Thermal interfacematerials for EVbattery systems : Aismalibar

super-large

large

medium

small

Last news

Aismalibar at The Battery Show North America in Novi, Michigan September 13-15, 2022

Aismalibar to attend The Battery Show Europe June 28th to 30th 2022

Aismalibar to attend the PCIM Europe from 10-12 May 2021.

These are the new TIMs for power electronics

Improved Thermal Interface Materials<br>for Cooling High-Power Electronics

Improved Thermal Interface Materials
for Cooling High-Power Electronics

Aismalibar at IPC APEX expo 2022

Aismalibar’s new range of Thermal Interface Material (TIM).

AISMALIBAR to exhibit at 2021 Productronica, November 16-19, 2021 in Munich, Germany.

FR4 Thermal properties to consider when designing PCBs

Innovative Thermal Management Solutions for High Power Electronic Modules

See all news

Thermal interface
materials for EV
battery systems

Aismalibar develops high end thermal interface materials

Aismalibar develop high end thermal interface materials

The electric car revolution needs new battery concepts, offering reliable and safe operation as well as fast and efficient charging. Car manufacturers use different types of battery cells, cylindrical or prismatic and a variety of pack designs and assemblies. However, thermal stress in the cells negatively affects battery charging capacity, safety and longevity.

The electric car revolution needs new battery designs offering reliable and safe operation as well as fast and efficient charging. Car manufacturers use different type of battery cells, cylindrical or prismatic and variety of pack designs and assembling’s. However, heat fluctuation negatively affects battery charging capacity, safety and longevity.

Advantages using Aismalibar thermal Interface Material on BATTERY SYSTEMS

Ultra-Thin layer of 70 -80 or 100 microns with high thermal conductivity, up to 2,2 W/m·K or 3,2 W/m·K
Capable to achieve high dielectric strength up to 6.000 VDC
Extra low thermal resistance
Optionally for delivering with thermal adhesive on one side for easy assembly
Capable to be delivered with Aismalibar Air Gap Filler technology for excellent wettability
Excellent endurance and reliability performance

AISMALIBAR THERMAL SOLUTIONS FOR BATTERY SYSTEMS

Aismalibar high end thermal management solutions including thermal interface materials (TIM) as well as insulated metal substrates (IMS), optimize design, production processes and help manufacturers with efficient thermal performances.

Aismalibar high end thermal management solutions including thermal interface materials (TIM) as well as insulated metal substrates (IMS), optimize design, production processes and can help manufacturers and suppliers in reaching their challenges.

Aismalibar product recommendations

Aismalibar solutions for BATTERY SYSTEMS

Aismalibar solutions for BATTERY PACKS

BSC ensures the dielectric resistance and with the AISMALIBAR GAP FILLER TECHNOLOGY we improve the thermal preformance. BSC can be delivered with air gap filler in one or both sides.

Air gaps bettwen the 2 materials are eliminated when the matareial achive the 40ºC.

Guarantied homogeneous coating +/- 2 µm
Excellent dielectric strength
Excellent wettability
No need maintenance

BSC WITH GAP FILLER TECHNOLOGY

Discover more

Discover
More

APPLICATIONS

Power electronics, electronic power modules in solar inverters, windmills, truck gear boxes, high power LED lighting, AC/DC converters. Industrial power electronics managements, in welding machines and robot drives. Electric Vehicles (EV) for Power Train and On-Board-Charger.

BOND SHEET CURED + AIR GAP FILLER

Ultra-thin dielectric layer, high dielectric strength,
high thermal conductivity and low thermal resistance.

Air Gap Filler μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)

70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)

50(1,2)

Air Gap Filler μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)

70(2,8)

80(3,1)

100(3,9)

	Total thickness
Bond Sheet Cured 70µm (ASTM 5476)	70 µm	4 KV	0,041 K/W	2,2 W/mK
Bond Sheet Cured 100µm (ASTM 5476)	100 µm	6 KV	0,058 K/W	2,2 W/mK
Bond Sheet Cured 70µm + Air Gap Filler	120 µm	4,2 KV	0,07 K/W	2,2 W/mK
Bond Sheet Cured 100µm + Air Gap Filler	150 µm	6,2 KV	0,088 K/W	2,2 W/mK
Air gap filler + Bond Sheet Cured 70µm + Air gap filler	170 µm	4,4 KV	0,099 K/W	2,2 W/mK
Air gap filler + Bond Sheet Cured 100µm + Air gap filler	200 µm	6,4 KV	0,117 K/W	2,2 W/mK
Bond Sheet Cured 80µm High Tg (ASTM 5476)	80 µm	4 KV	0,031 K/W	3,2 W/mK
Bond Sheet Cured 80µm High Tg + Air gap filler	130 µm	4,2 KV	0,051 K/W	3,2 W/mK
Air gap filler + Bond Sheet Cured 80µm HTg + Air gap filler	180 µm	4,4 KV	0,070 K/W	3,2 W/mK

Dielectric capacity Thermal resistance Rth Thermal conductivity

Bond sheet cured 70µm (ASTM5476)
Total thickness	70µm
Dialectric capacity	4KV
Thermal resistance Rth	0,041K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 100µm (ASTM 5476)
Total thickness	100µm
Dialectric capacity	6KV
Thermal resistance Rth	0,058K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 70µm + Air gap filler
Total thickness	120µm
Dialectric capacity	4,2KV
Thermal resistance Rth	0,07K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 100µm + Air gap filler
Total thickness	150µm
Dialectric capacity	6,2KV
Thermal resistance Rth	0,88K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Air gap filler + Bond Sheet Cured 70µm + Air gap filler
Total thickness	170µm
Dialectric capacity	4,4KV
Thermal resistance Rth	0,99K/W
Thermal conductivity	3,2W/mK
Technical data sheet

Air gap filler + Bond Sheet Cured 100µm + Air gap filler
Total thickness	200µm
Dialectric capacity	6,4KV
Thermal resistance Rth	0,117K/W
Thermal conductivity	3,2W/mK
Technical data sheet

Bond Sheet Cured 80µm High Tg (ASTM 5476)
Total thickness	80µm
Dialectric capacity	4KV
Thermal resistance Rth	0,031K/W
Thermal conductivity	3,2W/mK
Technical data sheet

Bond Sheet Cured 80µm High Tg + Air gap filler
Total thickness	130µm
Dialectric capacity	4,2KV
Thermal resistance Rth	0,051K/W
Thermal conductivity	3,2W/mK
Technical data sheet

Air gap filler + Bond Sheet Cured 80µm High Tg + Air gap filler
Total thickness	180µm
Dialectric capacity	4,4KV
Thermal resistance Rth	0,070K/W
Thermal conductivity	3,2W/mK
Technical data sheet

Bond sheet cured 70µm (ASTM5476)
Total Thickness	70 µm
Dialectric capacity	4 KV
Thermal resistance Rth	0,041K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 100µm (ASTM5476)
Total Thickness	100 µm
Dialectric capacity	6 KV
Thermal resistance Rth	0,058 K/W
Thermal conductivity	2,2 W/mK
Technical data sheet

Bond Sheet Cured 70µm + Air gap filler
Total Thickness	120 µm
Dialectric capacity	4,2 KV
Thermal resistance Rth	0,07 K/W
Thermal conductivity	2,2 W/mK
Technical data sheet

Bond Sheet Cured 100µm + Air gap filler
Total Thickness	150 µm
Dialectric capacity	6,2 KV
Thermal resistance Rth	0,88 K/W
Thermal conductivity	2,2 W/mK
Technical data sheet

Air gap filler + Bond Sheet Cured 70µm + Air gap filler
Total Thickness	170 µm
Dialectric capacity	4,4 KV
Thermal resistance Rth	0,99 K/W
Thermal conductivity	3,2 W/mK
Technical data sheet

Air gap filler + Bond Sheet Cured 100µm + Air gap filler
Total Thickness	200 µm
Dialectric capacity	6,4 KV
Thermal resistance Rth	0,117 K/W
Thermal conductivity	3,2 W/mK
Technical data sheet

Bond Sheet Cured 80µm High Tg (ASTM 5476)
Total Thickness	80 µm
Dialectric capacity	4 KV
Thermal resistance Rth	0,031 K/W
Thermal conductivity	3,2 W/mK
Technical data sheet

Bond Sheet Cured 80µm High Tg + Air gap filler
Total Thickness	130 µm
Dialectric capacity	4,2 KV
Thermal resistance Rth	0,051 K/W
Thermal conductivity	3,2 W/mK
Technical data sheet

Air gap filler + Bond Sheet Cured 80µm High Tg + Air gap filler
Total Thickness	180 µm
Dialectric capacity	4,4 KV
Thermal resistance Rth	0,070 K/W
Thermal conductivity	3,2 W/mK
Technical data sheet

ALPRIMER (ISOLAL)

Aluminum laminate coated with a thermal conductive ultra-thin dielectric layer.

Insulation thickness µm (in)

100(3,9)

Aluminium thickness um (In)

1000 (0.039)/ 1500 (0.059)/2000(0.078)/3000 (0.12)

	Dielectric capacity (KV)
ALP	6	Technical Data Sheet

BOND SHEET CURED + THERMAL TAPE

Adhesive film with thermal transmission combined with an ultra-thin dielectric layer.

Thermal Tape um (mllc)

50 (1.9)

Dielectric thickness µm (mlic)

70(2,8)/80(3,1) / 100(3,9)

	Total Thickness (µm)	Dielectric capacity (KV)	Thermal Resistance Rth (K/W)	Thermal Conductivity
Bond Sheet Cured 70µm + Thermal Tape	120	4,5	0,09	2,2 W/mk	Technical Data Sheet
Bond Sheet Cured 100µm + Thermal Tape	150	6,5	0,107	2,2 W/mk	Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 70µm + Thermal Tape	170	4,7	0,119	2,2 W/mk	Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 100µm + Thermal Tape	200	6,7	0,136	2,2 W/mk	Technical Data Sheet
Bond Sheet Cured 80µm High Tg + Thermal Tape	130	4,5	0,08	3,2 W/mK	Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 80µm High Tg + Thermal Tape	180	4,7	0,099	3,2 W/mK	Technical Data Sheet

COBRITHERM ALP

Aluminum laminate coated with a thermal conductive ultra-thin dielectric layer.

Insulation thickness μm (mils)

120(4,7)

Aluminium thickness μm (in)

1000(0.039)/1500(0.059)/
2000(0.078)/3000(0.12)

Insulation thickness μm (mils)

120(4,7)

Aluminium thickness μm (in)

1000(0.039)

1500(0.059)

2000(0.078)

3000(0.12)

	Total thickness
Cobritherm ALP	120 µm	5 KV	0,099 K/W	2,2 W/mK

Dielectric capacity Thermal resistance Rth Thermal conductivity

Cobritherm ALP
Total Thickness	120µm
Dialectric capacity	5KV
Thermal resistance Rth	0,099K/W
Thermal conductivity	2,2W/mK
Technical data sheet

BOND SHEET CURED + THERMAL TAPE

Adhesive film with thermal transmission combined with an ultra-thin thermally conductive dielectric layer.

Thermal Tape μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)

70(2,8) 80(3,1)  100(3,9)

Thermal Tape μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)

70(2,8)

80(3,1)

100(3,9)

	Total thickness
Bond Sheet Cured 70µm + Thermal Tape	120 µm	4,5 KV	0,09 K/W	2,2 W/mK
Bond Sheet Cured 100µm + Thermal Tape	150 µm	6,5 KV	0,107 K/W	2,2 W/mK
Air Gap Filler + Bond Sheet Cured 70µm + Thermal Tape	170 µm	4,7 KV	0,119 K/W	2,2 W/mK
Air Gap Filler + Bond Sheet Cured 100µm + Thermal Tape	200 µm	6,7 KV	0,136 K/W	2,2 W/mK
Bond Sheet Cured 80µm High Tg + Thermal Tape	130 µm	4,5 KV	0,08 K/W	3,2 W/mK
Air Gap Filler + Bond Sheet Cured 80µm + Thermal Tape	180 µm	4,7 KV	0,099 K/W	3,2 W/mK

Dielectric capacity Thermal resistance Rth Thermal conductivity

Bond Sheet Cured 70µm + Thermal Tape
Total Thickness	120µm
Dialectric capacity	4,5KV
Thermal resistance Rth	0,09K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 100µm + Thermal Tape
Total Thickness	150µm
Dialectric capacity	6,5KV
Thermal resistance Rth	0,107K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Air Gap Filler + Bond Sheet Cured 70µm + Thermal Tape
Total Thickness	170µm
Dialectric capacity	4,7KV
Thermal resistance Rth	0,119K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Air Gap Filler + Bond Sheet Cured 100µm + Thermal Tape
Total Thickness	200µm
Dialectric capacity	6,7KV
Thermal resistance Rth	0,136K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 80µm High Tg + Thermal Tape
Total Thickness	130µm
Dialectric capacity	4,5KV
Thermal resistance Rth	0,08K/W
Thermal conductivity	3,2W/mK
Technical data sheet

Air Gap Filler + Bond Sheet Cured 80µm + Thermal Tape
Total Thickness	180µm
Dialectric capacity	4,7KV
Thermal resistance Rth	0,99K/W
Thermal conductivity	3,2W/mK
Technical data sheet

COPPERFILLER

Copper laminate coated with a thermal air gap filler.

Air Gap Filler μm (mils)

50(2,0)

Copperfiller μm (mils)

35(1,4) 70(2,8) 105(4,1)


Copper	380 w/mk
Aismalibar thermal tape 50μm	1,2 w/mk
Aismalibar air gap filler	3,2 w/mk

Thermal Tape μm (mils)

50(2,0)

Copperfiller μm (mils)

35(1,4)

70(2,8)

105(4,1)


Copper	380 w/mk
Aismalibar thermal tape 50μm	1,2 w/mk
Aismalibar air gap filler	3,2 w/mk

	Total thickness
Copperfiller: Air gap filler + Copper 75µm + Air gap filler	175 µm	0,3 KV	0,039 K/W
Copperfiller: Air gap filler + Copper 75µm + TT50	175 µm	0,5 KV	0,117 K/W

Dielectric capacity Thermal resistance Rth Thermal conductivity

Copperfiller: Air gap filler + Copper 75µm + Air gap filler
Total Thickness	175µm
Dialectric capacity	0,3KV
Thermal resistance Rth	0,039K/W
Technical data sheet

Copperfiller: Air gap filler + Copper 75µm + TT50
Total Thickness	175µm
Dialectric capacity	0,5KV
Thermal resistance Rth	0,117K/W
Technical data sheet

Last news

9/09/2022

Aismalibar at The Battery Show North America in Novi, Michigan September 13-15, 2022

6/22/2022

Aismalibar to attend The Battery Show Europe June 28th to 30th 2022

5/06/2022

Aismalibar to attend the PCIM Europe from 10-12 May 2021.

4/09/2022

These are the new TIMs for power electronics

3/09/2022

Improved Thermal Interface Materialsfor Cooling High-Power Electronics

1/25/2022

Aismalibar at IPC APEX expo 2022

11/16/2021

Aismalibar’s new range of Thermal Interface Material (TIM).

11/16/2021

AISMALIBAR to exhibit at 2021 Productronica, November 16-19, 2021 in Munich, Germany.

10/01/2021

FR4 Thermal properties to consider when designing PCBs

7/16/2021

Innovative Thermal Management Solutions for High Power Electronic Modules

Aismalibar develops high end thermal interface materials

Advantages using Aismalibar thermal Interface Material on BATTERY SYSTEMS

BSC WITH GAP FILLER TECHNOLOGY

APPLICATIONS

BOND SHEET CURED + AIR GAP FILLER

Air Gap Filler μm (mils) 50(2,0)

Bond Sheet Cured μm (mils)70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)50(1,2)

Air Gap Filler μm (mils)50(2,0)

Bond Sheet Cured μm (mils)70(2,8) 80(3,1) 100(3,9)

ALPRIMER (ISOLAL)

BOND SHEET CURED + THERMAL TAPE

COBRITHERM ALP

Insulation thickness μm (mils)120(4,7)

Aluminium thickness μm (in)1000(0.039)/1500(0.059)/ 2000(0.078)/3000(0.12)

Insulation thickness μm (mils)120(4,7)

Aluminium thickness μm (in)1000(0.039) 1500(0.059) 2000(0.078) 3000(0.12)

BOND SHEET CURED + THERMAL TAPE

Thermal Tape μm (mils)50(2,0)

Bond Sheet Cured μm (mils)70(2,8) 80(3,1) 100(3,9)

Thermal Tape μm (mils)50(2,0)

Bond Sheet Cured μm (mils)70(2,8) 80(3,1) 100(3,9)

COPPERFILLER

Air Gap Filler μm (mils)50(2,0)

Copperfiller μm (mils)35(1,4) 70(2,8) 105(4,1)

Thermal Tape μm (mils)50(2,0)

Copperfiller μm (mils)35(1,4) 70(2,8) 105(4,1)

Improved Thermal Interface Materials
for Cooling High-Power Electronics

Air Gap Filler μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)
70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)
50(1,2)

Air Gap Filler μm (mils)
50(2,0)

Bond Sheet Cured μm (mils)
70(2,8)

80(3,1)

100(3,9)

Insulation thickness μm (mils)
120(4,7)

Aluminium thickness μm (in)
1000(0.039)/1500(0.059)/ 2000(0.078)/3000(0.12)

Insulation thickness μm (mils)
120(4,7)

Aluminium thickness μm (in)
1000(0.039)

1500(0.059)

2000(0.078)

3000(0.12)

Thermal Tape μm (mils)
50(2,0)

Bond Sheet Cured μm (mils)
70(2,8) 80(3,1) 100(3,9)

Thermal Tape μm (mils)
50(2,0)

Bond Sheet Cured μm (mils)
70(2,8)

80(3,1)

100(3,9)

Air Gap Filler μm (mils)
50(2,0)

Copperfiller μm (mils)
35(1,4) 70(2,8) 105(4,1)

Thermal Tape μm (mils)
50(2,0)

Copperfiller μm (mils)
35(1,4)

70(2,8)

105(4,1)