High conductivity and low thermal resistance enhance thermal transmission.
This film features double-sided adhesive and thermal transmission properties, based on acrylic resin and pressure-sensitive adhesive (PSA). Its dual-core technology ensures excellent adhesion over time, making it ideal for improving wetting between rough surfaces.
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High energy storage density, low volume change during phase transition, and the ability to maintain a constant temperature during thermal energy storage and release.
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It offers high thermal conductivity, low thermal resistance, and excellent heat transfer. It fills gaps and irregularities between components, reducing the risk of overheating and enhancing the overall performance and lifespan of electronic devices.
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