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IMS - METAL CLAD FASTHERM

FASTHERM CU-CU 0,7W 25µm

FamilyIMS - METAL CLAD

ProductFASTHERM

TypeCu-Cu

Dielectric Layer(μm)25

Thermal Resistance (K/W)0,119

Thermal Conductivity (W/mk)0,7

Elec. TEST V(DC)-

Brake down voltage V(AC)2000

ComformableYES

Ideal for high temperatureExcellent

Dielectric strengthLow

Insulation Guaranty*

Insulated Metal Substrate (IMS), based copper clad with RA copper foil on one side. It is designed for a reliable thermal dissipation of circuitry. FASTHERM Cu-Cu is ideal for pedestrian copper grow on pcbs. Due to its special dielectric layer Fastherm can be used for conformable MPCB manufacturing. It can be bent after MPCB production while maintaining the initial dielectric strength in between conductive layers.

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