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HIGH ELECTRICAL ISOLATION BOND SHEET cured

BOND SHEET CURED 2,2W 100µm by Aismalibar

FamilyHIGH ELECTRICAL ISOLATION

ProductBOND SHEET cured

TypeIsolation Pads with High Dielectric Strength

Dielectric Layer(μm)100

Thermal Resistance (K/W)0,152

Thermal Conductivity (W/mk)2,2

Elec. TEST V(DC)6000

Brake down voltage V(AC)-

ComformableNO

Ideal for high temperatureHigh

Dielectric strengthHigh

Insulation Guaranty*

BOND SHEET CURED 2,2W 100µm by Aismalibar

Dielectric polymerized glass reinforced in a bond sheet with high thermal conductivity. It is based on epoxy ceramic chemistry, and intended to improve thermal contact between two surfaces. Its high dielectric resistance and high thermal conductivity assures heat dissipation in critical power circuitry assuring high dielectric strength. Ideal for thermal insulating material, adhesive less, easy to assemble on PCBA and excellent dielectric performance.

Product group – fr4/fr95

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