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MULTILAYER BOND SHEET

BOND SHEET 3,2W 100µm Tg 180º Low CTE

FamilyMULTILAYER

ProductBOND SHEET

TypeCERAMIC PREPREG

Dielectric Layer(μm)100

Thermal Resistance (K/W)0,104

Thermal Conductivity (W/mk)3,2

Elec. TEST V(DC)-

Brake down voltage V(AC)-

ComformableNO

Ideal for high temperatureHigh

Dielectric strengthMedium

Insulation Guaranty*

High Tg – B-stage dielectric prepreg glass reinforced with high thermal conductivity. It is based on epoxy ceramic chemistry, and intended for effective bonding between multilayer circuits (PCB) and metal heat spreaders. Its high dielectric strength and resistance to thermal shocks added to its high thermal conductivity assures effective heat dissipation in critical power circuitry. Its low CTE value is ideal to achieve excellent interconnect reliability over thermal cycles.

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