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MULTILAYER AL+PRIMER

AL+PRIMER 2,2W 30µm

FamilyMULTILAYER

ProductAL+PRIMER

TypeIMS - Metal Clad

Dielectric Layer(μm)30

Thermal Resistance (K/W)0,045

Thermal Conductivity (W/mk)2,2

Elec. TEST V(DC)-

Brake down voltage V(AC)-

ComformableNO

Ideal for high temperature*

Dielectric strength*

Insulation Guaranty*

Aluminum coated with thermal conductive polymeric resin, delivered as B-stage. Can be supplied with coating on one or both sides and its ideal to laminate thin double side pcbs to Aluminum. By using AL+ Primer you increase bonding skills over aluminum lamination achieving high thermal conductivity.

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