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HIGH DIELECTRIC STRENGTH

Combined, high thermal conductivity and high dielectric strength ensure optimal dielectric insulation and minimal thermal resistance.

  • BOND SHEET CURED GLASS FREE

    BOND SHEET CURED GLASS FREE

    This polymerised, glass-reinforced dielectric bond sheet uses an epoxy-ceramic formulation to provide high thermal conductivity. It is designed to improve heat transfer between bonded surfaces while maintaining mechanical stability and electrical insulation in thermally managed electronic assemblies.

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  • BOND SHEET CURED REINFORCED

    BOND SHEET CURED REINFORCED

    This polymerised, glass-reinforced dielectric bond sheet uses an epoxy-ceramic formulation to provide high thermal conductivity. It is designed to improve heat transfer between bonded surfaces while maintaining mechanical stability and electrical insulation in thermally managed electronic assemblies.

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  • COBRITHERM ALP

    COBRITHERM ALP

    Cobritherm ALP is an aluminium-based dielectric substrate designed for efficient heat spreading and electrical insulation in thermally demanding electronic assemblies. It consists of an aluminium base coated with a ceramic dielectric layer that provides extra-low thermal resistance and dielectric strength up to 10 kV. Unlike materials intended for multilayer PCB stackups, Cobritherm ALP is mainly used as a standalone insulated metal platform for mounting electronic components where superior thermal performance is required.

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  • THERMAL FILM

    THERMAL FILM

    Polyamide with a silicone coating, which offers several advantages, including high dielectric strength and flexibility, as well as excellent resistance to abrasion, chemicals, and UV radiation.  

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  • SILICONE PAD

    SILICONE PAD

    Silicone pads offer excellent thermal conductivity, electrical insulation, and resistance to high temperatures and harsh chemicals.

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  • ACRYLIC PAD

    ACRYLIC PAD

    Acrylic pads offer high thermal conductivity, excellent electrical insulation, and resistance to chemicals, moisture, and UV radiation.

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  • THERMAL GEL

    THERMAL GEL

    Thermal gels are highly efficient at transferring heat between components, providing excellent thermal conductivity and reducing thermal resistance. They can conform to irregular shapes and surfaces.

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  • THERMAL ADHESIVE

    THERMAL ADHESIVE

    Thermal adhesive offers excellent thermal conductivity, high-strength bonding, and resistance to high temperatures and environmental stress.

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