COPPER CLAD LAMINATE (FR4)

COPPER CLAD LAMINATE (FR4)

Copper Clad Laminate (FR4) is an insulating substrate made from fully cured glass-reinforced epoxy resin laminated with copper foil on one or both sides. The FR4 core is produced by pressing and curing layers of fibreglass prepreg into a solid, stable dielectric material. During the lamination process, the cured core is bonded to copper foil under heat, pressure, and vacuum, creating a robust composite structure. The resulting laminate combines the electrical conductivity of copper with the mechanical strength and dielectric properties of the FR4 substrate, making it a fundamental material for manufacturing rigid printed circuit boards.