
COBRITHERM
COBRITHERM is a highly thermally conductive Insulated Metal Substrate (IMS) consisting of an aluminum or copper base clad with copper foil on the opposite side. It has an epoxy-based insulation layer with high inorganic content allowing the material to achieve excellent thermal conductivity. COBRITHERM substrate's goal is to minimize thermal impedance and effectively conduct heat from the electronic components into the metal core. COBRITHERM is a high pressure and temperature substrate which can achieve excellent bonding strengths, much higher than standard thermal adhesives common in the thermal management industry.
MAIN FEATURES
WHY USE COBRITHERM
COBRITHERM SOLUTIONS
COBRITHERM PRODUCT RANGE
COBRITHERM Product list
COBRITHERM HTC COPPER BASE 3,2W 130µm
TypeHTC COPPER BASE
Dielectric Layer (μm)130
Thermal Conductivity (W/mk)3,2
COBRITHERM HTC COPPER BASE 2,2W 130µm
TypeHTC COPPER BASE
Dielectric Layer (μm)130
Thermal Conductivity (W/mk)2,2
COBRITHERM HTC 2,2W 150µm
TypeHTC
Dielectric Layer (μm)150
Thermal Conductivity (W/mk)2,2
COBRITHERM HTC 3,2W 130µm
TypeHTC
Dielectric Layer (μm)130
Thermal Conductivity (W/mk)3,2
COBRITHERM HTC 2,2W 130µm
TypeHTC
Dielectric Layer (μm)130
Thermal Conductivity (W/mk)2,2
COBRITHERM HTC 3,2W 90µm
TypeHTC
Dielectric Layer (μm)90
Thermal Conductivity (W/mk)3,2
COBRITHERM HTC 2,2W 90µm
TypeHTC
Dielectric Layer (μm)90
Thermal Conductivity (W/mk)2,2
COBRITHERM ALCUP G-NT 1,3W 100µm
TypeALCUP G-NT
Dielectric Layer (μm)100
Thermal Conductivity (W/mk)1,3
COBRITHERM ALCUP G 1,3W 120µm
TypeALCUP G
Dielectric Layer (μm)120
Thermal Conductivity (W/mk)1,3
COBRITHERM ALCUP 1,8W 120µm
TypeALCUP
Dielectric Layer (μm)120
Thermal Conductivity (W/mk)1,8
COBRITHERM ALCUP 1,8W 100µm
TypeALCUP
Dielectric Layer (μm)100
Thermal Conductivity (W/mk)1,8