THIN LAM 2,2W 100µm
FamilyMULTILAYER
ProductTHIN LAM
TypeTHERMAL THIN LAMINATE
Dielectric Layer(μm)100
Thermal Resistance (K/W)0,152
Thermal Conductivity (W/mk)2,2
Elec. TEST V(DC)-
Brake down voltage V(AC)4000
ComformableNO
Ideal for high temperatureHigh
Dielectric strengthMedium
Insulation Guaranty*
Double sided Cu-clad thin laminate composed of thermal conductive polymeric glass reinforced prepreg used to produce double sided and multilayer PCB. Thin Lam bonds to a metal heat sink using standard multilayer lamination processes with one piece of B-stage COBRITHERM Bond-sheet. Its high resistance to thermal shocks added to its high thermal conductivity assures reliable and effective heat dissipation in critical power circuitry.
Catalogues
- MULTILAYER Leaflet with MULTILAYER products: BOND SHEET, THIN LAM, AL+PRIMER. Download
Datasheets
- THIN LAM 2,2W MULTILAYER - THIN LAM Download
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TypeTHERMAL THIN LAMINATE
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Dielectric capacity
Thermal resistance Rth
Thermal conductivity 
