ct_code_block

Fastherm

FASTHERM is a new technology we developed to achieve a faster thermal transition from the LED thermal pad into the heat sink. This superior thermal transition can be achieved by using the entire COBRITHERM HTC product range with either a copper or copper / aluminum base. At AISMALIBAR we created a special laminate with a bimetal heat sink made with a thin layer of copper cladded onto an aluminum base. The aluminum layer possesses diffusive properties while the copper layer has a very thin dielectric for improving horizontal thermal dissipation. The bimetal also allows for solderability in surface mounting applications.

  • Product specifications

    Dielectric Layer 35μm
    Copper Thermal Conductivity 380 W/mK
    Thermal Impedance 0,42 Kcm²/W
    Brake down voltage V(AC) 2 kV
    Maximum Operational Temperature 130ºC
    Pedestrian Copper Grow on PCBs Ideal
  • Product specifications

    Dielectric Layer 25μm
    Copper Thermal Conductivity 380 W/mK
    Thermal Impedance 0,42 Kcm²/W
    Brakedown Voltage V(AC) 2 kV
    Maximum Operational Temperature 130ºC
    Pedestrian Copper Grow on PCBs Ideal

Do you need more info?

We are here to help you with any inquiries.

crossmenu