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THERMAL INTERFACE MATERIALS
Aismalibar’s Thermal Interface Materials (TIM) are used in many electronic application fields, dividing them into two main areas differentiated by the need, or not, to have dielectric capacity. Additionally, our TIMs can be self-adhesive or not.
Improving dielectric isolation and fast thermal transmission
A clean, fast, and efficient thermal interface material to solve interface in between MPCB / Power Components and heat sinks.
AIR GAP FILLER TECHNOLOGY
TIM eliminate air gaps reducing thermal resistance, this will automatically be converted into a reduction of the junction temperature and copper lead frames.
PROS & CONS
Fills air gaps
Low Cost
Low thermal resistance
Dificult to apply homogeneously
Dirty
Paste tends to disappear with time
Lower efficiency at high temperatures
High thickness availability
Good wettability
Easy to cover homogeneously
Dificult to manipulate
High thermal resistance
Dificult to fill air gaps
Low dielectric strengh in thin thermal pads
PRODUCT RANGE
Aismalibar Thermal Interface Materials (TIMs) are divided into two main areas differentiated from each other by the need, or not, to have dielectric capacity.
The dielectric requirement is determined by the electronic device, its operating voltage, and the applicable regulations regarding ground insulation.
Aismalibar has additionally developed a series of applicable surfaces on our TIMs differentiated by whether or not, they need to be self-adhesive.
Both surfaces serve, in turn, to reduce the air cavities that exist between the surfaces of the TIMs and the heatsinks or electronic components.
Low Dielectric Strength
COPPERFILLER
Designed to eliminate the need to apply thermal paste on the surfaces to be dissipated.
THERMAL TAPE
Adhesive film with two-sided adhesive combined with thermal transmission properties based on acrylic resin.
Product name
Data Sheet
Product name
Data Sheet
High Dielectric Strength
BOND SHEET CURED
Ultra-thin dielectric layer with high dielectric strength, high thermal conductivity and low thermal resistance.
ISOLCOPPER
Thin copper (35 micron) cladded with an ultrathin dielectric layer filled with high end mineral content.
Product name
Data Sheet
Product name
Data Sheet
Power electronics, electronic power modules in solar inverters, windmills, truck gear boxes, high power LED lighting, AC/DC converters. Industrial power electronics managements, in welding machines and robot drives. Electric Vehicles (EV) for Power Train and On-Board-Charger.
50(2,0)
70(2,8) 80(3,1) 100(3,9)
50(1,2)
50(2,0)
70(2,8)
80(3,1)
100(3,9)
Aluminum laminate coated with a thermal conductive ultra-thin dielectric layer.
Insulation thickness µm (in)
100(3,9)
Aluminium thickness um (In)
1000 (0.039)/ 1500 (0.059)/2000(0.078)/3000 (0.12)
Dielectric capacity (KV) | ||
---|---|---|
ALP | 6 | Technical Data Sheet |
Adhesive film with thermal transmission combined with an ultra-thin dielectric layer.
Thermal Tape um (mllc)
50 (1.9)
Dielectric thickness µm (mlic)
70(2,8)/80(3,1) / 100(3,9)
Total Thickness (µm) | Dielectric capacity (KV) | Thermal Resistance Rth (K/W) | Thermal Conductivity | ||
---|---|---|---|---|---|
Bond Sheet Cured 70µm + Thermal Tape | 120 | 4,5 | 0,09 | 2,2 W/mk | Technical Data Sheet |
Bond Sheet Cured 100µm + Thermal Tape | 150 | 6,5 | 0,107 | 2,2 W/mk | Technical Data Sheet |
Air Gap Filler + Bond Sheet Cured 70µm + Thermal Tape | 170 | 4,7 | 0,119 | 2,2 W/mk | Technical Data Sheet |
Air Gap Filler + Bond Sheet Cured 100µm + Thermal Tape | 200 | 6,7 | 0,136 | 2,2 W/mk | Technical Data Sheet |
Bond Sheet Cured 80µm High Tg + Thermal Tape | 130 | 4,5 | 0,08 | 3,2 W/mK | Technical Data Sheet |
Air Gap Filler + Bond Sheet Cured 80µm High Tg + Thermal Tape | 180 | 4,7 | 0,099 | 3,2 W/mK | Technical Data Sheet |
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