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IMS - METAL CLAD COBRITHERM ULTRATHIN

COBRITHERM ULTRATHIN Low Modulus 3,2W 100µm

FamilyIMS - METAL CLAD

ProductCOBRITHERM ULTRATHIN

TypeHTC

Dielectric Layer(μm)100

Thermal Resistance (K/W)0,25

Thermal Conductivity (W/mk)3,0

Elec. TEST V(DC)750

Brake down voltage V(AC)7000

ComformableNO

Ideal for high temperatureExcellent

Dielectric strengthLow

Insulation GuarantyYES

Insulated Metal Substrate (IMS), based in low CTE aluminium clad with a low tensile modulus dielectric layer to an ED copper foil.
The Ultrathin LM has been designed to reduce thermal heat from MPCBs and at the same time improve the behaviour over thermal cycle test. The reduction of the tensile modulus of the Ultrathin LM will significantly reduce the cracking of solder joints. The dielectric layer composition has been develop to minimize the internal stress during thermal cycling. The typical mismatch between aluminium base and copper is adjusted and reduced thanks to the low modulus behaviour of the dielectric layer. A proprietarily formulated polymer-ceramic bonding layer with high thermal conductivity and dielectric strength allow us to guarantee thermal endurance.

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