COBRITHERM HTC COPPER BASE 3,2W 130µm
FamilyIMS - METAL CLAD
ProductCOBRITHERM
TypeHTC COPPER BASE
Dielectric Layer(μm)130
Thermal Resistance (K/W)0,135
Thermal Conductivity (W/mk)3,2
Elec. TEST V(DC)-
Brake down voltage V(AC)3000
Comformable*
Ideal for high temperatureExcellent
Dielectric strengthMedium
Insulation GuarantyYES
Insulated Metal Substrate (IMS), based copper clad with ED copper foil on the opposite side. It is designed for the reliable thermal dissipation of circuitry. The usage of copper base will reduce the mismatch in between the functional copper layer and the base material. Its 130 micron dielectric layer is ideal for extremely high voltage electronics when there is also a need of thermal dissipation. A proprietarily formulated reinforced-polymer-ceramic bonding layer with a high thermal conductivity of 3.2W/mºK and high dielectric strength allows us to guarantee thermal endurance.
The entire COBRITHERM range is 100% proof test guaranteed. AISMALIBAR tests the insulation in between the copper and aluminum layers under high voltage.
Catalogues
- COBRITHERM Leaflet with IMS- METAL CLAD products: COBRITHERM Download
Datasheets
- COBRITHERM HTC COPPER BASE 3,2W 130µm IMS-METAL CLAD - COBRITHERM Download
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