TIM - THERMAL INTERFACE MATERIAL
BOND SHEET CURED
BOND SHEET CURED is a reinforced dielectric polymerized interface material designed for high dielectric isolation and low thermal resistance. Ultra-thin dielectric layer with high dielectric strength, high thermal conductivity and low thermal resistance, which efficiently dissipates the heat generated by the power components to the cooling elements. Consisting of a glass fabric base, enriched with mineral fillers. Silicon free. Ideal for pick and place automation.
BOND SHEET CURED Product list
BOND SHEET CURED 70/100µm + 2 AIR GAP FILLER by Aismalibar
TypeHigh Dielectric Strength
Dielectric Layer (μm)
Thermal Conductivity (W/mk)
BOND SHEET CURED 70/100µm + 1 AIR GAP FILLER by Aismalibar
TypeHigh Dielectric Strength
Dielectric Layer (μm)
Thermal Conductivity (W/mk)
BOND SHEET CURED 70/100µm + 2 THERMAL TAPE by Aismalibar
TypeHigh Dielectric Strength
Dielectric Layer (μm)70
Thermal Conductivity (W/mk)
BOND SHEET CURED 70/100µm + 1 THERMAL TAPE by Aismalibar
TypeHigh Dielectric Strength
Dielectric Layer (μm)
Thermal Conductivity (W/mk)
BOND SHEET CURED 2,2W 100µm by Aismalibar
TypeALCUP
Dielectric Layer (μm)100
Thermal Conductivity (W/mk)2,2
BOND SHEET CURED 2,2W 70µm
TypeALCUP
Dielectric Layer (μm)70
Thermal Conductivity (W/mk)2,2
BOND SHEET 3,2W 100µm Tg 180º Low CTE
TypeALCUP
Dielectric Layer (μm)100
Thermal Conductivity (W/mk)3,2
BOND SHEET 2,2W 100µm
TypeALCUP
Dielectric Layer (μm)100
Thermal Conductivity (W/mk)2,2
BOND SHEET 3,2W 80µm Tg 180º Low CTE
TypeALCUP
Dielectric Layer (μm)80
Thermal Conductivity (W/mk)3,2
BOND SHEET 2,2W 80µm
TypeALCUP
Dielectric Layer (μm)80
Thermal Conductivity (W/mk)2,2
BOND SHEET 3,2W 70µm Tg 180º Low CTE
TypeALCUP
Dielectric Layer (μm)70
Thermal Conductivity (W/mk)3,2
BOND SHEET 2,2W 70µm
TypeALCUP
Dielectric Layer (μm)70
Thermal Conductivity (W/mk)2,2
Dielectric capacity
Thermal resistance Rth
Thermal conductivity 
