BOND SHEET CURED 2,2W 100µm by Aismalibar
FamilyTIM - THERMAL INTERFACE MATERIAL
ProductBOND SHEET CURED
TypeALCUP
Dielectric Layer(μm)100
Thermal Resistance (K/W)0,152
Thermal Conductivity (W/mk)2,2
Elec. TEST V(DC)6000
Brake down voltage V(AC)-
ComformableNO
Ideal for high temperatureHigh
Dielectric strengthHigh
Insulation Guaranty*
BOND SHEET CURED 2,2W 100µm by Aismalibar
Dielectric polymerized glass reinforced in a bond sheet with high thermal conductivity. It is based on epoxy ceramic chemistry, and intended to improve thermal contact between two surfaces. Its high dielectric resistance and high thermal conductivity assures heat dissipation in critical power circuitry assuring high dielectric strength. Ideal for thermal insulating material, adhesive less, easy to assemble on PCBA and excellent dielectric performance.
Catalogues
Datasheets
- BOND SHEET cured 2,2W (70µm–100µm) HIGH ELECTRICAL ISOLATION - BOND SHEET cured Download
BOND SHEET CURED other products
BOND SHEET CURED 70/100µm + 2 AIR GAP FILLER by Aismalibar
TypeHigh Dielectric Strength
Dielectric Layer (μm)
Thermal Conductivity (W/mk)
BOND SHEET CURED 70/100µm + 1 AIR GAP FILLER by Aismalibar
TypeHigh Dielectric Strength
Dielectric Layer (μm)
Thermal Conductivity (W/mk)
BOND SHEET CURED 70/100µm + 2 THERMAL TAPE by Aismalibar
TypeHigh Dielectric Strength
Dielectric Layer (μm)70
Thermal Conductivity (W/mk)
BOND SHEET CURED 70/100µm + 1 THERMAL TAPE by Aismalibar
TypeHigh Dielectric Strength
Dielectric Layer (μm)
Thermal Conductivity (W/mk)
BOND SHEET CURED 2,2W 100µm by Aismalibar
TypeALCUP
Dielectric Layer (μm)100
Thermal Conductivity (W/mk)2,2
BOND SHEET CURED 2,2W 70µm
TypeALCUP
Dielectric Layer (μm)70
Thermal Conductivity (W/mk)2,2
BOND SHEET 3,2W 100µm Tg 180º Low CTE
TypeALCUP
Dielectric Layer (μm)100
Thermal Conductivity (W/mk)3,2
BOND SHEET 2,2W 100µm
TypeALCUP
Dielectric Layer (μm)100
Thermal Conductivity (W/mk)2,2
BOND SHEET 3,2W 80µm Tg 180º Low CTE
TypeALCUP
Dielectric Layer (μm)80
Thermal Conductivity (W/mk)3,2
BOND SHEET 2,2W 80µm
TypeALCUP
Dielectric Layer (μm)80
Thermal Conductivity (W/mk)2,2
BOND SHEET 3,2W 70µm Tg 180º Low CTE
TypeALCUP
Dielectric Layer (μm)70
Thermal Conductivity (W/mk)3,2
BOND SHEET 2,2W 70µm
TypeALCUP
Dielectric Layer (μm)70
Thermal Conductivity (W/mk)2,2
Dielectric capacity
Thermal resistance Rth
Thermal conductivity 
