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Thin Lam

THIN LAM is a thin laminate designed for high thermal dissipation applications, with thermal conductivity ranging between 2.2 and 3.2 W/mK. This laminate can be bent after component insertion in order to achieve three-dimensional shapes with the PCB board. THIN LAM is the ideal replacement for FR4 thin laminates when thermal release is required. Double side Cu-clad thin laminate is built on the basis of thermal conductive polymeric-ceramic glass reinforced prepreg. It is mainly intended to produce double side PCB, for later bonding to a metal heat spreader by means of one sheet of B-stage.

  • Product specifications

    Thermal Impedance 0,37/0,75 Kcm²/W
    Resistance to Thermal Shocks High
    Thermal Conductivity 2,2 W/mK
    Effective Heat Dissipation Yes
    Dielectric Breakdown Voltage, AC ≥3/≥6 kV
  • Product specifications

    Dielectric Layer 1520μm
    Thermal Conductivity 3,2 W/kV
    Brakedown Voltage V(AC) 50 kV/mm
    Ideal for high temperature High
    Dielectric Strength Excellent
    Bond to a Metal Heat Sink Yes
    Resistance to Thermal Shocks Yes
  • Product specifications

    Dielectric Layer 1270μm
    Thermal Conductivity 3,2 W/kV
    Brakedown Voltage V(AC) 50 kV/mm
    Ideal for high temperature High
    Dielectric Strength Excellent
    Bond to a Metal Heat Sink Yes
    Resistance to Thermal Shocks Yes
  • Product specifications

    Dielectric Layer 1000μm
    Thermal Conductivity 3,2 W/kV
    Brakedown Voltage V(AC) 50 kV/mm
    Ideal for high temperature High
    Dielectric Strength Excellent
    Bond to a Metal Heat Sink Yes
    Resistance to Thermal Shocks Yes
  • Product specifications

    Dielectric Layer 760μm
    Thermal Conductivity 3,2 W/kV
    Brakedown Voltage V(AC) 50 kV/mm
    Ideal for high temperature High
    Dielectric Strength Excellent
    Bond to a Metal Heat Sink Yes
    Resistance to Thermal Shocks Yes
  • Product specifications

    Dielectric Layer 710μm
    Thermal Conductivity 3,2 W/kV
    Brakedown Voltage V(AC) 50 kV/mm
    Ideal for high temperature High
    Dielectric Strength Excellent
    Bond to a Metal Heat Sink Yes
    Resistance to Thermal Shocks Yes
  • Product specifications

    Dielectric Layer 600μm
    Thermal Conductivity 3,2 W/kV
    Brakedown Voltage V(AC) 50 kV/mm
    Ideal for high temperature High
    Dielectric Strength Excellent
    Bond to a Metal Heat Sink Yes
    Resistance to Thermal Shocks Yes
  • Product specifications

    Dielectric Layer 500μm
    Thermal Conductivity 3,2 W/kV
    Brakedown Voltage V(AC) 50 kV/mm
    Ideal for high temperature High
    Dielectric Strength Excellent
    Bond to a Metal Heat Sink Yes
    Resistance to Thermal Shocks Yes
  • Product specifications

    Dielectric Layer 450μm
    Thermal Conductivity 3,2 W/kV
    Brakedown Voltage V(AC) 50 kV/mm
    Ideal for high temperature High
    Dielectric Strength Excellent
    Bond to a Metal Heat Sink Yes
    Resistance to Thermal Shocks Yes
  • Product specifications

    Dielectric Layer 400μm
    Thermal Conductivity 3,2 W/kV
    Brakedown Voltage V(AC) 50 kV/mm
    Ideal for high temperature High
    Dielectric Strength Excellent
    Bond to a Metal Heat Sink Yes
    Resistance to Thermal Shocks Yes
  • Product specifications

    Dielectric Layer 380μm
    Thermal Conductivity 3,2 W/kV
    Brakedown Voltage V(AC) 50 kV/mm
    Ideal for high temperature High
    Dielectric Strength Excellent
    Bond to a Metal Heat Sink Yes
    Resistance to Thermal Shocks Yes
  • Product specifications

    Dielectric Layer 300μm
    Thermal Conductivity 3,2 W/kV
    Brakedown Voltage V(AC) 50 kV/mm
    Ideal for high temperature High
    Dielectric Strength Excellent
    Bond to a Metal Heat Sink Yes
    Resistance to Thermal Shocks Yes

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