BOND SHEET CURED 2,2W 100µm by Aismalibar
Dielectric polymerized glass reinforced in a bond sheet with high thermal conductivity. It is based on epoxy ceramic chemistry, and intended to improve thermal contact between two surfaces. Its high dielectric resistance and high thermal conductivity assures heat dissipation in critical power circuitry assuring high dielectric strength. Ideal for thermal insulating material, adhesive less, easy to assemble on PCBA and excellent dielectric performance.