BOND SHEET CURED + AIR GAP FILLER
Dielectric layer improving thermal performance with Air Gap Filling technology.
BOND SHEET CURED
Ultra-thin dielectric layer, high dielectric strength, high thermal conductivity and low thermal resistance.
Total Thickness (µm) | Dielectric capacity (KV) | Thermal Resistance Rth (K/W) | Thermal Conductivity | ||
|---|---|---|---|---|---|
Bond Sheet Cured 70µm (ASTM 5476) | 70 | 4 | 0,041 | 2,2 W/mk | Technical Data Sheet |
Bond Sheet Cured 100µm (ASTM 5476) | 100 | 6 | 0,058 | 2,2 W/mk | Technical Data Sheet |
Bond Sheet Cured 70µm + Air Gap Filler | 120 | 4,2 | 0,07 | 2,2 W/mk | Technical Data Sheet |
Bond Sheet Cured 100µm + Air Gap Filler | 150 | 6,2 | 0,088 | 2,2 W/mk | Technical Data Sheet |
Air Gap Filler + Bond Sheet Cured 70µm + Air Gap Filler | 170 | 4,4 | 0,099 | 3,2 W/mK | Technical Data Sheet |
Air Gap Filler + Bond Sheet Cured 100µm + Air Gap Filler | 200 | 6,4 | 0,117 | 3,2 W/mK | Technical Data Sheet |
Bond Sheet Cured 80µm High Tg (ASTM 5476) | 80 | 4 | 0,031 | 3,2 W/mK | Technical Data Sheet |