BOND SHEET CURED + THERMAL TAPE

Adhesive film with thermal transmission combined with an ultra-thin thermally conductive dielectric layer.

Thermal Tape μm (mils)
50(2,0)

Bond Sheet Cured μm (mils)
70(2,8) 80(3,1)  100(3,9)

Thermal Tape μm (mils)
50(2,0)

Bond Sheet Cured μm (mils)
70(2,8)
80(3,1)
100(3,9)

Total thickness
Dielectric capacity
Thermal resistance Rth
Thermal conductivity
Bond Sheet Cured 70µm + Thermal Tape
120 µm
4,5 KV
0,09 K/W
2,2 W/mK
Technical data sheet
Bond Sheet Cured 100µm + Thermal Tape
150 µm
6,5 KV
0,107 K/W
2,2 W/mK
Technical data sheet
Air Gap Filler + Bond Sheet Cured 70µm + Thermal Tape
170 µm
4,7 KV
0,119 K/W
2,2 W/mK
Technical data sheet
Air Gap Filler + Bond Sheet Cured 100µm + Thermal Tape
200 µm
6,7 KV
0,136 K/W
2,2 W/mK
Technical data sheet
Bond Sheet Cured 80µm High Tg + Thermal Tape
130 µm
4,5 KV
0,08 K/W
3,2 W/mK
Technical data sheet
Air Gap Filler + Bond Sheet Cured 80µm + Thermal Tape
180 µm
4,7 KV
0,099 K/W
3,2 W/mK
Technical data sheet
Dielectric capacity Dielectric capacity Thermal resistance Rth Thermal resistance Rth Thermal conductivity Thermal conductivity
Bond Sheet Cured 70µm + Thermal Tape
Total Thickness
120µm
Dialectric capacity
4,5KV
Thermal resistance Rth
0,09K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Technical data sheet
Bond Sheet Cured 100µm + Thermal Tape
Total Thickness
150µm
Dialectric capacity
6,5KV
Thermal resistance Rth
0,107K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Technical data sheet
Air Gap Filler + Bond Sheet Cured 70µm + Thermal Tape
Total Thickness
170µm
Dialectric capacity
4,7KV
Thermal resistance Rth
0,119K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Technical data sheet
Air Gap Filler + Bond Sheet Cured 100µm + Thermal Tape
Total Thickness
200µm
Dialectric capacity
6,7KV
Thermal resistance Rth
0,136K/W
Thermal conductivity
2,2W/mK
Technical data sheet
Technical data sheet
Bond Sheet Cured 80µm High Tg + Thermal Tape
Total Thickness
130µm
Dialectric capacity
4,5KV
Thermal resistance Rth
0,08K/W
Thermal conductivity
3,2W/mK
Technical data sheet
Technical data sheet
Air Gap Filler + Bond Sheet Cured 80µm + Thermal Tape
Total Thickness
180µm
Dialectric capacity
4,7KV
Thermal resistance Rth
0,99K/W
Thermal conductivity
3,2W/mK
Technical data sheet
Technical data sheet