
BOND SHEET CURED 70/100µm + 1 AIR GAP FILLER by Aismalibar
FamilyTIM - THERMAL INTERFACE MATERIAL
ProductBOND SHEET CURED
TypeHigh Dielectric Strength
Dielectric Layer(μm)
Thermal Resistance (K/W)
Thermal Conductivity (W/mk)
Elec. TEST V(DC)
Brake down voltage V(AC)
Comformable
Ideal for high temperature
Dielectric strength
Insulation Guaranty
- Aismalibar Thermal air gap filler is a unique technology that provides air gap filling capacity at 35-40ºC
- Low mounting pressure
- Silicon free
- No need of thermal grease
- Bond sheet cured with single or double side thermal air gap filers
- Offered in cut two size
- UL recognition V0 flammability
- Bond sheet cured Tg : 130ºC (DSC)
BOND SHEET CURED other products
BOND SHEET CURED 70/100µm + 2 AIR GAP FILLER by Aismalibar
TypeHigh Dielectric Strength
Dielectric Layer (μm)
Thermal Conductivity (W/mk)
BOND SHEET CURED 70/100µm + 1 AIR GAP FILLER by Aismalibar
TypeHigh Dielectric Strength
Dielectric Layer (μm)
Thermal Conductivity (W/mk)
BOND SHEET CURED 70/100µm + 2 THERMAL TAPE by Aismalibar
TypeHigh Dielectric Strength
Dielectric Layer (μm)70
Thermal Conductivity (W/mk)
BOND SHEET CURED 70/100µm + 1 THERMAL TAPE by Aismalibar
TypeHigh Dielectric Strength
Dielectric Layer (μm)
Thermal Conductivity (W/mk)
BOND SHEET CURED 2,2W 100µm by Aismalibar
TypeALCUP
Dielectric Layer (μm)100
Thermal Conductivity (W/mk)2,2
BOND SHEET CURED 2,2W 70µm
TypeALCUP
Dielectric Layer (μm)70
Thermal Conductivity (W/mk)2,2
BOND SHEET 3,2W 100µm Tg 180º Low CTE
TypeALCUP
Dielectric Layer (μm)100
Thermal Conductivity (W/mk)3,2
BOND SHEET 2,2W 100µm
TypeALCUP
Dielectric Layer (μm)100
Thermal Conductivity (W/mk)2,2
BOND SHEET 3,2W 80µm Tg 180º Low CTE
TypeALCUP
Dielectric Layer (μm)80
Thermal Conductivity (W/mk)3,2
BOND SHEET 2,2W 80µm
TypeALCUP
Dielectric Layer (μm)80
Thermal Conductivity (W/mk)2,2
BOND SHEET 3,2W 70µm Tg 180º Low CTE
TypeALCUP
Dielectric Layer (μm)70
Thermal Conductivity (W/mk)3,2
BOND SHEET 2,2W 70µm
TypeALCUP
Dielectric Layer (μm)70
Thermal Conductivity (W/mk)2,2