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IMS - METAL CLAD COBRITHERM

COBRITHERM HTC COPPER BASE 3,2W 130µm

FamilyIMS - METAL CLAD

ProductCOBRITHERM

TypeHTC COPPER BASE

Dielectric Layer(μm)130

Thermal Resistance (K/W)0,135

Thermal Conductivity (W/mk)3,2

Elec. TEST V(DC)-

Brake down voltage V(AC)3000

Comformable*

Ideal for high temperatureExcellent

Dielectric strengthMedium

Insulation GuarantyYES

Insulated Metal Substrate (IMS), based copper clad with ED copper foil on the opposite side. It is designed for the reliable thermal dissipation of circuitry. The usage of copper base will reduce the mismatch in between the functional copper layer and the base material. Its 130 micron dielectric layer is ideal for extremely high voltage electronics when there is also a need of thermal dissipation. A proprietarily formulated reinforced-polymer-ceramic bonding layer with a high thermal conductivity of 3.2W/mºK and high dielectric strength allows us to guarantee thermal endurance.
The entire COBRITHERM range is 100% proof test guaranteed. AISMALIBAR tests the insulation in between the copper and aluminum layers under high voltage.

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