FASTHERM CU-CU 0,7W 25µm
FamilyIMS - METAL CLAD
ProductFASTHERM
TypeCu-Cu
Dielectric Layer(μm)25
Thermal Resistance (K/W)0,119
Thermal Conductivity (W/mk)0,7
Elec. TEST V(DC)-
Brake down voltage V(AC)2000
ComformableYES
Ideal for high temperatureExcellent
Dielectric strengthLow
Insulation Guaranty*
Insulated Metal Substrate (IMS), based copper clad with RA copper foil on one side. It is designed for a reliable thermal dissipation of circuitry. FASTHERM Cu-Cu is ideal for pedestrian copper grow on pcbs. Due to its special dielectric layer Fastherm can be used for conformable MPCB manufacturing. It can be bent after MPCB production while maintaining the initial dielectric strength in between conductive layers.
Datasheets
- FASTHERM Cu-Cu 25µm 35µm 0,7W IMS-METAL CLAD - FASTHERM Download
