Aismalibar Attending to Electronica Nov22

    10 / 12 / 2022

    Last modification: 

    30 / 5 / 2023

ELECTRONICA

November 15-18, 2022
MESSE MÜNCHEN
Hall B1 Booth 543

GET YOUR TICKET

ELECTRONICA

November 15-18, 2022
MESSE MÜNCHEN
Hall B1 Booth 543

GET YOUR TICKET

Aismalibar to attend Electronica, on Novermber 15-18 at Munich, the world's leading event for electronics

Eletronic developments increasingly need to improve thermal dissipation and maintain good dielectric strength. Thermal management becomes more challenging on new PCBs design needs. At Aismalibar we have been developing industry-leading solutions to enhance the overall thermal performance of your electronic circuits.

Some "Tech-Bites" about the latest innovations:

Eduardo Benmayor

General Manager

ELIMINATE OR REDUCE THERMAL VIAS

Uwe Lemke

Business Developer

IMPROVE ISOLATION & THERMAL TRANSMISSION

José María Serrat

Sales Manager

THERMAL SOLUTIONS FOR ELECTRIC VEHICLE

Our experts explaining each innovative materials we have been developing to design high performance PCBs.

Find them at Hall B1 Booth 543.

COOLING ELECTRONICS

Our team will show you solutions to simplify your PCB designs improving circuits performance

GET YOUR TICKET

Thermal dissipation in wide-bandgap power semiconductors (WBG)

We get 12% of temperature reduction using Aismalibar THIN LAM 3,2W (No thermal vias) vs Standar FR4 with Thermal Vias. Not using or reducing thermal vias facilitates PCB fabrication and design. A research collaboration with UPC Universitat Politècnica de Catalunya (TIEG Group).

LABTEST PAPER

Improve dielectric isolation and fast thermal transmission

Aismalibar's new TIMs overcome the problems we find working with Thermal Pastes and Dielectric Thin Films. A clean, fast and efficient solution to solve interface in between MPCB / Power Components and heat sinks, minimizing air gaps to reduce thermal resistance.

TIM RANGE LEAFLET

Thermal Materials for Electric Vehicle Batteries

Our TIM (Thermal Interface Materials) and IMS (Insulated Metal Substrates) ranges improve dielectric isolation and fast thermal transmission in battery assemblies, taking into consideration cost reduction, lifetime performance, safety and reliability.

DISCOVER MORE

Excellent working temperature and thermal performance

With a thickness of only 35 microns, COBRITHERM ULTRATHIN High Tg reduces thermal resistance down to 0.11Kcm2/w (0,017 Kin2/W), offering excelent thermal dissipation conditions for high power LEDs assembly.