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HIGH ELECTRICAL ISOLATION BOND SHEET cured

BOND SHEET CURED 2,2W 70µm

FamilyHIGH ELECTRICAL ISOLATION

ProductBOND SHEET cured

TypeIsolation Pads with High Dielectric Strength

Dielectric Layer(μm)70

Thermal Resistance (K/W)0,106

Thermal Conductivity (W/mk)2,2

Elec. TEST V(DC)4000

Brake down voltage V(AC)-

ComformableNO

Ideal for high temperatureExcellent

Dielectric strengthExcellent

Insulation Guaranty*

Dielectric polymerized glass reinforced in a bond sheet with high thermal conductivity. It is based on epoxy ceramic chemistry, and intended to improve thermal contact between two surfaces. Its high resistance to thermal shocks and high thermal conductivity assures heat dissipation in critical power circuitry. Ideal for thermal insulating material, adhesive less, easy to assemble on PCBA and excellent dielectric performance.

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