100µm + Thermal Tape
Total Thickness
150µm
Dialectric capacity
6,5KV
Thermal resistance Rth
0,107K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Air Gap Filler + Bond Sheet Cured 70µm + Thermal Tape
Total Thickness
170µm
Dialectric capacity
4,7KV
Thermal resistance Rth
0,119K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Air Gap Filler + Bond Sheet Cured 100µm + Thermal Tape
Total Thickness
200µm
Dialectric capacity
6,7KV
Thermal resistance Rth
0,136K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Bond Sheet Cured 80µm High Tg + Thermal Tape
Total Thickness
130µm
Dialectric capacity
4,5KV
Thermal resistance Rth
0,08K/W
Thermal conductivity
3,2W/mK
Technical data sheet
Air Gap Filler + Bond Sheet Cured 80µm + Thermal Tape
Total Thickness
180µm
Dialectric capacity
4,7KV
Thermal resistance Rth
0,99K/W
Thermal conductivity
3,2W/mK
Technical data sheet

COPPERFILLER

Copper laminate coated with a thermal air gap filler.

Aismalibar air gap filler μm (mils)

50(1.9)

Copper thickness μm (mils)

30(1.18) / 75(2.9) / 105(4.1)

Thermal conductivity
Copper
380 w/mk
Aismalibar thermal tape 50μm
1,2 w/mk
Aismalibar air gap filler
3,2 w/mk
Total thickness
Dielectric capacity
Thermal resistance Rth
Technical data sheet
Copperfiller: Air gap filler + Copper 75µm + Air gap filler
175 µm
0,3 KV
0,039 K/W
Copperfiller: Air gap filler + Copper 75µm + TT50
175 µm
0,5 KV
0,117 K/W
Copperfiller: Air gap filler + Copper 75µm + Air gap filler
Total Thickness
175µm
Dialectric capacity
0,3KV
Thermal resistance Rth
0,039K/W
Technical data sheet
Copperfiller: Air gap filler + Copper 75µm + TT50
Total Thickness
175µm
Dialectric capacity
0,5KV
Thermal resistance Rth
0,117K/W
Technical data sheet