IMS - METAL CLAD
Thick aluminum based substrate, cladded in ED copper foil. Designed for an effective thermal dissipation and high electrical insulation. Our proprietary formulated polymer-ceramic ensures high thermal conductivity, dielectric strength and thermal endurance. AISMALIBAR’s Insulated Metal Substrates allow processing by standard PCBs procedures, integrating heat dissipation with no need for extra components and SMD assembly process.
Multilayer PCBs are often requested in the case of complex boards with denser circuitry. This combination of multiple layers allows better functions and connections. AISMALIBAR offers different substrates that can be combined to offer unique solutions tailored to your electronic designs.
HIGH ELECTRICAL ISOLATION
In construction of electronic equipment, there are parts where maintaining a good electrical insulation is crucial for the proper functioning of the equipment, for security reasons and regulations. This, in addition to an excellent thermal dissipation, is achieved by separating the parts with a highly insulating material electrically, but with high thermal transmission. The BOND SHEET CURED family is the most suitable for this purpose, both for its different possibilities of electrical insulation and for the versatility and ease of adaptation to the shape required by customers.
COPPER CLAD LAMINATE
Copper clad laminates are composed of an inner layer of prepreg laminated on both sides with a thin layer of copper foil. The lamination is achieved by pressing together one or more plies of copper and prepreg under intense heat, pressure and vacuum conditions.