Thermal Interface Material

super-large

large

medium

small

Last news

Flextherm thermal insulated metal substrate

Aismalibar at The Battery Show North America in Novi, Michigan September 13-15, 2022

Aismalibar to attend The Battery Show Europe June 28th to 30th 2022

Aismalibar to attend the PCIM Europe from 10-12 May 2021.

These are the new TIMs for power electronics

Improved Thermal Interface Materials<br>for Cooling High-Power Electronics

Improved Thermal Interface Materials
for Cooling High-Power Electronics

Aismalibar at IPC APEX expo 2022

Aismalibar’s new range of Thermal Interface Material (TIM).

AISMALIBAR to exhibit at 2021 Productronica, November 16-19, 2021 in Munich, Germany.

FR4 Thermal properties to consider when designing PCBs

See all news

THERMAL INTERFACE MATERIALS

Aismalibar’s Thermal Interface Materials (TIM) are used in many electronic application fields, dividing them into two main areas differentiated by the need, or not, to have dielectric capacity. Additionally, our TIMs can be self-adhesive or not.

Improving dielectric isolation and fast thermal transmission

A clean, fast, and efficient thermal interface material to solve interface in between MPCB / Power Components and heat sinks.

AIR GAP FILLER TECHNOLOGY

TIM eliminate air gaps reducing thermal resistance, this will automatically be converted into a reduction of the junction temperature and copper lead frames.

PROS & CONS

With thermal paste

Fills air gaps

Low Cost

Low thermal resistance

Dificult to apply homogeneously

Dirty

Paste tends to disappear with time

Lower efficiency at high temperatures

With thermal pad

High thickness availability

Good wettability

Easy to cover homogeneously

Dificult to manipulate

High thermal resistance

Dificult to fill air gaps

Low dielectric strengh in thin thermal pads

With Aismalibar TIM

Easy to manipulate
Extra low thermal resistance
Fills air gaps better than thermal pads
Guarantied homogeneous coating +/- 2 µm
Excellent dielectric strength
Excellent wettability
No need maintenance

Not possible for applications that required high thickness TIM’s

PRODUCT RANGE

Aismalibar Thermal Interface Materials (TIMs) are divided into two main areas differentiated from each other by the need, or not, to have dielectric capacity.

The dielectric requirement is determined by the electronic device, its operating voltage, and the applicable regulations regarding ground insulation.

Aismalibar has additionally developed a series of applicable surfaces on our TIMs differentiated by whether or not, they need to be self-adhesive.

Both surfaces serve, in turn, to reduce the air cavities that exist between the surfaces of the TIMs and the heatsinks or electronic components.

Low Dielectric Strength

COPPERFILLER

Designed to eliminate the need to apply thermal paste on the surfaces to be dissipated.

THERMAL TAPE

Adhesive film with two-sided adhesive combined with thermal transmission properties based on acrylic resin.

Product name

Data Sheet

Product name

Data Sheet

Copperfiller

Thermal Tape

High Dielectric Strength

BOND SHEET CURED

Ultra-thin dielectric layer with high dielectric strength, high thermal conductivity and low thermal resistance.

ISOLCOPPER

Thin copper (35 micron) cladded with an ultrathin dielectric layer filled with high end mineral content.

Smart Combinations

Product name

Data Sheet

Product name

Data Sheet

Bond sheet cured

Isolcopper

Bond sheet cured High Tg

Isolcopper + Thermal Tape

Bond sheet cured + Thermal Tape

Isolcopper + Air Gap Filler

Bond sheet cured + Air Gap Filler

Isolcopper + Thermal Tape + Air Gap Filler

Bond sheet cured + Thermal Tape + Air Gap Filler

Bond sheet cured High Tg + Thermal Tape

Bond sheet cured High Tg + Air Gap Filler

Bond sheet cured High Tg + Thermal Tape + Air Gap Filler

APPLICATIONS

Power electronics, electronic power modules in solar inverters, windmills, truck gear boxes, high power LED lighting, AC/DC converters. Industrial power electronics managements, in welding machines and robot drives. Electric Vehicles (EV) for Power Train and On-Board-Charger.

BOND SHEET CURED + AIR GAP FILLER

Ultra-thin dielectric layer, high dielectric strength,
high thermal conductivity and low thermal resistance.

Air Gap Filler μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)

70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)

50(1,2)

Air Gap Filler μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)

70(2,8)

80(3,1)

100(3,9)

	Total thickness
Bond Sheet Cured 70µm (ASTM 5476)	70 µm	4 KV	0,041 K/W	2,2 W/mK
Bond Sheet Cured 100µm (ASTM 5476)	100 µm	6 KV	0,058 K/W	2,2 W/mK
Bond Sheet Cured 70µm + Air Gap Filler	120 µm	4,2 KV	0,07 K/W	2,2 W/mK
Bond Sheet Cured 100µm + Air Gap Filler	150 µm	6,2 KV	0,088 K/W	2,2 W/mK
Air gap filler + Bond Sheet Cured 70µm + Air gap filler	170 µm	4,4 KV	0,099 K/W	2,2 W/mK
Air gap filler + Bond Sheet Cured 100µm + Air gap filler	200 µm	6,4 KV	0,117 K/W	2,2 W/mK
Bond Sheet Cured 80µm High Tg (ASTM 5476)	80 µm	4 KV	0,031 K/W	3,2 W/mK
Bond Sheet Cured 80µm High Tg + Air gap filler	130 µm	4,2 KV	0,051 K/W	3,2 W/mK
Air gap filler + Bond Sheet Cured 80µm HTg + Air gap filler	180 µm	4,4 KV	0,070 K/W	3,2 W/mK

Dielectric capacity Thermal resistance Rth Thermal conductivity

Bond sheet cured 70µm (ASTM5476)
Total thickness	70µm
Dialectric capacity	4KV
Thermal resistance Rth	0,041K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 100µm (ASTM 5476)
Total thickness	100µm
Dialectric capacity	6KV
Thermal resistance Rth	0,058K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 70µm + Air gap filler
Total thickness	120µm
Dialectric capacity	4,2KV
Thermal resistance Rth	0,07K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 100µm + Air gap filler
Total thickness	150µm
Dialectric capacity	6,2KV
Thermal resistance Rth	0,88K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Air gap filler + Bond Sheet Cured 70µm + Air gap filler
Total thickness	170µm
Dialectric capacity	4,4KV
Thermal resistance Rth	0,99K/W
Thermal conductivity	3,2W/mK
Technical data sheet

Air gap filler + Bond Sheet Cured 100µm + Air gap filler
Total thickness	200µm
Dialectric capacity	6,4KV
Thermal resistance Rth	0,117K/W
Thermal conductivity	3,2W/mK
Technical data sheet

Bond Sheet Cured 80µm High Tg (ASTM 5476)
Total thickness	80µm
Dialectric capacity	4KV
Thermal resistance Rth	0,031K/W
Thermal conductivity	3,2W/mK
Technical data sheet

Bond Sheet Cured 80µm High Tg + Air gap filler
Total thickness	130µm
Dialectric capacity	4,2KV
Thermal resistance Rth	0,051K/W
Thermal conductivity	3,2W/mK
Technical data sheet

Air gap filler + Bond Sheet Cured 80µm High Tg + Air gap filler
Total thickness	180µm
Dialectric capacity	4,4KV
Thermal resistance Rth	0,070K/W
Thermal conductivity	3,2W/mK
Technical data sheet

Bond sheet cured 70µm (ASTM5476)
Total Thickness	70 µm
Dialectric capacity	4 KV
Thermal resistance Rth	0,041K/W
Thermal conductivity	2,2W/mK
Technical data sheet

Bond Sheet Cured 100µm (ASTM5476)
Total Thickness	100 µm
Dialectric capacity	6 KV
Thermal resistance Rth	0,058 K/W
Thermal conductivity	2,2 W/mK
Technical data sheet

Bond Sheet Cured 70µm + Air gap filler
Total Thickness	120 µm
Dialectric capacity	4,2 KV
Thermal resistance Rth	0,07 K/W
Thermal conductivity	2,2 W/mK
Technical data sheet

Bond Sheet Cured 100µm + Air gap filler
Total Thickness	150 µm
Dialectric capacity	6,2 KV
Thermal resistance Rth	0,88 K/W
Thermal conductivity	2,2 W/mK
Technical data sheet

Air gap filler + Bond Sheet Cured 70µm + Air gap filler
Total Thickness	170 µm
Dialectric capacity	4,4 KV
Thermal resistance Rth	0,99 K/W
Thermal conductivity	3,2 W/mK
Technical data sheet

Air gap filler + Bond Sheet Cured 100µm + Air gap filler
Total Thickness	200 µm
Dialectric capacity	6,4 KV
Thermal resistance Rth	0,117 K/W
Thermal conductivity	3,2 W/mK
Technical data sheet

Bond Sheet Cured 80µm High Tg (ASTM 5476)
Total Thickness	80 µm
Dialectric capacity	4 KV
Thermal resistance Rth	0,031 K/W
Thermal conductivity	3,2 W/mK
Technical data sheet

Bond Sheet Cured 80µm High Tg + Air gap filler
Total Thickness	130 µm
Dialectric capacity	4,2 KV
Thermal resistance Rth	0,051 K/W
Thermal conductivity	3,2 W/mK
Technical data sheet

Air gap filler + Bond Sheet Cured 80µm High Tg + Air gap filler
Total Thickness	180 µm
Dialectric capacity	4,4 KV
Thermal resistance Rth	0,070 K/W
Thermal conductivity	3,2 W/mK
Technical data sheet

ALPRIMER (ISOLAL)

Aluminum laminate coated with a thermal conductive ultra-thin dielectric layer.

Insulation thickness µm (in)

100(3,9)

Aluminium thickness um (In)

1000 (0.039)/ 1500 (0.059)/2000(0.078)/3000 (0.12)

	Dielectric capacity (KV)
ALP	6	Technical Data Sheet

BOND SHEET CURED + THERMAL TAPE

Adhesive film with thermal transmission combined with an ultra-thin dielectric layer.

Thermal Tape um (mllc)

50 (1.9)

Dielectric thickness µm (mlic)

70(2,8)/80(3,1) / 100(3,9)

	Total Thickness (µm)	Dielectric capacity (KV)	Thermal Resistance Rth (K/W)	Thermal Conductivity
Bond Sheet Cured 70µm + Thermal Tape	120	4,5	0,09	2,2 W/mk	Technical Data Sheet
Bond Sheet Cured 100µm + Thermal Tape	150	6,5	0,107	2,2 W/mk	Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 70µm + Thermal Tape	170	4,7	0,119	2,2 W/mk	Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 100µm + Thermal Tape	200	6,7	0,136	2,2 W/mk	Technical Data Sheet
Bond Sheet Cured 80µm High Tg + Thermal Tape	130	4,5	0,08	3,2 W/mK	Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 80µm High Tg + Thermal Tape	180	4,7	0,099	3,2 W/mK	Technical Data Sheet

Privacy Overview

This website uses cookies to improve your experience while you navigate through the website. Out of these cookies, the cookies that are categorized as necessary are stored on your browser as they are essential for the working of basic functionalities of the website. We also use third-party cookies that help us analyze and understand how you use this website. These cookies will be stored in your browser only with your consent. You also have the option to opt-out of these cookies. But opting out of some of these cookies may have an effect on your browsing experience.

Necessary

Always Enabled

Functional

Functional cookies help to perform certain functionalities like sharing the content of the website on social media platforms, collect feedbacks, and other third-party features.

Cookie	Duration	Description
__cf_bm	30 minutes	This cookie, set by Cloudflare, is used to support Cloudflare Bot Management.

Performance

Analytics

Others

Last news

12/10/2022

Flextherm thermal insulated metal substrate

9/09/2022

Aismalibar at The Battery Show North America in Novi, Michigan September 13-15, 2022

6/22/2022

Aismalibar to attend The Battery Show Europe June 28th to 30th 2022

5/06/2022

Aismalibar to attend the PCIM Europe from 10-12 May 2021.

4/09/2022

These are the new TIMs for power electronics

3/09/2022

Improved Thermal Interface Materials
for Cooling High-Power Electronics

1/25/2022

Aismalibar at IPC APEX expo 2022

11/16/2021

Aismalibar’s new range of Thermal Interface Material (TIM).

11/16/2021

AISMALIBAR to exhibit at 2021 Productronica, November 16-19, 2021 in Munich, Germany.

10/01/2021

FR4 Thermal properties to consider when designing PCBs

With thermal paste

With thermal pad

With Aismalibar TIM

Smart Combinations

Smart Combinations

APPLICATIONS

BOND SHEET CURED + AIR GAP FILLER

Air Gap Filler μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)
70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)
50(1,2)

Air Gap Filler μm (mils)
50(2,0)

Bond Sheet Cured μm (mils)
70(2,8)

80(3,1)

100(3,9)

ALPRIMER (ISOLAL)

BOND SHEET CURED + THERMAL TAPE

Last news

12/10/2022

Flextherm thermal insulated metal substrate

9/09/2022

Aismalibar at The Battery Show North America in Novi, Michigan September 13-15, 2022

6/22/2022

Aismalibar to attend The Battery Show Europe June 28th to 30th 2022

5/06/2022

Aismalibar to attend the PCIM Europe from 10-12 May 2021.

4/09/2022

These are the new TIMs for power electronics

3/09/2022

Improved Thermal Interface Materialsfor Cooling High-Power Electronics

1/25/2022

Aismalibar at IPC APEX expo 2022

11/16/2021

Aismalibar’s new range of Thermal Interface Material (TIM).

11/16/2021

AISMALIBAR to exhibit at 2021 Productronica, November 16-19, 2021 in Munich, Germany.

10/01/2021

FR4 Thermal properties to consider when designing PCBs

With thermal paste

With thermal pad

With Aismalibar TIM

Smart Combinations

Smart Combinations

APPLICATIONS

BOND SHEET CURED + AIR GAP FILLER

Air Gap Filler μm (mils) 50(2,0)

Bond Sheet Cured μm (mils)70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)50(1,2)

Air Gap Filler μm (mils)50(2,0)

Bond Sheet Cured μm (mils)70(2,8) 80(3,1) 100(3,9)

ALPRIMER (ISOLAL)

BOND SHEET CURED + THERMAL TAPE

Improved Thermal Interface Materials
for Cooling High-Power Electronics

Air Gap Filler μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)
70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)
50(1,2)

Air Gap Filler μm (mils)
50(2,0)

Bond Sheet Cured μm (mils)
70(2,8)

80(3,1)

100(3,9)