Bond Sheet Glass Free

Our range of high-temperature Bond Sheets (Thermal Prepreg) is versatile for various applications within the multilayer PCB and MPCB industry, adhering to standard lamination processes. When incorporating Bond Sheet, dielectric layers gain thermal conductivity, effectively dissipating heat from electronic components on the functional copper sides to the heatsink. The Low CTE versions are well-suited for achieving exceptional interconnect reliability across thermal cycles. This is a B-stage thermally conductive dielectric prepreg glass-free. It is based on epoxy ceramic chemistry and intended for adequate bonding between multilayer circuits (PCB) and metal heat spreaders.