COBRITHERM HTC 2,2W 150µm
FamilyIMS - METAL CLAD
ProductCOBRITHERM
TypeHTC
Dielectric Layer(μm)150
Thermal Resistance (K/W)0,227
Thermal Conductivity (W/mk)2,2
Elec. TEST V(DC)3000
Brake down voltage V(AC)10000
ComformableNO
Ideal for high temperatureMedium
Dielectric strengthExcellent
Insulation GuarantyYES
Insulated Metal Substrate (IMS), based aluminum clad with ED copper foil on the opposite side. It is designed for the reliable thermal dissipation of circuitry. Its 150 micron dielectric layer is ideal for extremely high voltage electronics when there is also a need of thermal dissipation. A proprietarily formulated reinforced-polymer-ceramic bonding layer with a high thermal conductivity of 2.2W/mºK and high dielectric strength allows us to guarantee thermal endurance.
The entire COBRITHERM range is 100% proof test guaranteed. AISMALIBAR tests the insulation in between the copper and aluminum layers under high voltage.
Ideal for power modules, IGBTS and automotive power train.
Catalogues
- COBRITHERM Leaflet with IMS- METAL CLAD products: COBRITHERM Download
Datasheets
- COBRITHERM HTC 2,2W 150µm IMS-METAL CLAD - COBRITHERM Download
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