INSULATED METAL SUBSTRATE (IMS)
INSULATED METAL SUBSTRATE (IMS)
An Insulated Metal Substrate (IMS) is a metal-based dielectric composite designed for efficient heat spreading and high electrical insulation. It consists of an aluminium base clad with a polymer-ceramic dielectric layer and ED copper foil, forming a robust platform for thermally demanding electronic assemblies. Aismalibar’s IMS materials use a specially developed polymer-ceramic formulation that delivers high thermal conductivity, enabling low dielectric thermal resistance when applied in thin layers. This formulation also provides high dielectric strength and excellent thermal endurance, ensuring reliable performance in high-power-density designs. Aismalibar IMS substrates integrate heat spreading and electrical insulation directly into standard PCB manufacturing processes, eliminating the need for additional thermal components and simplifying SMD assembly.
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COBRITHERM HTC
Insulated Metal Substrate (IMS) features a copper-clad layer on one side and electro-deposited (ED) copper foil on the other. Using a copper base enhances both mechanical stability and overall thermal performance, as its superior heat-spreading capability reduces thermomechanical stress and lowers the effective thermal resistance of the substrate.
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COBRITHERM HTC COPPER BASE
Insulated Metal Substrate (IMS) features a copper-clad layer on one side and electro-deposited (ED) copper foil on the other. Using a copper base enhances both mechanical stability and overall thermal performance, as its superior heat-spreading capability reduces thermomechanical stress and lowers the effective thermal resistance of the substrate.
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COBRITHERM HTC ULTRATHIN
COBRITHERM HTC ULTRATHIN is an Insulated Metal Substrate (IMS) based on an aluminium base with a high-conductivity dielectric layer and ED copper foil. It is specifically designed for high-power applications such as AC-DC converters, motor drivers, and high-power LEDs above 2 W. The ultrathin 35-micron dielectric greatly improves thermal transfer, reducing the thermal resistance to just 0.014 K/W and enabling excellent operating-temperature performance. By integrating COBRITHERM HTC ULTRATHIN into your designs, you can effectively manage heat and improve the overall performance and reliability of high-power electronic assemblies.
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FLEXTHERM
FLEXTHERM is an Insulated Metal Substrate (IMS) featuring an aluminium base and RA copper foil separated by an ultra-thin, thermally conductive dielectric layer. FLEXTHERM is a high-technology electrically insulated metal substrate designed to manufacture conformable metal PCBs. Its low thermal resistance enables efficient heat transfer from heat-generating components into the FLEXTHERM metal base. The material’s bendable properties allow it to conform to both positive and negative radii, making it ideal for three-dimensional electronic designs.
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FASTHERM
FLEXTHERM is an Insulated Metal Substrate (IMS) featuring an aluminium base and RA copper foil separated by an ultra-thin, thermally conductive dielectric layer. FASTHERM is an Insulated Metal Substrate (IMS) featuring a copper base and RA copper foil separated by an ultra-thin, thermally conductive dielectric layer. It is designed to deliver high-speed heat transfer from heat-generating components to the heat sink, making it ideal for high-power electronics. FASTHERM includes a dielectric layer as thin as 25 microns, significantly reducing dielectric thermal resistance to exceptionally low levels. This substrate is well-suited for applications such as high-power LEDs, power converters, motor drivers, and designs requiring efficient thermal management and high reliability. FASTHERM is also fully compatible with pedestal PCB technology.
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