
COPPERFILLER by Aismalibar
FamilyTIM - THERMAL INTERFACE MATERIAL
ProductCOPPERFILLER
TypeLow Dielectric Strength
Dielectric Layer(μm)
Thermal Resistance (K/W)
Thermal Conductivity (W/mk)
Elec. TEST V(DC)
Brake down voltage V(AC)
Comformable
Ideal for high temperature
Dielectric strength
Insulation Guaranty
COPPERFILLER is a TIM developed by Aismalibar designed to eliminate the need to apply thermal paste on the surfaces to be dissipated.
It is composed of three layers, the two external ones are responsible for filling the air cavities between the radiators and the components, eliminating the need for thermal paste and a central layer of 30 micron copper designed to distribute the temperature more efficient both in Z axis and in X, Y.
- No need to apply thermal paste
- Air voids reduction
- Efficient temperature distribution
- Heat spreader