BOND SHEET CURED 2,2W 100µm by Aismalibar
FamilyHIGH ELECTRICAL ISOLATION
ProductBOND SHEET cured
TypeIsolation Pads with High Dielectric Strength
Dielectric Layer(μm)100
Thermal Resistance (K/W)0,152
Thermal Conductivity (W/mk)2,2
Elec. TEST V(DC)6000
Brake down voltage V(AC)-
ComformableNO
Ideal for high temperatureHigh
Dielectric strengthHigh
Insulation Guaranty*
BOND SHEET CURED 2,2W 100µm by Aismalibar
Dielectric polymerized glass reinforced in a bond sheet with high thermal conductivity. It is based on epoxy ceramic chemistry, and intended to improve thermal contact between two surfaces. Its high dielectric resistance and high thermal conductivity assures heat dissipation in critical power circuitry assuring high dielectric strength. Ideal for thermal insulating material, adhesive less, easy to assemble on PCBA and excellent dielectric performance.
Catalogues
Datasheets
- BOND SHEET cured 2,2W (70µm–100µm) HIGH ELECTRICAL ISOLATION - BOND SHEET cured Download
