IMS - METAL CLAD
Thick aluminum based substrate, cladded in ED copper foil. Designed for an effective thermal dissipation and high electrical insulation. Our proprietary formulated polymer-ceramic ensures high thermal conductivity, dielectric strength and thermal endurance. AISMALIBAR’s Insulated Metal Substrates allow processing by standard PCBs procedures, integrating heat dissipation with no need for extra components and SMD assembly process.
TIM - THERMAL INTERFACE MATERIAL
Aismalibar has developed a family of Thermal Interface Materials (TIMs) for a wide area of electronic application fields, dividing it into two main areas differentiated from each other by the need, or not, to have dielectric capacity.
Multilayer PCBs are often requested in the case of complex boards with denser circuitry. This combination of multiple layers allows better functions and connections. AISMALIBAR offers different substrates that can be combined to offer unique solutions tailored to your electronic designs.
COPPER CLAD LAMINATE
Copper clad laminates are composed of an inner layer of prepreg laminated on both sides with a thin layer of copper foil. The lamination is achieved by pressing together one or more plies of copper and prepreg under intense heat, pressure and vacuum conditions.