MULTILAYER
BOND SHEET
AISMALIBAR offers a range of High Thermal BOND SHEET (Thermal Pre Preg) that can be used for different applications in the PCB and MPCB industry. By using BOND SHEET, dielectric layers become thermally conductive and are ideal to release heat from the heat-generating elements located on the functional copper to the opposite copper layer or heat sink layer. BOND SHEET is available in 80- and 100-micron thickness (3.1 mils and 4mils[H1]), with a thermal conductivity of 2.2 W/mK or 3.2 W/mK. BOND SHEET is used in standard multilayer lamination processes. Its high resistance to thermal shocks added to its high thermal conductivity assures reliable and effective heat dissipation in critical power circuitry.
BOND SHEET Product list
BOND SHEET 3,2W 100µm Tg 180º Low CTE
TypeCERAMIC PREPREG
Dielectric Layer (μm)100
Thermal Conductivity (W/mk)3,2
BOND SHEET 2,2W 100µm
TypeCERAMIC PREPREG
Dielectric Layer (μm)100
Thermal Conductivity (W/mk)2,2
BOND SHEET 3,2W 80µm Tg 180º Low CTE
TypeCERAMIC PREPREG
Dielectric Layer (μm)80
Thermal Conductivity (W/mk)3,2
BOND SHEET 2,2W 80µm
TypeCERAMIC PREPREG
Dielectric Layer (μm)80
Thermal Conductivity (W/mk)2,2
BOND SHEET 3,2W 70µm Tg 180º Low CTE
TypeCERAMIC PREPREG
Dielectric Layer (μm)70
Thermal Conductivity (W/mk)3,2
BOND SHEET 2,2W 70µm
TypeCERAMIC PREPREG
Dielectric Layer (μm)70
Thermal Conductivity (W/mk)2,2