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HIGH ELECTRICAL ISOLATION

BOND SHEET cured

BOND SHEET CURED is a reinforced dielectric polymerized interface material designed for high dielectric insulation and low thermal resistance. A clean, fast and efficient thermal interface material used to avoid air gaps in between MPCB and heat sinks, improves dielectric insulation and fast thermal transmission. It can be easily cut into shapes to match customer requirements.

MAIN FEATURES
WHY TO USE BOND SHEET CURED

BOND SHEET cured Product list