BOND SHEET 3,2W 70µm Tg 180º Low CTE
FamilyMULTILAYER
ProductBOND SHEET CURED
TypeALCUP
Dielectric Layer(μm)70
Thermal Resistance (K/W)0,073
Thermal Conductivity (W/mk)3,2
Elec. TEST V(DC)-
Brake down voltage V(AC)-
ComformableNO
Ideal for high temperatureHigh
Dielectric strengthLow
Insulation Guaranty*
High Tg – B-stage dielectric prepreg glass reinforced with high thermal conductivity. It is based on epoxy ceramic chemistry, and intended for effective bonding between multilayer circuits (PCB) and metal heat spreaders. Its high dielectric strength and resistance to thermal shocks added to its high thermal conductivity assures effective heat dissipation in critical power circuitry. Its low CTE value is ideal to achieve excellent interconnect reliability over thermal cycles.
Catalogues
- Multilayer Leaflet with MULTILAYER products: BOND SHEET, THIN LAM, AL+PRIMER. Download
Datasheets
- BOND SHEET (70µm–80µm–100µm) HTC 3,2W MULTILAYER - BOND SHEET Download
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TypeALCUP
Dielectric Layer (μm)70
Thermal Conductivity (W/mk)2,2
BOND SHEET 3,2W 100µm Tg 180º Low CTE
TypeALCUP
Dielectric Layer (μm)100
Thermal Conductivity (W/mk)3,2
BOND SHEET 2,2W 100µm
TypeALCUP
Dielectric Layer (μm)100
Thermal Conductivity (W/mk)2,2
BOND SHEET 3,2W 80µm Tg 180º Low CTE
TypeALCUP
Dielectric Layer (μm)80
Thermal Conductivity (W/mk)3,2
BOND SHEET 2,2W 80µm
TypeALCUP
Dielectric Layer (μm)80
Thermal Conductivity (W/mk)2,2
BOND SHEET 3,2W 70µm Tg 180º Low CTE
TypeALCUP
Dielectric Layer (μm)70
Thermal Conductivity (W/mk)3,2
BOND SHEET 2,2W 70µm
TypeALCUP
Dielectric Layer (μm)70
Thermal Conductivity (W/mk)2,2
Dielectric capacity
Thermal resistance Rth
Thermal conductivity 
