Insulated Metal Substrate (IMS), based copper clad with RA copper foil on one side. It is designed for a reliable thermal dissipation of circuitry. FASTHERM Cu-Cu is ideal for pedestrian copper grow on pcbs. Due to its special dielectric layer Fastherm can be used for conformable MPCB manufacturing. It can be bent after MPCB production while maintaining the initial dielectric strength in between conductive layers.