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THERMAL INTERFACE MATERIALS

Aismalibar’s Thermal Interface Materials (TIM) are used in many electronic application fields, dividing them into two main areas differentiated by the need, or not, to have dielectric capacity. Additionally, our TIMs can be self-adhesive or not.

TIMs

Improving dielectric isolation and fast thermal transmission

A clean, fast, and efficient thermal interface material to solve interface in between MPCB / Power Components and heat sinks.

AIR GAP FILLER TECHNOLOGY

TIM eliminate air gaps reducing thermal resistance, this will automatically be converted into a reduction of the junction temperature and copper lead frames.

PROS & CONS

pastatermica
pastatermica

With thermal paste

Fills air gaps

Low Cost

Low thermal resistance

Dificult to apply homogeneously

Dirty

Paste tends to disappear with time 

Lower efficiency at high temperatures

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3d794e84437c5f3f847c3430f05c9360

With thermal pad

High thickness availability

Good wettability

Easy to cover homogeneously

Dificult to manipulate

High thermal resistance

Dificult to fill air gaps

Low dielectric strengh in thin thermal pads

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With Aismalibar TIM

  • Easy to manipulate
  • Extra low thermal resistance
  • Fills air gaps better than thermal pads
  • Guarantied homogeneous coating +/- 2 µm
  • Excellent dielectric strength
  • Excellent wettability
  • No need maintenance
  • Not possible for applications that required high thickness TIM’s

PRODUCT RANGE

Aismalibar Thermal Interface Materials (TIMs) are divided into two main areas differentiated from each other by the need, or not, to have dielectric capacity.

The dielectric requirement is determined by the electronic device, its operating voltage, and the applicable regulations regarding ground insulation.

 

Aismalibar has additionally developed a series of applicable surfaces on our TIMs differentiated by whether or not, they need to be self-adhesive.

Both surfaces serve, in turn, to reduce the air cavities that exist between the surfaces of the TIMs and the heatsinks or electronic components.

Low Dielectric Strength

COPPERFILLER

FOTO_AGF_CU_AGF

Designed to eliminate the need to apply thermal paste on the surfaces to be dissipated. 

THERMAL TAPE

AGF_D_TTver0

Adhesive film with two-sided adhesive combined with thermal transmission properties based on acrylic resin.

Product name

Data Sheet

Product name

Data Sheet

Copperfiller

Thermal Tape

High Dielectric Strength

BOND SHEET CURED

FOTO_D_ver0

Ultra-thin dielectric layer with high dielectric strength, high thermal conductivity and low thermal resistance.

ISOLCOPPER

FOTO_AGF_C_AGF

Thin copper (35 micron) cladded with an ultrathin dielectric layer filled with high end mineral content. 

Smart Combinations

Smart Combinations

Product name

Data Sheet

Product name

Data Sheet

Bond sheet cured

Isolcopper

Bond sheet cured High Tg

Isolcopper + Thermal Tape

Bond sheet cured + Thermal Tape

Isolcopper + Air Gap Filler

Bond sheet cured + Air Gap Filler

Isolcopper + Thermal Tape + Air Gap Filler

Bond sheet cured + Thermal Tape + Air Gap Filler

Bond sheet cured High Tg + Thermal Tape

Bond sheet cured High Tg + Air Gap Filler

Bond sheet cured High Tg + Thermal Tape + Air Gap Filler

APPLICATIONS

Power electronics, electronic power modules in solar inverters, windmills, truck gear boxes, high power LED lighting, AC/DC converters. Industrial power electronics managements, in welding machines and robot drives. Electric Vehicles (EV) for Power Train and On-Board-Charger.