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MULTILAYER THIN LAM

THIN LAM 3,2W 450µm Tg 180º Low CTE

FamilyMULTILAYER

ProductTHIN LAM

TypeTHERMAL THIN LAMINATE

Dielectric Layer(μm)450

Thermal Resistance (K/W)-

Thermal Conductivity (W/mk)3,2

Elec. TEST V(DC)-

Brake down voltage V(AC)-

ComformableNO

Ideal for high temperatureHigh

Dielectric strengthExcellent

Insulation Guaranty*

Double sided Cu-clad thin laminate composed of thermal conductive polymeric glass reinforced prepreg used to produce double sided and multilayer PCB. Thin Lam bonds to a metal heat sink using standard multilayer lamination processes with one piece of B-stage COBRITHERM Bond-sheet. Its high resistance to thermal shocks added to its high thermal conductivity assures reliable and effective heat dissipation in critical power circuitry.

THIN LAM other products

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TypeTHERMAL THIN LAMINATE

Dielectric Layer (μm)1520

Thermal Conductivity (W/mk)3,2

THIN LAM 3,2W 1270µm Tg 180º Low CTE

TypeTHERMAL THIN LAMINATE

Dielectric Layer (μm)1270

Thermal Conductivity (W/mk)3,2

THIN LAM 3,2W 1000µm Tg 180º Low CTE

TypeTHERMAL THIN LAMINATE

Dielectric Layer (μm)1000

Thermal Conductivity (W/mk)3,2

THIN LAM 3,2W 760µm Tg 180º Low CTE

TypeTHERMAL THIN LAMINATE

Dielectric Layer (μm)760

Thermal Conductivity (W/mk)3,2

THIN LAM 3,2W 710µm Tg 180º Low CTE

TypeTHERMAL THIN LAMINATE

Dielectric Layer (μm)710

Thermal Conductivity (W/mk)3,2

THIN LAM 3,2W 600µm Tg 180º Low CTE

TypeTHERMAL THIN LAMINATE

Dielectric Layer (μm)600

Thermal Conductivity (W/mk)3,2

THIN LAM 3,2W 500µm Tg 180º Low CTE

TypeTHERMAL THIN LAMINATE

Dielectric Layer (μm)500

Thermal Conductivity (W/mk)3,2

THIN LAM 3,2W 450µm Tg 180º Low CTE

TypeTHERMAL THIN LAMINATE

Dielectric Layer (μm)450

Thermal Conductivity (W/mk)3,2

THIN LAM 3,2W 400µm Tg 180º Low CTE

TypeTHERMAL THIN LAMINATE

Dielectric Layer (μm)400

Thermal Conductivity (W/mk)3,2

THIN LAM 3,2W 380µm Tg 180º Low CTE

TypeTHERMAL THIN LAMINATE

Dielectric Layer (μm)380

Thermal Conductivity (W/mk)3,2

THIN LAM 3,2W 300µm Tg 180º Low CTE

TypeTHERMAL THIN LAMINATE

Dielectric Layer (μm)300

Thermal Conductivity (W/mk)3,2

THIN LAM 3,2W 250µm Tg 180º Low CTE

TypeTHERMAL THIN LAMINATE

Dielectric Layer (μm)250

Thermal Conductivity (W/mk)3,2

THIN LAM 3,2W 150µm Tg 180º Low CTE

TypeTHERMAL THIN LAMINATE

Dielectric Layer (μm)150

Thermal Conductivity (W/mk)3,2

THIN LAM 2,2W 150µm

TypeTHERMAL THIN LAMINATE

Dielectric Layer (μm)150

Thermal Conductivity (W/mk)2,2

THIN LAM 3,2W 200µm Tg 180º Low CTE

TypeTHERMAL THIN LAMINATE

Dielectric Layer (μm)200

Thermal Conductivity (W/mk)3.2

THIN LAM 2,2W 127µm

TypeTHERMAL THIN LAMINATE

Dielectric Layer (μm)127

Thermal Conductivity (W/mk)2,2

THIN LAM 3,2W 100µm Tg 180º Low CTE

TypeTHERMAL THIN LAMINATE

Dielectric Layer (μm)100

Thermal Conductivity (W/mk)3,2

THIN LAM 2,2W 100µm

TypeTHERMAL THIN LAMINATE

Dielectric Layer (μm)100

Thermal Conductivity (W/mk)2,2

THIN LAM 3,2W 75µm Tg 180º Low CTE

TypeTHERMAL THIN LAMINATE

Dielectric Layer (μm)75

Thermal Conductivity (W/mk)3,2

THIN LAM 2,2W 75µm

TypeTHERMAL THIN LAMINATE

Dielectric Layer (μm)75

Thermal Conductivity (W/mk)2,2

BOND SHEET CURED + AIR GAP FILLER

Ultra-thin dielectric layer, high dielectric strength,
high thermal conductivity and low thermal resistance.
Montaje_1

Air Gap Filler μm (mils)

50(2,0)

Bond Sheet Cured μm (mils)
70(2,8) 80(3,1) 100(3,9)

Air Gap Filler μm (mils)
50(1,2)

Air Gap Filler μm (mils)
50(2,0)

Bond Sheet Cured μm (mils)
70(2,8)
80(3,1)
100(3,9)

Total thickness
Dielectric capacity
Thermal resistance Rth
Thermal conductivity
Bond Sheet Cured 70µm (ASTM 5476)
70 µm
4 KV
0,041 K/W
2,2 W/mK
Technical data sheet
Bond Sheet Cured 100µm (ASTM 5476)
100 µm
6 KV
0,058 K/W
2,2 W/mK
Technical data sheet
Bond Sheet Cured 70µm + Air Gap Filler
120 µm
4,2 KV
0,07 K/W
2,2 W/mK
Technical data sheet
Bond Sheet Cured 100µm + Air Gap Filler
150 µm
6,2 KV
0,088 K/W
2,2 W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 70µm + Air gap filler
170 µm
4,4 KV
0,099 K/W
2,2 W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 100µm + Air gap filler
200 µm
6,4 KV
0,117 K/W
2,2 W/mK
Technical data sheet
Bond Sheet Cured 80µm High Tg (ASTM 5476)
80 µm
4 KV
0,031 K/W
3,2 W/mK
Technical data sheet
Bond Sheet Cured 80µm High Tg + Air gap filler
130 µm
4,2 KV
0,051 K/W
3,2 W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 80µm HTg + Air gap filler
180 µm
4,4 KV
0,070 K/W
3,2 W/mK
Technical data sheet
Dielectric capacity Dielectric capacity Thermal resistance Rth Thermal resistance Rth Thermal conductivity Thermal conductivity
Bond sheet cured 70µm (ASTM5476)
Total thickness
70µm
Dialectric capacity
4KV
Thermal resistance Rth
0,041K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Bond Sheet Cured 100µm (ASTM 5476)
Total thickness
100µm
Dialectric capacity
6KV
Thermal resistance Rth
0,058K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Bond Sheet Cured 70µm + Air gap filler
Total thickness
120µm
Dialectric capacity
4,2KV
Thermal resistance Rth
0,07K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Bond Sheet Cured 100µm + Air gap filler
Total thickness
150µm
Dialectric capacity
6,2KV
Thermal resistance Rth
0,88K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 70µm + Air gap filler
Total thickness
170µm
Dialectric capacity
4,4KV
Thermal resistance Rth
0,99K/W
Thermal conductivity
3,2W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 100µm + Air gap filler
Total thickness
200µm
Dialectric capacity
6,4KV
Thermal resistance Rth
0,117K/W
Thermal conductivity
3,2W/mK
Technical data sheet
Bond Sheet Cured 80µm High Tg (ASTM 5476)
Total thickness
80µm
Dialectric capacity
4KV
Thermal resistance Rth
0,031K/W
Thermal conductivity
3,2W/mK
Technical data sheet
Bond Sheet Cured 80µm High Tg + Air gap filler
Total thickness
130µm
Dialectric capacity
4,2KV
Thermal resistance Rth
0,051K/W
Thermal conductivity
3,2W/mK
Technical data sheet
Air gap filler + Bond Sheet Cured 80µm High Tg + Air gap filler
Total thickness
180µm
Dialectric capacity
4,4KV
Thermal resistance Rth
0,070K/W
Thermal conductivity
3,2W/mK
Technical data sheet
Bond sheet cured 70µm (ASTM5476)
Total Thickness
70 µm
Dialectric capacity
4 KV
Thermal resistance Rth
0,041K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Technical data sheet
Bond Sheet Cured 100µm (ASTM5476)
Total Thickness
100 µm
Dialectric capacity
6 KV
Thermal resistance Rth
0,058 K/W
Thermal conductivity
2,2 W/mK
Technical data sheet
Technical data sheet
Bond Sheet Cured 70µm + Air gap filler
Total Thickness
120 µm
Dialectric capacity
4,2 KV
Thermal resistance Rth
0,07 K/W
Thermal conductivity
2,2 W/mK
Technical data sheet
Technical data sheet
Bond Sheet Cured 100µm + Air gap filler
Total Thickness
150 µm
Dialectric capacity
6,2 KV
Thermal resistance Rth
0,88 K/W
Thermal conductivity
2,2 W/mK
Technical data sheet
Technical data sheet
Air gap filler + Bond Sheet Cured 70µm + Air gap filler
Total Thickness
170 µm
Dialectric capacity
4,4 KV
Thermal resistance Rth
0,99 K/W
Thermal conductivity
3,2 W/mK
Technical data sheet
Technical data sheet
Air gap filler + Bond Sheet Cured 100µm + Air gap filler
Total Thickness
200 µm
Dialectric capacity
6,4 KV
Thermal resistance Rth
0,117 K/W
Thermal conductivity
3,2 W/mK
Technical data sheet
Technical data sheet
Bond Sheet Cured 80µm High Tg (ASTM 5476)
Total Thickness
80 µm
Dialectric capacity
4 KV
Thermal resistance Rth
0,031 K/W
Thermal conductivity
3,2 W/mK
Technical data sheet
Technical data sheet
Bond Sheet Cured 80µm High Tg + Air gap filler
Total Thickness
130 µm
Dialectric capacity
4,2 KV
Thermal resistance Rth
0,051 K/W
Thermal conductivity
3,2 W/mK
Technical data sheet
Technical data sheet
Air gap filler + Bond Sheet Cured 80µm High Tg + Air gap filler
Total Thickness
180 µm
Dialectric capacity
4,4 KV
Thermal resistance Rth
0,070 K/W
Thermal conductivity
3,2 W/mK
Technical data sheet
Technical data sheet

ALPRIMER (ISOLAL)

Aluminum laminate coated with a thermal conductive ultra-thin dielectric layer.

Imagen1

Insulation thickness µm (in)

100(3,9)

Aluminium thickness um (In)

1000 (0.039)/ 1500 (0.059)/2000(0.078)/3000 (0.12)

Dielectric capacity (KV)
ALP
6
Technical Data Sheet

BOND SHEET CURED + THERMAL TAPE

Adhesive film with thermal transmission combined with an ultra-thin dielectric layer.

Thermal Tape um (mllc)

50 (1.9)

Dielectric thickness µm (mlic)

70(2,8)/80(3,1) / 100(3,9)

Total Thickness (µm)
Dielectric capacity (KV)
Thermal Resistance Rth (K/W)
Thermal Conductivity
Bond Sheet Cured 70µm + Thermal Tape
120
4,5
0,09
2,2 W/mk
Technical Data Sheet
Bond Sheet Cured 100µm + Thermal Tape
150
6,5
0,107
2,2 W/mk
Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 70µm + Thermal Tape
170
4,7
0,119
2,2 W/mk
Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 100µm + Thermal Tape
200
6,7
0,136
2,2 W/mk
Technical Data Sheet
Bond Sheet Cured 80µm High Tg + Thermal Tape
130
4,5
0,08
3,2 W/mK
Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 80µm High Tg + Thermal Tape
180
4,7
0,099
3,2 W/mK
Technical Data Sheet

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