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FR4-FR95

With a combination of our well-known THICK COPPER technology we are able to offer FR4 THICK COPPER from 105 to 400 microns always with RA copper. All our FR4 are UL, lead free, VDE and CE approved.

  • Product specifications

    Isolation Thickness Minimum 70μm, more on request
    Effective bonding between multilayer circuits (PCB) Yes
    CTE Low
    Interconnect reliability over thermal cycles Ideal
  • Product specifications

    ED Copper Layers 35μm
    Dielectric Layer 0.05-1.2 mm
    Glass Epoxy Yes
    Thermal Resistance High
    Dielectric Breakdown 40kV
    z-CTE Low
    Reinforcement Woven E-glass
    Glass Transition Tg ≥155ºC
  • Product specifications

    ED Copper Layers 35μm
    Dielectric Layer 0.8-3.2 mm
    Glass Epoxy Yes
    Thermal Resistance High
    Dielectric Breakdown 42kV
    z-CTE Low
    Reinforcement Woven E-glass
    Glass Transition Tg 135ºC
  • Product specifications

    ED Copper Layers 35μm
    Dielectric Layer 0,8-3,2mm
    Glass Epoxy Yes
    Thermal Resistance High
    Dielectric Breakdown 42kV
    z-CTE Low
    Reinforcement Woven E-glass
    Glass Transition Tg 170ºC
  • Product specifications

    ED Copper Layers 35μm
    Dielectric Layer 0,8-3,2mm
    Glass Epoxy Yes
    Thermal Resistance High
    Dielectric Breakdown 42kV
    z-CTE Low
    Reinforcement Woven E-glass
    Glass Transition Tg 135ºC
  • Product specifications

    ED Copper Layers 35μm
    Dielectric Layer 0,05-1,2mm
    Glass Epoxy Yes
    Thermal Resistance High
    Dielectric Breakdown 42kV
    z-CTE Low
    Reinforcement Woven E-glass
    Glass Transition Tg 135ºC

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