INSULATED METAL SUBSTRATE (IMS)
INSULATED METAL SUBSTRATE (IMS)
An Insulated Metal Substrate (IMS) is a metal-based dielectric composite designed for efficient heat spreading and high electrical insulation. It consists of an aluminium base clad with a polymer-ceramic dielectric layer and ED copper foil, forming a robust platform for thermally demanding electronic assemblies. Aismalibar’s IMS materials use a specially developed polymer-ceramic formulation that delivers high thermal conductivity, enabling low dielectric thermal resistance when applied in thin layers. This formulation also provides high dielectric strength and excellent thermal endurance, ensuring reliable performance in high-power-density designs. Aismalibar IMS substrates integrate heat spreading and electrical insulation directly into standard PCB manufacturing processes, eliminating the need for additional thermal components and simplifying SMD assembly.
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COBRITHERM HTC
COBRITHERM is a highly thermally conductive, insulated metal substrate (IMS) with a solid aluminium or copper base on one side and a copper foil on the other. It contains an insulating layer of epoxy resin with a high organic content, which ensures the material has excellent thermal conductivity and insulation properties. The purpose of the COBRITHERM substrate is to minimise thermal resistance and enable efficient heat dissipation from the electronic components to the metal core. COBRITHERM is pressed into a substrate under high pressure and at high temperature, resulting in an excellent bond between the individual layers. This far surpasses thermal adhesives, which are commonly used in thermal management.
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COBRITHERM HTC COPPER BASE
Insulated Metal Substrate (IMS) features a copper-clad layer on one side and electro-deposited (ED) copper foil on the other. Using a copper base enhances both mechanical stability and overall thermal performance, as its superior heat-spreading capability reduces thermomechanical stress and lowers the effective thermal resistance of the substrate.
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COBRITHERM HTC ULTRATHIN
COBRITHERM HTC ULTRATHIN is an Insulated Metal Substrate (IMS) based on an aluminium base with a high-conductivity dielectric layer and ED copper foil. It is specifically designed for high-power applications such as AC-DC converters, motor drivers, and high-power LEDs above 2 W. The ultrathin 35-micron dielectric greatly improves thermal transfer, reducing the thermal resistance to just 0.014 K/W and enabling excellent operating-temperature performance. By integrating COBRITHERM HTC ULTRATHIN into your designs, you can effectively manage heat and improve the overall performance and reliability of high-power electronic assemblies.
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FLEXTHERM
FLEXTHERM is an Insulated Metal Substrate (IMS) featuring an aluminium base and RA copper foil separated by an ultra-thin, thermally conductive dielectric layer. FLEXTHERM is a high-technology electrically insulated metal substrate designed to manufacture conformable metal PCBs. Its low thermal resistance enables efficient heat transfer from heat-generating components into the FLEXTHERM metal base. The material’s bendable properties allow it to conform to both positive and negative radii, making it ideal for three-dimensional electronic designs.
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FASTHERM
FASTHERM is a new technology developed by AISMALIBAR to achieve faster heat transfer between the LED thermal block and the heat sink. This improved heat transfer can be achieved using the full range of COBRITHERM HTC products, whether copper- or aluminium-based. AISMALIBAR has developed a special laminate with a bimetallic heat sink, consisting of a thin copper layer on an aluminium base. The aluminium layer has diffusion properties, whilst the copper layer has a very low thermal resistance, which improves heat dissipation in the horizontal plane. The bimetal also facilitates solderability in surface-mount applications.
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