BOND SHEET CURED + AIR GAP FILLER

Dielectric layer improving thermal performance with Air Gap Filling technology.

BOND SHEET CURED

Ultra-thin dielectric layer, high dielectric strength, high thermal conductivity and low thermal resistance.

Total Thickness (µm)
Dielectric capacity (KV)
Thermal Resistance Rth (K/W)
Thermal Conductivity
Bond Sheet Cured 70µm (ASTM 5476)
70
4
0,041
2,2 W/mk
Technical Data Sheet
Bond Sheet Cured 100µm (ASTM 5476)

100
6
0,058
2,2 W/mk
Technical Data Sheet
Bond Sheet Cured 70µm + Air Gap Filler

120
4,2
0,07
2,2 W/mk
Technical Data Sheet
Bond Sheet Cured 100µm + Air Gap Filler

150
6,2
0,088
2,2 W/mk
Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 70µm + Air Gap Filler

170
4,4
0,099
3,2 W/mK
Technical Data Sheet
Air Gap Filler + Bond Sheet Cured 100µm + Air Gap Filler

200
6,4
0,117
3,2 W/mK
Technical Data Sheet
Bond Sheet Cured 80µm High Tg (ASTM 5476)

80
4
0,031
3,2 W/mK
Technical Data Sheet