COBRITHERM HTC

COBRITHERM is a highly thermally conductive, insulated metal substrate (IMS) with a solid aluminium or copper base on one side and a copper foil on the other. It contains an insulating layer of epoxy resin with a high organic content, which ensures the material has excellent thermal conductivity and insulation properties. The purpose of the COBRITHERM substrate is to minimise thermal resistance and enable efficient heat dissipation from the electronic components to the metal core. COBRITHERM is pressed into a substrate under high pressure and at high temperature, resulting in an excellent bond between the individual layers. This far surpasses thermal adhesives, which are commonly used in thermal management.