BOND SHEET cured

Ultra-thin dielectric layer High dielectric strength High thermal conductivity Low thermal resistance Easy to cut, rout or punch Clean solution avoids the use of oils or silicon Ideal for power module and LED modules ground insolation

Freedom about formats and shapes It can be cut or punched in different sizes and shapes It can be cut to size upon request to cover 100% of the surface. A clean, fast and efficient thermal interface material. Avoids air gaps between MPCB and heat sinks High dielectric breakdown voltage: 70u > 3kv, 100u > 6kv