BOND SHEET CURED 2,2W 70µm
FamilyHIGH ELECTRICAL ISOLATION
ProductBOND SHEET cured
TypeIsolation Pads with High Dielectric Strength
Dielectric Layer(μm)70
Thermal Resistance (K/W)0,106
Thermal Conductivity (W/mk)2,2
Elec. TEST V(DC)4000
Brake down voltage V(AC)-
ComformableNO
Ideal for high temperatureExcellent
Dielectric strengthExcellent
Insulation Guaranty*
Dielectric polymerized glass reinforced in a bond sheet with high thermal conductivity. It is based on epoxy ceramic chemistry, and intended to improve thermal contact between two surfaces. Its high resistance to thermal shocks and high thermal conductivity assures heat dissipation in critical power circuitry. Ideal for thermal insulating material, adhesive less, easy to assemble on PCBA and excellent dielectric performance.
Catalogues
Datasheets
- BOND SHEET cured 2,2W (70µm–100µm) HIGH ELECTRICAL ISOLATION - BOND SHEET cured Download
