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MULTILAYER BOND SHEET

BOND SHEET 2,2W 100µm

FamilyMULTILAYER

ProductBOND SHEET

TypeCERAMIC PREPREG

Dielectric Layer(μm)100

Thermal Resistance (K/W)0,152

Thermal Conductivity (W/mk)2,2

Elec. TEST V(DC)-

Brake down voltage V(AC)-

ComformableNO

Ideal for high temperatureHigh

Dielectric strengthMedium

Insulation Guaranty*

B-stage dielectric prepreg glass reinforced with high thermal conductivity. It is based on epoxy ceramic chemistry, and intended for effective bonding between multilayer circuits (PCB) and metal heat spreaders. Its high dielectric strength and resistance to thermal shocks added to its high thermal conductivity assures effective heat dissipation in critical power circuitry.

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