THERMAL INTERFACE MATERIALS
Aismalibar’s Thermal Interface Materials (TIM) are used in many electronic application fields, dividing them into two main areas differentiated by the need, or not, to have dielectric capacity. Additionally, our TIMs can be self-adhesive or not.
Improving dielectric isolation and fast thermal transmission
A clean, fast, and efficient thermal interface material to solve interface in between MPCB / Power Components and heat sinks.
AIR GAP FILLER TECHNOLOGY
TIM eliminate air gaps reducing thermal resistance, this will automatically be converted into a reduction of the junction temperature and copper lead frames.
PROS & CONS
Fills air gaps
Low thermal resistance
Dificult to apply homogeneously
Paste tends to disappear with time
Lower efficiency at high temperatures
High thickness availability
Easy to cover homogeneously
Dificult to manipulate
High thermal resistance
Dificult to fill air gaps
Low dielectric strengh in thin thermal pads
Aismalibar Thermal Interface Materials (TIMs) are divided into two main areas differentiated from each other by the need, or not, to have dielectric capacity.
The dielectric requirement is determined by the electronic device, its operating voltage, and the applicable regulations regarding ground insulation.
Aismalibar has additionally developed a series of applicable surfaces on our TIMs differentiated by whether or not, they need to be self-adhesive.
Both surfaces serve, in turn, to reduce the air cavities that exist between the surfaces of the TIMs and the heatsinks or electronic components.
Low Dielectric Strength
Designed to eliminate the need to apply thermal paste on the surfaces to be dissipated.
Adhesive film with two-sided adhesive combined with thermal transmission properties based on acrylic resin.
High Dielectric Strength
BOND SHEET CURED
Ultra-thin dielectric layer with high dielectric strength, high thermal conductivity and low thermal resistance.
Thin copper (35 micron) cladded with an ultrathin dielectric layer filled with high end mineral content.
Bond sheet cured
Bond sheet cured High Tg
Isolcopper + Thermal Tape
Bond sheet cured + Thermal Tape
Isolcopper + Air Gap Filler
Bond sheet cured + Air Gap Filler
Isolcopper + Thermal Tape + Air Gap Filler
Bond sheet cured + Thermal Tape + Air Gap Filler
Bond sheet cured High Tg + Thermal Tape
Bond sheet cured High Tg + Air Gap Filler
Bond sheet cured High Tg + Thermal Tape + Air Gap Filler
Power electronics, electronic power modules in solar inverters, windmills, truck gear boxes, high power LED lighting, AC/DC converters. Industrial power electronics managements, in welding machines and robot drives. Electric Vehicles (EV) for Power Train and On-Board-Charger.